Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.
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FEMC008GTTG7-T13-17
Flexxon Global
FEMC008GTTG7-T13-17 by Flexxon Global is an 8GX8 SLC NAND flash memory with 68719476736-bit density. Operating at -40 to 85 °C, it's AEC-Q100 and TS 16949 compliant for industrial use. With a rectangular package and PLASTIC/EPOXY material, it has 100 terminals for surface mount applications.
R-PBGA-B100
68719476736 bit
FLASH CARD
8
1
100
8589934592 words
8G
85 Cel
-40 Cel
8GX8
PLASTIC/EPOXY
RECTANGULAR
AEC-Q100; TS 16949
3.3
YES
CMOS
INDUSTRIAL
BALL
BOTTOM
SLC NAND TYPE
FEMC016GTTE7-T13-27
FEMC016GTTE7-T13-27 by Flexxon Global is a SLC NAND flash memory with 16GX8 organization and 137.4Gb density. It operates at -25 to 85°C, has 100 terminals, and uses CMOS technology. Ideal for automotive applications due to AEC-Q100 screening level and TS16949 certification.
137438953472 bit
17179869184 words
16G
-25 Cel
16GX8
OTHER
FEMC016GTTE7-T14-16
FEMC016GTTE7-T14-16 by Flexxon Global is a 16GX8 MLC NAND flash memory card with 137.4Tb density and 3.3V supply voltage. Ideal for automotive applications due to AEC-Q100 screening, TS 16949 compliance, and operating temperature range of -25°C to 85°C.
R-PBGA-B153
153
MLC NAND TYPE
FEMC002GTTE7-T14-17
FEMC002GTTE7-T14-17 by Flexxon Global is a SLC NAND flash memory with 2GX8 organization, 17179869184 bit memory density, and 3.3V nominal voltage. Ideal for automotive applications due to AEC-Q100 screening level and TS 16949 certification, operating b/w -25°C to 85°C temperature range.
17179869184 bit
2147483648 words
2G
2GX8
FEMC002GTTG7-T24-17
FEMC002GTTG7-T24-17 by Flexxon Global is a SLC NAND flash memory with 2GX8 organization, 17179869184 bit memory density, and operates at industrial temperature grade. It has 153 terminals, package shape is rectangular made of plastic/epoxy material. Ideal for automotive applications due to AEC-Q100 screening level and TS 16949 certification.
FEMC008GTTA7-T13-16
FEMC008GTTA7-T13-16 by Flexxon Global is an 8GX8 MLC NAND flash memory card with 68719476736 bit density. Operating at -40 to 85 °C, it has a supply voltage of 3.3V and meets AEC-Q100 standards. Ideal for industrial applications requiring high-density memory in a compact rectangular package.
FEMC008GTTG7-T13-16
FEMC008GTTG7-T13-16 by Flexxon Global is an 8GX8 MLC NAND flash memory card with 68719476736-bit density. It operates at industrial temperature grade (-40 to 85 °C) and has a supply voltage of 3.3V. Suitable for automotive applications due to AEC-Q100 screening level and TS16949 certification.
FEMC004GTTE7-T13-17
FEMC004GTTE7-T13-17 by Flexxon Global is a SLC NAND flash memory with 4GX8 organization, 3.3V supply voltage, and 100 terminals. It operates b/w -25°C to 85°C, suitable for automotive applications meeting AEC-Q100 standards. With a memory density of 34.36 Gb, it's ideal for high-performance storage solutions in harsh environments.
34359738368 bit
4294967296 words
4G
4GX8
FEMC004GTTE7-T14-16
FEMC004GTTE7-T14-16 by Flexxon Global is a Flash Memory with 4GX8 organization, MLC NAND type, and 3.3V nominal voltage. It is suitable for applications requiring high memory density and operates in a wide temperature range (-25 to 85 °C).
FEMC004GTTG7-T24-16
FEMC004GTTG7-T24-16 by Flexxon Global is a 3.3V MLC NAND flash memory with 4GX8 organization, 34359738368-bit density, and AEC-Q100 screening. Ideal for industrial applications requiring reliable data storage in temperatures ranging from -40 to 85°C. This rectangular package with 153 terminals is designed for surface mount assembly.
FEMC008GTTE7-T13-16
Flexxon Global's FEMC008GTTE7-T13-16 Flash Memory features 8GX8 organization, MLC NAND technology, and 3.3V nominal voltage. Ideal for automotive applications with AEC-Q100 screening level, TS 16949 certification, and operating temperatures ranging from -25 to 85°C.
FEMC016GTTA7-T13-16
FEMC016GTTA7-T13-16 by Flexxon Global is a 16GX8 MLC NAND flash card with 137.4Tb memory density, operating at -40 to 85°C. Suitable for industrial applications, it features AEC-Q100 screening and TS 16949 certification, with a supply voltage of 3.3V and 100 terminals in a rectangular package.
FEMC016GTTE7-T13-16
FEMC016GTTE7-T13-16 by Flexxon Global is a flash memory with 16GX8 organization and MLC NAND type technology. It has a memory density of 137438953472 bits and operates at temperatures ranging from -25 to 85°C. This memory card is suitable for applications requiring high storage capacity and reliable performance.
GD25Q16CEIGR
Gigadevice Semiconductor
GD25Q16CEIGR by Gigadevice Semiconductor is a 2MX8 NOR flash memory with 120 MHz clock frequency. Operating at -40 to 85 °C, it offers 100000 Write/Erase Cycles endurance. Ideal for industrial applications requiring high-speed serial data storage in compact form factors.
120 MHz
20
100000 Write/Erase Cycles
R-XDSO-N8
3 mm
16777216 bit
FLASH
2097152 words
2M
SYNCHRONOUS
2MX8
HVSON
SOLCC8,.11,20
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
SERIAL
.5 mm
SPI
.000005 Amp
20 mA
3.6 V
2.7 V
NO LEAD
DUAL
NOR TYPE
2 mm
HARDWARE/SOFTWARE
GD25Q16CSIG
GD25Q16CSIG by Gigadevice Semiconductor is a 16Mb NOR Flash Memory with 120MHz clock frequency, SPI serial bus type. Operating at -40 to 85°C, it offers 100K write/erase cycles and supports hardware/software write protection. Ideal for industrial applications requiring high-speed data storage in compact designs.
R-PDSO-G8
5.28 mm
SOP
SOP8,.3
SMALL OUTLINE
2.16 mm
GULL WING
1.27 mm
5.23 mm
GD25Q16CTIG
GD25Q16CTIG by Gigadevice Semiconductor is a 16Mb NOR Flash Memory with SPI interface. Operating at 120MHz clock frequency, it offers 100K Write/Erase cycles endurance. Ideal for industrial applications requiring high-speed data transfer and reliable non-volatile memory storage.
4.9 mm
SOP8,.25
1.75 mm
3.9 mm
MTFDDAV480TDS-1AW1ZABYY
Micron Technology
Micron Technology's MTFDDAV480TDS-1AW1ZABYY is a 480GX8 TLC NAND flash memory with 3.3V programming voltage. Operating in asynchronous mode, it has a memory density of 4123168604160 bit and operates b/w 0 to 70 °C. Ideal for microelectronic assemblies, this rectangular package measures 80mm x 22mm x 3.28mm and features a serial interface with no lead terminals.
R-XSMA-N75
80 mm
4123168604160 bit
FLASH MODULE
75
515396075520 words
480G
ASYNCHRONOUS
70 Cel
0 Cel
480GX8
UNSPECIFIED
SMA
MICROELECTRONIC ASSEMBLY
3.28 mm
3.46 V
3.14 V
NO
SINGLE
TLC NAND TYPE
22 mm
2988780
Phoenix Contact
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; Package Shape: RECTANGULAR; No. of Words Code: 256M; Length: 36.4 mm; Width: 3.3 mm;
36.4 mm
2147483648 bit
CONFIGURATION MEMORY
268435456 words
256M
256MX8
42.8 mm
3.465 V
3.135 V
3.3 mm
SFU32048E1AE1TO-I-QT-1A1-STD
Swissbit Ag
SFU32048E1AE1TO-I-QT-1A1-STD by Swissbit Ag is a 2GX8 SLC NAND flash memory with 17179869184 bit density. Operating in industrial temperature range (-40 to 85 °C), it has a rectangular shape, 67.8mm length, and asynchronous mode. Ideal for applications requiring high reliability and fast data storage.
10
R-XXMA-X
67.8 mm
5
8.3 mm
208 mA
5.5 V
4.5 V
18 mm
MTFC16GAPALBH-ITTR
MTFC16GAPALBH-ITTR by Micron Technology is a 16GX8 NAND flash memory with 17179869184 words capacity. Operating at up to 200 MHz, it has a thin profile and fine pitch package style suitable for industrial applications. With a temperature range of -40 to 85 °C, it offers high-speed synchronous operation in a compact form factor.
200 MHz
13 mm
3-STATE
TFBGA
BGA153,14X14,20
GRID ARRAY, THIN PROFILE, FINE PITCH
PARALLEL
260
2.7
1.2 mm
TIN SILVER COPPER
30
NAND TYPE
11.5 mm
MTFC16GAPALBH-IT
MTFC16GAPALBH-IT by Micron Technology is a 16GX8 NAND flash memory with 17179869184 words capacity. Operating at up to 200 MHz, it has a thin profile and fine pitch package style suitable for industrial applications. With a temperature range of -40 to 85 °C, this flash card offers high memory density and synchronous operation.
e1
1.1 mm
IS25WP512M-RHLA3-TR
Integrated Silicon Solution
IS25WP512M-RHLA3-TR by Integrated Silicon Solution is a 64MX8 NOR flash memory with 112 MHz clock frequency. Operating at 1.8V, it offers 100000 write/erase cycles and supports SPI serial bus type. Ideal for automotive applications due to AEC-Q100 screening level and -40 to 125 °C temperature range.
112 MHz
R-PBGA-B24
8 mm
536870912 bit
3
24
67108864 words
64M
125 Cel
64MX8
TBGA
BGA24,5X5,40
GRID ARRAY, THIN PROFILE
1.8
AEC-Q100
.00026 Amp
35 mA
1.95 V
1.7 V
AUTOMOTIVE
1 mm
6 mm
MX25V20066M1I02
Macronix
Macronix MX25V20066M1I02 is a NOR flash memory with 256Kx8 organization, SPI serial bus type, and 80 MHz clock frequency. It is ideal for industrial applications requiring high endurance of 100k write/erase cycles in a small outline package.
ALSO AVAILABLE WITH 2.3VMIN@50MHZ
80 MHz
2097152 bit
262144 words
256K
256KX8
.00002 Amp
15 mA
HARDWARE
MTFC64GAPALGT-AIT
FLASH CARD; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: VFBGA; Package Shape: RECTANGULAR; Package Equivalence Code: BGA153,14X14,20;
549755813888 bit
68719476736 words
64G
64GX8
VFBGA
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
.8 mm
MTFC64GAPALHT-AIT
Micron Technology's MTFC64GAPALHT-AIT is a 64GX8 NAND flash memory with 549755813888 bit density. Operating at up to 200 MHz, it offers -40 to 85 °C temp range and AEC-Q100 screening for industrial applications. With a very thin profile, this package features a grid array style suitable for high-speed data storage systems.
VBGA
BGA100,10X17,40
GRID ARRAY, VERY THIN PROFILE
14 mm
MTFC16GAPALHT-AAT
MTFC16GAPALHT-AAT by Micron Technology is a 16GX8 NAND flash memory with 17179869184 words capacity. Operating at up to 200 MHz, it has a memory density of 137438953472 bit and supports industrial temperature grade applications. With a very thin profile package style, it is suitable for high-performance devices requiring fast data storage and retrieval.
105 Cel
MTFC32GAPALGT-AAT
FLASH CARD; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: VFBGA; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2.7 V;
274877906944 bit
34359738368 words
32G
32GX8
MTFC8GAMALGT-AIT
MTFC8GAMALGT-AIT by Micron Technology is a NAND flash memory with 8GX8 organization, operating at up to 200 MHz. It features a very thin profile, fine pitch package style suitable for industrial applications. With a memory density of 68719476736 bits and AEC-Q100 screening level, it offers reliable performance in automotive electronics.
MTFC8GAMALHT-AIT
Micron Technology's MTFC8GAMALHT-AIT is a NAND flash memory with 8GX8 organization, 200 MHz clock frequency, and 85°C max operating temp. Ideal for industrial applications requiring high-speed data storage in compact devices due to its very thin profile package style and AEC-Q100 screening level.
MTFC128GAPALBH-AIT
Micron Technology's MTFC128GAPALBH-AIT is a 128GX8 NAND flash memory with 1.1mm seated height, operating at up to 200MHz clock frequency. Ideal for industrial applications, it offers a memory density of 1099511627776 bit and operates in an industrial temperature range from -40°C to 85°C.
1099511627776 bit
137438953472 words
128G
128GX8
MTFC8GAMALGT-AAT
Micron Technology's MTFC8GAMALGT-AAT is a NAND flash memory with 8GX8 organization, 200 MHz clock frequency, and 105°C max operating temp. Ideal for industrial applications requiring high-speed data storage in compact devices due to its fine pitch grid array package and low power consumption.
MTFC8GAMALHT-AAT
MTFC8GAMALHT-AAT by Micron Technology is a 8GX8 NAND flash memory with 68719476736 bit density. It operates in synchronous mode at up to 200 MHz clock frequency, suitable for industrial applications requiring high-speed data storage and retrieval. With a temperature range of -40 to 105 °C, it offers reliable performance in harsh environments.
MTFC32GAPALGT-AIT
FLASH CARD; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: VFBGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B153;
MTFC32GAPALHT-AAT
MTFC32GAPALHT-AAT by Micron Technology is a 32GX8 NAND flash memory with 34359738368 words capacity. Operating at up to 200 MHz, it offers industrial-grade performance with -40 to 105 °C temperature range. Ideal for applications requiring high-speed data storage in compact form factors.
MTFC32GAPALHT-AIT
Micron Technology's MTFC32GAPALHT-AIT is a 32GX8 NAND flash memory with 34359738368 words capacity. Operating at up to 200 MHz, it features a very thin profile grid array package suitable for industrial applications. With a temperature range of -40 to 85 °C, this CMOS technology memory supports parallel operation and has a min data retention time of 5 units.
MTFDHBA480TDF-1AW4ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; No. of Words: 515396075520 words; No. of Words Code: 480G; Package Style (Meter): MICROELECTRONIC ASSEMBLY;
R-XXMA-N
XMA
MTFDHBA480TDF-1AW12ABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel; Surface Mount: YES; Package Body Material: UNSPECIFIED;
MTFDHBE3T2TDG-1AW1ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Surface Mount: YES; Organization: 3.2TX8; Technology: CMOS;
28147497671065 bit
3518437208883 words
3.2T
3.2TX8
MTFDHBE3T8TDF-1AW1ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Surface Mount: YES; Technology: CMOS; No. of Words Code: 3.84T;
33776997205278 bit
4222124650659 words
3.84T
3.84TX8
MTFDHBE7T6TDF-1AW4ZABYY
Micron Technology's MTFDHBE7T6TDF-1AW4ZABYY is a RECTANGULAR MICROELECTRONIC ASSEMBLY with 7.68TX8 organization, TLC NAND TYPE, and 67553994410557 bit memory density. It operates in ASYNCHRONOUS mode at temperatures from 0 to 70 °C, suitable for FLASH MODULE applications.
67553994410557 bit
8444249301319 words
7.68T
7.68TX8
MTFDHBE800TDG-1AW1ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Minimum Operating Temperature: 0 Cel; Memory Width: 8; Type: TLC NAND TYPE;
6871947673600 bit
858993459200 words
800G
800GX8
MTFDHBG1T9TDF-1AW4ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Terminal Position: UNSPECIFIED; Organization: 1.92TX8; Surface Mount: YES;
16888498602639 bit
2111062325329 words
1.92T
1.92TX8
MTFDHBE3T2TDG-1AW4ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Memory Density: 28147497671065 bit; Technology: CMOS; Package Body Material: UNSPECIFIED;
MTFDHBE6T4TDG-1AW4ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS; Terminal Position: UNSPECIFIED; Maximum Operating Temperature: 70 Cel;
56294995342131 bit
7036874417766 words
6.4T
6.4TX8
MTFDHBG1T9TDF-1AW1ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; No. of Functions: 1; Terminal Form: NO LEAD; No. of Words: 2111062325329 words;
MTFDHBG3T8TDF-1AW1ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; No. of Words: 4222124650659 words; Package Style (Meter): MICROELECTRONIC ASSEMBLY; Terminal Position: UNSPECIFIED;
MTFDHBA400TDG-1AW1ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED; Package Style (Meter): MICROELECTRONIC ASSEMBLY; Terminal Position: UNSPECIFIED;
3435973836800 bit
429496729600 words
400G
400GX8
MTFDHBA480TDF-1AW1ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Package Style (Meter): MICROELECTRONIC ASSEMBLY; Type: TLC NAND TYPE; No. of Words Code: 480G;
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