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TEA1792ATSX

NXP Semiconductors

TEA1792ATSX by NXP Semiconductors

TEA1792ATSX from NXP Semiconductors is a compact, surface-mount IC designed for efficient power management. It operates at a nominal voltage of 20V with a max supply current of 1.2mA and features a dual terminal configuration. Ideal for applications requiring reliable performance in small electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Anansix

USA . 1,170 parts In-Stock

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1,170

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Digiode

USA . 1,072 parts In-Stock

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1,072

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Vyrian

USA . 607 parts In-Stock

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607

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Distributors (Availability)

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One Stop Electronics

USA . 1,437 parts In-Stock

1+ parts

$21.000

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1,437

$21.000

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Advanced Electronics

New Zealand . 550 parts In-Stock

1+ parts

$36.681

100+ parts

$33.380

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$30.078

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550

$36.681

$33.380

$30.078

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Corohmni

South Africa . 3,200 parts In-Stock

1+ parts

$78.262

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3,200

$78.262

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UNI Independent Distributors

Spain . 5,954 parts In-Stock

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5,954

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Corphita

USA . 4,284 parts In-Stock

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Overview

Elevate your designs with the TEA1792ATSX from NXP Semiconductors, a trusted leader in innovative technology. This compact and efficient component streamlines power management for a wide range of applications, ensuring reliable performance while saving space. With its superior quality and low power consumption, the TEA1792ATSX empowers engineers to create robust solutions that enhance product longevity and user satisfaction. Unlock new possibilities today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and reduces the risk of damage, making the product suitable for various environments.

Surface Mount: YES

Being a surface mount device allows for efficient space utilization on circuit boards, making it ideal for compact applications.

Package Shape: RECTANGULAR

The rectangular package shape offers a standardized footprint that can easily integrate into existing designs.

Power Supplies (V): 20

A supply voltage of 20V indicates the product can handle a variety of applications that require moderate power levels.

No. of Terminals: 6

Having 6 terminals makes it versatile for different connections and functionalities while keeping the layout simple.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

The small outline and thin profile design contribute to reduced space requirements on the PCB and allow for high-density designs.

Terminal Position: DUAL

The dual terminal position provides better interconnectivity options, potentially improving performance in multi-functional roles.

Terminal Form: GULL WING

Gull wing terminals ensure secure connections to the PCB while facilitating easy soldering and assembly.

Maximum Supply Current: 1.2 mA

A maximum supply current of 1.2 mA indicates low power consumption, making this device energy-efficient and suitable for battery-operated applications.

Nominal Supply Voltage: 20 V

With a nominal supply voltage of 20V, this device offers consistency in performance across various applications.

Terminal Pitch: 0.95 mm

A terminal pitch of 0.95 mm supports high-density layouts, making it favorable for modern compact electronic designs.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TEA1792ATSX attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G6

No. of Terminals:

6

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Power Supplies (V):

20

Qualification:

Not Qualified

Sub-Category:

Other Microprocessor ICs

Maximum Supply Current:

1.2 mA

Nominal Supply Voltage:

20 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Trade Compliance

TEA1792ATSX Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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