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AUTOMOTIVE Other Function uPs,uCs & Peripheral ICs 110

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
L99MM70XPTR by STMicroelectronics

L99MM70XPTR

STMicroelectronics

L99MM70XPTR by STMicroelectronics is a CMOS MICROPROCESSOR CIRCUIT with 36 terminals in a SMALL OUTLINE package. It operates b/w -40 to 125 °C and supports supply voltages from 6V to 18V, making it ideal for AUTOMOTIVE applications requiring high performance and reliability.

R-PDSO-G36

e3

10.3 mm

3

36

125 Cel

-40 Cel

PLASTIC/EPOXY

HSSOP

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

260

2.45 mm

18 V

6 V

13.5 V

YES

CMOS

AUTOMOTIVE

Tin (Sn)

GULL WING

.5 mm

DUAL

30

7.5 mm

MICROPROCESSOR CIRCUIT

UCD3138A64PFCR by Texas Instruments

UCD3138A64PFCR

Texas Instruments

MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: TFQFP; Package Shape: SQUARE;

YES

I2C; SPI; UART

2 MHz

NO

NO

0

S-PQFP-G80

e4

12 mm

3

43

80

8

125 Cel

-40 Cel

NO

PLASTIC/EPOXY

TFQFP

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

260

65536

1.2 mm

3.6 V

3 V

3.3 V

YES

CMOS

AUTOMOTIVE

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

12 mm

MICROPROCESSOR CIRCUIT

2K

COMPARATOR(7)

UCD3138A64PFC by Texas Instruments

UCD3138A64PFC

Texas Instruments

UCD3138A64PFC by Texas Instruments is a 80-terminal IC with 3-3.6V supply voltage range, operating at -40 to 125°C. It features 2MHz clock frequency, 65536 ROM words, and 43 I/O lines. Ideal for automotive applications due to its thin profile and fine pitch package style.

YES

I2C; SPI; UART

2 MHz

NO

NO

0

S-PQFP-G80

e4

12 mm

3

43

80

8

125 Cel

-40 Cel

NO

PLASTIC/EPOXY

TFQFP

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

260

65536

1.2 mm

3.6 V

3 V

3.3 V

YES

CMOS

AUTOMOTIVE

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

12 mm

MICROPROCESSOR CIRCUIT

2K

COMPARATOR(7)

SI8250-IQ by Silicon Labs

SI8250-IQ

Silicon Labs

SI8250-IQ by Silicon Labs is a 32-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 125 °C and has a supply voltage range of 2.25-2.75 V, making it suitable for automotive applications requiring low profile, surface-mountable ICs.

S-PQFP-G32

7 mm

32

125 Cel

-40 Cel

PLASTIC/EPOXY

LQFP

SQUARE

FLATPACK, LOW PROFILE

NOT SPECIFIED

Not Qualified

1.6 mm

2.75 V

2.25 V

2.5 V

YES

CMOS

AUTOMOTIVE

GULL WING

.8 mm

QUAD

NOT SPECIFIED

7 mm

MICROPROCESSOR CIRCUIT

SI8251-IQ by Silicon Labs

SI8251-IQ

Silicon Labs

SI8251-IQ by Silicon Labs is a 32-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 125 °C, suitable for automotive applications. With a supply voltage range of 2.25V to 2.75V, it comes in a square flatpack package ideal for surface mount assembly.

S-PQFP-G32

7 mm

32

125 Cel

-40 Cel

PLASTIC/EPOXY

LQFP

SQUARE

FLATPACK, LOW PROFILE

NOT SPECIFIED

Not Qualified

1.6 mm

2.75 V

2.25 V

2.5 V

YES

CMOS

AUTOMOTIVE

GULL WING

.8 mm

QUAD

NOT SPECIFIED

7 mm

MICROPROCESSOR CIRCUIT

XA7Z010-1CLG225Q by Xilinx

XA7Z010-1CLG225Q

Xilinx

XA7Z010-1CLG225Q by Xilinx is a MICROPROCESSOR CIRCUIT with 225 terminals in a GRID ARRAY package. Operating b/w -40 to 125 °C, it's AEC-Q100 compliant for AUTOMOTIVE use. Featuring CMOS technology, it has a 0.8 mm terminal pitch and TIN SILVER COPPER finish.

S-PBGA-B225

e1

13 mm

3

225

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA225,15X15,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1,1.8

Not Qualified

AEC-Q100

1.5 mm

Other uPs/uCs/Peripheral ICs

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

N

13 mm

MICROPROCESSOR CIRCUIT

XA7Z010-1CLG400Q by Xilinx

XA7Z010-1CLG400Q

Xilinx

XA7Z010-1CLG400Q by Xilinx is a MICROPROCESSOR CIRCUIT with 400 terminals in a GRID ARRAY package. It operates b/w -40 to 125 °C, suitable for AUTOMOTIVE applications. The CMOS technology, low profile design, and fine pitch make it ideal for compact electronic systems.

S-PBGA-B400

e1

17 mm

3

400

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1,1.8

Not Qualified

AEC-Q100

1.6 mm

Other uPs/uCs/Peripheral ICs

YES

CMOS

AUTOMOTIVE

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

30

N

17 mm

MICROPROCESSOR CIRCUIT

XA7Z020-1CLG400Q by Xilinx

XA7Z020-1CLG400Q

Xilinx

XA7Z020-1CLG400Q by Xilinx is an automotive-grade microprocessor circuit with 400 terminals in a low-profile grid array package. Operating b/w -40 to 125°C, it features power supplies of 1V and 1.8V, making it ideal for automotive applications requiring high-performance computing capabilities.

S-PBGA-B400

e1

17 mm

3

400

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1,1.8

Not Qualified

AEC-Q100

1.6 mm

Other uPs/uCs/Peripheral ICs

YES

CMOS

AUTOMOTIVE

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

30

N

17 mm

MICROPROCESSOR CIRCUIT

XA7Z020-1CLG484Q by Xilinx

XA7Z020-1CLG484Q

Xilinx

XA7Z020-1CLG484Q by Xilinx is a MICROPROCESSOR CIRCUIT with 484 terminals in a GRID ARRAY package. Operating b/w -40 to 125 °C, it's AEC-Q100 compliant for AUTOMOTIVE use. Features include 1.8V power supply, 0.8mm terminal pitch, and TIN SILVER COPPER finish.

S-PBGA-B484

e1

19 mm

3

484

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1,1.8

Not Qualified

AEC-Q100

1.6 mm

Other uPs/uCs/Peripheral ICs

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

N

19 mm

MICROPROCESSOR CIRCUIT

XA7Z030-1FBG484Q by Xilinx

XA7Z030-1FBG484Q

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

S-PBGA-B484

e1

23 mm

4

484

125 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

GRID ARRAY

250

1,1.8

Not Qualified

AEC-Q100

2.54 mm

Other uPs/uCs/Peripheral ICs

YES

CMOS

AUTOMOTIVE

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

N

23 mm

MICROPROCESSOR CIRCUIT

MCP25050-E/P by Microchip Technology

MCP25050-E/P

Microchip Technology

MCP25050-E/P by Microchip Tech: 8-bit microprocessor IC with 5V supply, -40 to 125°C temp range. Automotive grade for CMOS tech applications. Rectangular package, 14 terminals, matte tin finish ideal for automotive electronics.

R-PDIP-T14

e3

19.05 mm

8

14

125 Cel

-40 Cel

PLASTIC/EPOXY

DIP

DIP14,.3

RECTANGULAR

IN-LINE

5

Not Qualified

TS 16949

4.318 mm

Parallel IO Port

5.5 V

4.5 V

5 V

NO

CMOS

AUTOMOTIVE

MATTE TIN

THROUGH-HOLE

2.54 mm

DUAL

7.62 mm

MICROPROCESSOR CIRCUIT

MCP25050-E/SL by Microchip Technology

MCP25050-E/SL

Microchip Technology

MCP25050-E/SL by Microchip: 8-bit microprocessor circuit with 5V supply, operating from -40 to 125 °C. Automotive grade, TS16949 screened IC in small outline package for surface mount applications. Features dual terminal position, CMOS technology, and matte tin finish on gull wing terminals.

R-PDSO-G14

e3

8.65 mm

1

8

14

125 Cel

-40 Cel

PLASTIC/EPOXY

SOP

SOP14,.24

RECTANGULAR

SMALL OUTLINE

5

Not Qualified

TS 16949

1.75 mm

Parallel IO Port

5.5 V

4.5 V

5 V

YES

CMOS

AUTOMOTIVE

Matte Tin (Sn)

GULL WING

1.27 mm

DUAL

3.9 mm

MICROPROCESSOR CIRCUIT

MCP25050T-E/SL by Microchip Technology

MCP25050T-E/SL

Microchip Technology

MCP25050T-E/SL by Microchip: 8-bit peripheral IC with 5V supply, -40 to 125°C operating temp. Ideal for automotive applications, TS16949 certified, small outline package with dual terminals.

R-PDSO-G14

e3

8.65 mm

1

8

14

125 Cel

-40 Cel

PLASTIC/EPOXY

SOP

SOP14,.24

RECTANGULAR

SMALL OUTLINE

5

Not Qualified

TS 16949

1.75 mm

Parallel IO Port

5.5 V

4.5 V

5 V

YES

CMOS

AUTOMOTIVE

Matte Tin (Sn)

GULL WING

1.27 mm

DUAL

3.9 mm

MICROPROCESSOR CIRCUIT

UCD3138128PFCR by Texas Instruments

UCD3138128PFCR

Texas Instruments

UCD3138128PFCR by Texas Instruments is a MICROPROCESSOR CIRCUIT with 80 terminals, operating at -40 to 125 °C. It has ADC channels, 3-3.6 V supply voltage range, and is suitable for automotive applications due to its CMOS technology and thin profile package style.

YES

S-PQFP-G80

e4

12 mm

3

80

125 Cel

-40 Cel

PLASTIC/EPOXY

TFQFP

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

260

1.2 mm

3.6 V

3 V

3.3 V

YES

CMOS

AUTOMOTIVE

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

12 mm

MICROPROCESSOR CIRCUIT

UCD3138128PFC by Texas Instruments

UCD3138128PFC

Texas Instruments

UCD3138128PFC by Texas Instruments is an 80-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 125°C, suitable for automotive applications. With a supply voltage range of 3-3.6V, it features ADC channels and Gull Wing terminals in a compact square package.

YES

S-PQFP-G80

e4

12 mm

3

80

125 Cel

-40 Cel

PLASTIC/EPOXY

TFQFP

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

260

1.2 mm

3.6 V

3 V

3.3 V

YES

CMOS

AUTOMOTIVE

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

12 mm

MICROPROCESSOR CIRCUIT

CC2540TF256RHAT by Texas Instruments

CC2540TF256RHAT

Texas Instruments

CC2540TF256RHAT by Texas Instruments is a MICROPROCESSOR CIRCUIT with 8192 RAM Bytes, SPI, USART, and USB compatibility. Operating b/w -40 to 125 °C, it's ideal for AUTOMOTIVE applications requiring a compact CHIP CARRIER package with 40 terminals and a very thin profile. With a supply voltage range of 2-3.6 V, this CMOS technology device offers high performance in a small form factor.

SPI; USART; USB

S-PQCC-N40

e4

6 mm

3

21

40

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

8192

8

1 mm

3.6 V

2 V

3 V

YES

CMOS

AUTOMOTIVE

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

6 mm

MICROPROCESSOR CIRCUIT

AWR1443FQIGABLQ1 by Texas Instruments

AWR1443FQIGABLQ1

Texas Instruments

AWR1443FQIGABLQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 589824 RAM Bytes. It operates at -40 to 125 °C and has a supply voltage range of 1.14V to 1.32V, making it ideal for AUTOMOTIVE applications. The package style is GRID ARRAY with 161 terminals in a SQUARE shape, suitable for surface mount assembly.

S-PBGA-B161

e1

10.4 mm

3

161

125 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

589824

AEC-Q100

1.17 mm

1.32 V

1.14 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

10.4 mm

MICROPROCESSOR CIRCUIT

AWR1443FQIGABLRQ1 by Texas Instruments

AWR1443FQIGABLRQ1

Texas Instruments

AWR1443FQIGABLRQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 589824 RAM Bytes. It operates at -40 to 125 °C and has a supply voltage range of 1.14V to 1.32V, making it ideal for AUTOMOTIVE applications. The package style is GRID ARRAY with 161 terminals in a SQUARE shape, suitable for surface mount assembly.

S-PBGA-B161

e1

10.4 mm

3

161

125 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

589824

AEC-Q100

1.2 mm

1.32 V

1.14 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

10.4 mm

MICROPROCESSOR CIRCUIT

UCD3138ARGCR by Texas Instruments

UCD3138ARGCR

Texas Instruments

UCD3138ARGCR by Texas Instruments is a 64-terminal microprocessor circuit with a max clock frequency of 2 MHz. It operates in automotive-grade temperatures from -40 to 125 °C and supports I2C and UART bus compatibility. This chip carrier package with a very thin profile is suitable for applications requiring high-performance control in harsh environments.

YES

I2C; UART

2 MHz

0

S-PQCC-N64

e4

9 mm

2

64

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.6 V

3 V

3.3 V

YES

CMOS

AUTOMOTIVE

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

30

9 mm

MICROPROCESSOR CIRCUIT

UCD3138ARGCT by Texas Instruments

UCD3138ARGCT

Texas Instruments

UCD3138ARGCT by Texas Instruments is a 64-terminal microprocessor circuit with CMOS technology. It operates at 3-3.6V, -40 to 125°C, and supports I2C and UART bus compatibility. Ideal for automotive applications due to its compact square package style and low profile design.

YES

I2C; UART

2 MHz

0

S-PQCC-N64

e4

9 mm

2

64

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.6 V

3 V

3.3 V

YES

CMOS

AUTOMOTIVE

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

30

9 mm

MICROPROCESSOR CIRCUIT

UCD3138ARMHR by Texas Instruments

UCD3138ARMHR

Texas Instruments

UCD3138ARMHR by Texas Instruments is a 40-terminal microprocessor circuit with CMOS technology. It operates at a max clock frequency of 2 MHz and supports I2C and UART bus compatibility. Ideal for automotive applications, it has a temperature range from -40 to 125 °C and a supply voltage of 3-3.6 V.

YES

I2C; UART

2 MHz

0

S-PQCC-N40

e4

6 mm

2

40

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.8 mm

3.6 V

3 V

3.3 V

YES

CMOS

AUTOMOTIVE

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

30

6 mm

MICROPROCESSOR CIRCUIT

UCD3138ARMHT by Texas Instruments

UCD3138ARMHT

Texas Instruments

UCD3138ARMHT by Texas Instruments is a MICROPROCESSOR CIRCUIT with 40 terminals, operating at -40 to 125 °C. It has a max clock frequency of 2 MHz and supports I2C and UART bus compatibility. Ideal for automotive applications due to its low profile CHIP CARRIER package style.

YES

I2C; UART

2 MHz

0

S-PQCC-N40

e4

6 mm

2

40

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.8 mm

3.6 V

3 V

3.3 V

YES

CMOS

AUTOMOTIVE

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

30

6 mm

MICROPROCESSOR CIRCUIT

DRA746APGABCQ1 by Texas Instruments

DRA746APGABCQ1

Texas Instruments

DRA746APGABCQ1 by Texas Instruments is an AEC-Q100 compliant microprocessor circuit with 760 terminals in a grid array package. It operates at a speed of 1500 rpm, suitable for automotive applications due to its CMOS technology and tin silver copper terminal finish. The device can withstand peak reflow temperatures up to 250°C for 30 seconds, making it ideal for automotive electronic systems.

X-PBGA-B760

e1

3

760

PLASTIC/EPOXY

BGA

UNSPECIFIED

GRID ARRAY

250

AEC-Q100

1500 rpm

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

MCIMX6DP4AVT8AA by NXP Semiconductors

MCIMX6DP4AVT8AA

NXP Semiconductors

SoC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B624

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.225 V

1.4 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6DP6AVT8AA by NXP Semiconductors

MCIMX6DP6AVT8AA

NXP Semiconductors

SoC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.225 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6G1AVM05AA by NXP Semiconductors

MCIMX6G1AVM05AA

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B289

14 mm

3

289

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.3 V

1.15 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX6G1AVM07AA by NXP Semiconductors

MCIMX6G1AVM07AA

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B289

14 mm

3

289

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.3 V

1.25 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX6G2AVM05AA by NXP Semiconductors

MCIMX6G2AVM05AA

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B289

14 mm

3

289

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.3 V

1.15 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX6G2AVM07AA by NXP Semiconductors

MCIMX6G2AVM07AA

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B289

14 mm

3

289

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.3 V

1.25 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

XA7Z030-1FBV484Q by Xilinx

XA7Z030-1FBV484Q

Xilinx

The Xilinx XA7Z030-1FBV484Q is a CMOS microprocessor circuit with 484 ball terminals. It operates in automotive-grade temperatures (-40 to 125 °C) and is AEC-Q100 screened. This square grid array package is ideal for automotive applications requiring high-performance processing capabilities.

S-PBGA-B484

484

125 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

AEC-Q100

YES

CMOS

AUTOMOTIVE

BALL

BOTTOM

MICROPROCESSOR CIRCUIT

DRA744BJGABCQ1 by Texas Instruments

DRA744BJGABCQ1

Texas Instruments

DRA744BJGABCQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 64-bit External Data Bus Width and 32 MHz Max Clock Frequency. Ideal for AUTOMOTIVE applications, it features a PLASTIC/EPOXY Package Body Material and operates b/w -40 to 125 °C temperature range.

CAN; I2C; PCI; SPI; UART; USB

32 MHz

64

S-PBGA-B760

e1

23 mm

3

760

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.96 mm

1000 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

DRA744BJGABCRQ1 by Texas Instruments

DRA744BJGABCRQ1

Texas Instruments

DRA744BJGABCRQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 64-bit External Data Bus Width, operating at 32 MHz. It is designed for AUTOMOTIVE applications, featuring a max supply voltage of 1.2 V and a temperature range from -40 to 125 °C.

CAN; I2C; PCI; SPI; UART; USB

32 MHz

64

S-PBGA-B760

e1

23 mm

3

760

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.96 mm

1000 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

DRA745BLGABCQ1 by Texas Instruments

DRA745BLGABCQ1

Texas Instruments

DRA745BLGABCQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 64-bit External Data Bus Width, operating at 32 MHz. It is designed for AUTOMOTIVE applications, featuring a max supply voltage of 1.2 V and a temperature range from -40 to 125 °C.

CAN; I2C; SPI; UART; USB

32 MHz

64

S-PBGA-B760

e1

23 mm

3

760

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.96 mm

1176 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

DRA745BLGABCRQ1 by Texas Instruments

DRA745BLGABCRQ1

Texas Instruments

DRA745BLGABCRQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 64-bit External Data Bus Width, operating at up to 32 MHz. It is designed for AUTOMOTIVE applications, featuring a max supply voltage of 1.2 V and a temperature range from -40°C to 125°C.

CAN; I2C; SPI; UART; USB

32 MHz

64

S-PBGA-B760

e1

23 mm

3

760

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.96 mm

1176 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

DRA746BPGABCQ1 by Texas Instruments

DRA746BPGABCQ1

Texas Instruments

The Texas Instruments DRA746BPGABCQ1 is a MICROPROCESSOR CIRCUIT with 64-bit External Data Bus Width, operating at up to 32 MHz clock frequency. Designed for AUTOMOTIVE applications, it features a package style of GRID ARRAY and supports CAN, I2C, SPI, UART, and USB bus compatibility.

CAN; I2C; SPI; UART; USB

32 MHz

64

S-PBGA-B760

e1

23 mm

3

760

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.96 mm

1500 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

DRA746BPGABCRQ1 by Texas Instruments

DRA746BPGABCRQ1

Texas Instruments

The Texas Instruments DRA746BPGABCRQ1 is a MICROPROCESSOR CIRCUIT with 64-bit External Data Bus, operating at up to 32 MHz. Designed for AUTOMOTIVE applications, it features a max supply voltage of 1.2 V and can withstand temperatures from -40 to 125 °C. This IC supports CAN, I2C, SPI, UART, and USB bus compatibility.

CAN; I2C; SPI; UART; USB

32 MHz

64

S-PBGA-B760

e1

23 mm

3

760

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.96 mm

1500 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

DRA750BJGABCRQ1 by Texas Instruments

DRA750BJGABCRQ1

Texas Instruments

DRA750BJGABCRQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 48-bit External Data Bus Width, operating at 32 MHz. Designed for AUTOMOTIVE applications, it features a max supply voltage of 1.2 V and can withstand temperatures from -40 to 125 °C.

CAN; I2C; PCI; SPI; UART; USB

32 MHz

48

S-PBGA-B760

e1

23 mm

3

760

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.96 mm

1000 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

DRA752BPGABCQ1 by Texas Instruments

DRA752BPGABCQ1

Texas Instruments

DRA752BPGABCQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 760 terminals in a GRID ARRAY, FINE PITCH package. It operates b/w -40 to 125 °C and has a supply voltage range of 1.11V to 1.2V, making it ideal for AUTOMOTIVE applications requiring high performance and reliability.

S-PBGA-B760

e1

23 mm

3

760

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.96 mm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

DRA752BPGABCRQ1 by Texas Instruments

DRA752BPGABCRQ1

Texas Instruments

DRA752BPGABCRQ1 by Texas Instruments is an automotive-grade microprocessor circuit with a CMOS technology. It operates b/w -40 to 125 °C and has a supply voltage range of 1.11V to 1.2V. With 760 terminals in a grid array package, it is suitable for automotive applications requiring high performance and reliability.

S-PBGA-B760

e1

23 mm

3

760

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.96 mm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

DRA756BPGABCQ1 by Texas Instruments

DRA756BPGABCQ1

Texas Instruments

The Texas Instruments DRA756BPGABCQ1 is a MICROPROCESSOR CIRCUIT with 64-bit External Data Bus Width, operating at 32 MHz. Designed for AUTOMOTIVE applications, it features a max supply voltage of 1.2 V and can withstand temperatures from -40 to 125 °C.

CAN; I2C; PCI; SPI; UART; USB

32 MHz

64

S-PBGA-B760

e1

23 mm

3

760

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.96 mm

1500 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

UCD3138128APFCR by Texas Instruments

UCD3138128APFCR

Texas Instruments

UCD3138128APFCR by Texas Instruments is an 80-terminal microprocessor circuit with a clock frequency of 2MHz. It operates in automotive-grade temperatures (-40 to 125°C) and supports I2C, SPI, and UART bus compatibility. This thin-profile IC is ideal for applications requiring ADC channels and a supply voltage range of 3-3.6V.

YES

I2C; SPI; UART

2 MHz

0

S-PQFP-G80

e4

12 mm

3

80

125 Cel

-40 Cel

PLASTIC/EPOXY

TFQFP

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

260

1.2 mm

3.6 V

3 V

3.3 V

YES

CMOS

AUTOMOTIVE

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

12 mm

MICROPROCESSOR CIRCUIT

UCD3138128APFC by Texas Instruments

UCD3138128APFC

Texas Instruments

UCD3138128APFC by Texas Instruments is an 80-terminal microprocessor circuit with a clock frequency of 2MHz. It operates in automotive-grade temperatures (-40 to 125°C) and supports I2C, SPI, and UART bus compatibility. The package style is flatpack with a thin profile and fine pitch, making it suitable for various applications requiring high-performance processing in compact spaces.

YES

I2C; SPI; UART

2 MHz

0

S-PQFP-G80

e4

12 mm

3

80

125 Cel

-40 Cel

PLASTIC/EPOXY

TFQFP

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

260

1.2 mm

3.6 V

3 V

3.3 V

YES

CMOS

AUTOMOTIVE

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

12 mm

MICROPROCESSOR CIRCUIT

UCD3138ARJAR by Texas Instruments

UCD3138ARJAR

Texas Instruments

UCD3138ARJAR by Texas Instruments is a 40-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 125°C, suitable for automotive applications. With a supply voltage range of 3-3.6V and ADC channels, it's ideal for various peripheral IC functions in compact designs.

YES

S-PQCC-N40

e4

6 mm

2

40

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.6 V

3 V

3.3 V

YES

CMOS

AUTOMOTIVE

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

NO LEAD

.5 mm

QUAD

30

6 mm

MICROPROCESSOR CIRCUIT

UCD3138ARJAT by Texas Instruments

UCD3138ARJAT

Texas Instruments

UCD3138ARJAT by Texas Instruments is a 40-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 125 °C and has a supply voltage range of 3-3.6 V. Ideal for automotive applications, it features ADC channels, quad terminal position, and nickel/palladium/gold/silver finish.

YES

S-PQCC-N40

e4

6 mm

2

40

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.6 V

3 V

3.3 V

YES

CMOS

AUTOMOTIVE

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

NO LEAD

.5 mm

QUAD

30

6 mm

MICROPROCESSOR CIRCUIT

MPXY8510DK016T1 by NXP Semiconductors

MPXY8510DK016T1

NXP Semiconductors

MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HQCCN; Package Shape: SQUARE;

S-XQCC-N32

9 mm

32

125 Cel

-40 Cel

UNSPECIFIED

HQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

NOT SPECIFIED

2.3 mm

3.6 V

1.8 V

3 V

YES

CMOS

AUTOMOTIVE

NO LEAD

.65 mm

QUAD

NOT SPECIFIED

9 mm

MICROPROCESSOR CIRCUIT

MPXY8600DK6T1 by NXP Semiconductors

MPXY8600DK6T1

NXP Semiconductors

MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HQCCN; Package Shape: SQUARE;

S-XQCC-N32

9 mm

32

125 Cel

-40 Cel

UNSPECIFIED

HQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

NOT SPECIFIED

2.3 mm

3.6 V

1.8 V

3 V

YES

CMOS

AUTOMOTIVE

NO LEAD

.65 mm

QUAD

NOT SPECIFIED

9 mm

MICROPROCESSOR CIRCUIT

XAZU2EG-1SBVA484Q by Xilinx

XAZU2EG-1SBVA484Q

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B484

e1

19 mm

3

484

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

.85 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

XAZU2EG-1SFVA625Q by Xilinx

XAZU2EG-1SFVA625Q

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 625; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B625

e1

21 mm

3

625

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.43 mm

.85 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

MICROPROCESSOR CIRCUIT