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Flash Memory

Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.

Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.

There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.

Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.

Flash Memory

Available Parts 1,676

Part# Info Specs
Part RoHS Manufacturer Description Maximum Access Time Additional Features Alternate Memory Width Boot Block Maximum Clock Frequency (fCLK) Command User Interface Common Flash Interface Data Polling Minimum Data Retention Time Endurance Input/Output Type JESD-30 Code JESD-609 Code Length Memory Density Memory IC Type Memory Width Moisture Sensitivity Level (MSL) No. of Functions No. of Ports No. of Sectors/Size No. of Terminals No. of Words No. of Words Code Operating Mode Maximum Operating Temperature Minimum Operating Temperature Organization Output Characteristics Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Page Size (words) Parallel or Serial Peak Reflow Temperature (C) Power Supplies (V) Programming Voltage (V) Qualification Ready or Busy Screening Level Maximum Seated Height Sector Size (Words) Serial Bus Type Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage (Vsup) Minimum Supply Voltage (Vsup) Nominal Supply Voltage / Vsup (V) Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Toggle Bit Type Width Maximum Write Cycle Time (tWC) Write Protection
S25HL01GTDPBHA033 by Infineon Technologies

S25HL01GTDPBHA033

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Maximum Supply Voltage (Vsup): 3.6 V; Terminal Pitch: 1 mm;

133 MHz

25

2560000 Write/Erase Cycles

S-PBGA-B24

8 mm

1073741824 bit

FLASH

8

3

1

24

134217728 words

128M

SYNCHRONOUS

85 Cel

-40 Cel

128MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

3

AEC-Q100

1 mm

SPI

.00056 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HL01GTDPBHB030 by Infineon Technologies

S25HL01GTDPBHB030

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Surface Mount: YES; Endurance: 2560000 Write/Erase Cycles;

133 MHz

25

2560000 Write/Erase Cycles

S-PBGA-B24

8 mm

1073741824 bit

FLASH

8

3

1

24

134217728 words

128M

SYNCHRONOUS

105 Cel

-40 Cel

128MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

3

AEC-Q100

1 mm

SPI

.00056 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HL01GTDPBHB033 by Infineon Technologies

S25HL01GTDPBHB033

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Memory Density: 1073741824 bit; Parallel or Serial: SERIAL;

133 MHz

25

2560000 Write/Erase Cycles

S-PBGA-B24

8 mm

1073741824 bit

FLASH

8

1

24

134217728 words

128M

SYNCHRONOUS

105 Cel

-40 Cel

128MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

3

AEC-Q100

1 mm

SPI

.00056 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HL01GTDPBHI033 by Infineon Technologies

S25HL01GTDPBHI033

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY; Organization: 128MX8;

133 MHz

25

2560000 Write/Erase Cycles

S-PBGA-B24

8 mm

1073741824 bit

FLASH

8

3

1

24

134217728 words

128M

SYNCHRONOUS

85 Cel

-40 Cel

128MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

3

1 mm

SPI

.00056 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HL01GTDPBHM033 by Infineon Technologies

S25HL01GTDPBHM033

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3; Minimum Data Retention Time: 25;

133 MHz

25

2560000 Write/Erase Cycles

S-PBGA-B24

8 mm

1073741824 bit

FLASH

8

3

1

24

134217728 words

128M

SYNCHRONOUS

125 Cel

-40 Cel

128MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

3

AEC-Q100

1 mm

SPI

.00056 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HL01GTDPBHV030 by Infineon Technologies

S25HL01GTDPBHV030

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B24; Programming Voltage (V): 3;

133 MHz

25

2560000 Write/Erase Cycles

S-PBGA-B24

8 mm

1073741824 bit

FLASH

8

3

1

24

134217728 words

128M

SYNCHRONOUS

105 Cel

-40 Cel

128MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

3

1 mm

SPI

.00056 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HL01GTDPMHM010 by Infineon Technologies

S25HL01GTDPMHM010

Infineon Technologies

FLASH; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; No. of Words: 134217728 words; Maximum Operating Temperature: 125 Cel;

133 MHz

25

2560000 Write/Erase Cycles

R-PDSO-G16

10.3 mm

1073741824 bit

FLASH

8

3

1

16

134217728 words

128M

SYNCHRONOUS

125 Cel

-40 Cel

128MX8

PLASTIC/EPOXY

SOP

SOP16,.4

RECTANGULAR

SMALL OUTLINE

SERIAL

3

AEC-Q100

2.65 mm

SPI

.00056 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

GULL WING

1.27 mm

DUAL

NOR TYPE

7.5 mm

HARDWARE

S25HL01GTDPMHV010 by Infineon Technologies

S25HL01GTDPMHV010

Infineon Technologies

FLASH; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Serial Bus Type: SPI; Terminal Form: GULL WING;

133 MHz

25

2560000 Write/Erase Cycles

R-PDSO-G16

10.3 mm

1073741824 bit

FLASH

8

3

1

16

134217728 words

128M

SYNCHRONOUS

105 Cel

-40 Cel

128MX8

PLASTIC/EPOXY

SOP

SOP16,.4

RECTANGULAR

SMALL OUTLINE

SERIAL

3

2.65 mm

SPI

.00056 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

GULL WING

1.27 mm

DUAL

NOR TYPE

7.5 mm

HARDWARE

S25HL01GTDPMHV013 by Infineon Technologies

S25HL01GTDPMHV013

Infineon Technologies

FLASH; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Length: 10.3 mm; Maximum Clock Frequency (fCLK): 133 MHz;

133 MHz

25

2560000 Write/Erase Cycles

R-PDSO-G16

10.3 mm

1073741824 bit

FLASH

8

3

1

16

134217728 words

128M

SYNCHRONOUS

105 Cel

-40 Cel

128MX8

PLASTIC/EPOXY

SOP

SOP16,.4

RECTANGULAR

SMALL OUTLINE

SERIAL

3

2.65 mm

SPI

.00056 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

GULL WING

1.27 mm

DUAL

NOR TYPE

7.5 mm

HARDWARE

S25HL01GTFABHA033 by Infineon Technologies

S25HL01GTFABHA033

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Programming Voltage (V): 3; Surface Mount: YES;

166 MHz

25

2560000 Write/Erase Cycles

S-PBGA-B24

8 mm

1073741824 bit

FLASH

8

3

1

24

134217728 words

128M

SYNCHRONOUS

85 Cel

-40 Cel

128MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

3

AEC-Q100

1 mm

SPI

.00056 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HL01GTFABHB033 by Infineon Technologies

S25HL01GTFABHB033

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Terminal Form: BALL; Type: NOR TYPE;

166 MHz

25

2560000 Write/Erase Cycles

S-PBGA-B24

8 mm

1073741824 bit

FLASH

8

3

1

24

134217728 words

128M

SYNCHRONOUS

105 Cel

-40 Cel

128MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

3

AEC-Q100

1 mm

SPI

.00056 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HL01GTFAMHB013 by Infineon Technologies

S25HL01GTFAMHB013

Infineon Technologies

FLASH; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL; Terminal Form: GULL WING;

166 MHz

25

2560000 Write/Erase Cycles

R-PDSO-G16

10.3 mm

1073741824 bit

FLASH

8

3

1

16

134217728 words

128M

SYNCHRONOUS

105 Cel

-40 Cel

128MX8

PLASTIC/EPOXY

SOP

SOP16,.4

RECTANGULAR

SMALL OUTLINE

SERIAL

3

AEC-Q100

2.65 mm

SPI

.00056 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

GULL WING

1.27 mm

DUAL

NOR TYPE

7.5 mm

HARDWARE

S25HL01GTFAMHM013 by Infineon Technologies

S25HL01GTFAMHM013

Infineon Technologies

FLASH; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 125 Cel; Length: 10.3 mm;

166 MHz

25

2560000 Write/Erase Cycles

R-PDSO-G16

10.3 mm

1073741824 bit

FLASH

8

3

1

16

134217728 words

128M

SYNCHRONOUS

125 Cel

-40 Cel

128MX8

PLASTIC/EPOXY

SOP

SOP16,.4

RECTANGULAR

SMALL OUTLINE

SERIAL

3

AEC-Q100

2.65 mm

SPI

.00056 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

GULL WING

1.27 mm

DUAL

NOR TYPE

7.5 mm

HARDWARE

S25HL01GTDPBHM030 by Infineon Technologies

S25HL01GTDPBHM030

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Screening Level: AEC-Q100; JESD-30 Code: S-PBGA-B24;

133 MHz

25

2560000 Write/Erase Cycles

S-PBGA-B24

8 mm

1073741824 bit

FLASH

8

3

1

24

134217728 words

128M

SYNCHRONOUS

125 Cel

-40 Cel

128MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

3

AEC-Q100

1 mm

SPI

.00056 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HL01GTFAMHA013 by Infineon Technologies

S25HL01GTFAMHA013

Infineon Technologies

FLASH; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Organization: 128MX8; Surface Mount: YES;

166 MHz

25

2560000 Write/Erase Cycles

R-PDSO-G16

10.3 mm

1073741824 bit

FLASH

8

3

1

16

134217728 words

128M

SYNCHRONOUS

85 Cel

-40 Cel

128MX8

PLASTIC/EPOXY

SOP

SOP16,.4

RECTANGULAR

SMALL OUTLINE

SERIAL

3

AEC-Q100

2.65 mm

SPI

.00056 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

GULL WING

1.27 mm

DUAL

NOR TYPE

7.5 mm

HARDWARE

S25HL01GTFAMHB010 by Infineon Technologies

S25HL01GTFAMHB010

Infineon Technologies

FLASH; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS; Minimum Operating Temperature: -40 Cel;

166 MHz

25

2560000 Write/Erase Cycles

R-PDSO-G16

10.3 mm

1073741824 bit

FLASH

8

3

1

16

134217728 words

128M

SYNCHRONOUS

105 Cel

-40 Cel

128MX8

PLASTIC/EPOXY

SOP

SOP16,.4

RECTANGULAR

SMALL OUTLINE

SERIAL

3

AEC-Q100

2.65 mm

SPI

.00056 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

GULL WING

1.27 mm

DUAL

NOR TYPE

7.5 mm

HARDWARE

S25HL01GTFAMHM010 by Infineon Technologies

S25HL01GTFAMHM010

Infineon Technologies

FLASH; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; Operating Mode: SYNCHRONOUS;

166 MHz

25

2560000 Write/Erase Cycles

R-PDSO-G16

10.3 mm

1073741824 bit

FLASH

8

3

1

16

134217728 words

128M

SYNCHRONOUS

125 Cel

-40 Cel

128MX8

PLASTIC/EPOXY

SOP

SOP16,.4

RECTANGULAR

SMALL OUTLINE

SERIAL

3

AEC-Q100

2.65 mm

SPI

.00056 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

GULL WING

1.27 mm

DUAL

NOR TYPE

7.5 mm

HARDWARE

S25HL512TDPBHM010 by Infineon Technologies

S25HL512TDPBHM010

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Write Protection: HARDWARE; Parallel or Serial: SERIAL;

133 MHz

25

1280000 Write/Erase Cycles

S-PBGA-B24

8 mm

536870912 bit

FLASH

8

3

1

24

67108864 words

64M

SYNCHRONOUS

125 Cel

-40 Cel

64MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

3

AEC-Q100

1 mm

SPI

.00034 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HL512TDPBHM013 by Infineon Technologies

S25HL512TDPBHM013

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Screening Level: AEC-Q100; Moisture Sensitivity Level (MSL): 3;

133 MHz

25

1280000 Write/Erase Cycles

S-PBGA-B24

8 mm

536870912 bit

FLASH

8

3

1

24

67108864 words

64M

SYNCHRONOUS

125 Cel

-40 Cel

64MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

3

AEC-Q100

1 mm

SPI

.00034 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HS512TFABHI013 by Infineon Technologies

S25HS512TFABHI013

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Serial Bus Type: SPI; Terminal Pitch: 1 mm;

166 MHz

25

1280000 Write/Erase Cycles

S-PBGA-B24

8 mm

536870912 bit

FLASH

8

3

1

24

67108864 words

64M

SYNCHRONOUS

85 Cel

-40 Cel

64MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

1.8

1 mm

SPI

.00034 Amp

69 mA

2 V

1.7 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HS512TFABHM010 by Infineon Technologies

S25HS512TFABHM010

Infineon Technologies

Infineon's S25HS512TFABHM010 is a 64MX8 NOR flash memory with 166 MHz clock frequency, suitable for automotive applications due to AEC-Q100 screening. Operating at 1.8V, it offers 1280000 write/erase cycles and features SPI serial bus interface.

166 MHz

25

1280000 Write/Erase Cycles

S-PBGA-B24

8 mm

536870912 bit

FLASH

8

3

1

24

67108864 words

64M

SYNCHRONOUS

125 Cel

-40 Cel

64MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

1.8

AEC-Q100

1 mm

SPI

.00034 Amp

69 mA

2 V

1.7 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HS512TFABHM013 by Infineon Technologies

S25HS512TFABHM013

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Write Protection: HARDWARE; Width: 8 mm;

166 MHz

25

1280000 Write/Erase Cycles

S-PBGA-B24

8 mm

536870912 bit

FLASH

8

3

1

24

67108864 words

64M

SYNCHRONOUS

125 Cel

-40 Cel

64MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

1.8

AEC-Q100

1 mm

SPI

.00034 Amp

69 mA

2 V

1.7 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HS512TFABHB013 by Infineon Technologies

S25HS512TFABHB013

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Screening Level: AEC-Q100; Surface Mount: YES;

166 MHz

25

1280000 Write/Erase Cycles

S-PBGA-B24

8 mm

536870912 bit

FLASH

8

3

1

24

67108864 words

64M

SYNCHRONOUS

105 Cel

-40 Cel

64MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

1.8

AEC-Q100

1 mm

SPI

.00034 Amp

69 mA

2 V

1.7 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HL512TDPBHV013 by Infineon Technologies

S25HL512TDPBHV013

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Minimum Data Retention Time: 25; Maximum Standby Current: .00034 Amp;

133 MHz

25

1280000 Write/Erase Cycles

S-PBGA-B24

8 mm

536870912 bit

FLASH

8

3

1

24

67108864 words

64M

SYNCHRONOUS

105 Cel

-40 Cel

64MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

3

1 mm

SPI

.00034 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HL512TDPMHM013 by Infineon Technologies

S25HL512TDPMHM013

Infineon Technologies

FLASH; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2.7 V; Package Style (Meter): SMALL OUTLINE;

133 MHz

25

1280000 Write/Erase Cycles

R-PDSO-G16

10.3 mm

536870912 bit

FLASH

8

3

1

16

67108864 words

64M

SYNCHRONOUS

125 Cel

-40 Cel

64MX8

PLASTIC/EPOXY

SOP

SOP16,.4

RECTANGULAR

SMALL OUTLINE

SERIAL

3

AEC-Q100

2.65 mm

SPI

.00034 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

GULL WING

1.27 mm

DUAL

NOR TYPE

7.5 mm

HARDWARE

S25HL512TDPBHI010 by Infineon Technologies

S25HL512TDPBHI010

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Nominal Supply Voltage / Vsup (V): 3; Package Body Material: PLASTIC/EPOXY;

133 MHz

25

1280000 Write/Erase Cycles

S-PBGA-B24

8 mm

536870912 bit

FLASH

8

3

1

24

67108864 words

64M

SYNCHRONOUS

85 Cel

-40 Cel

64MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

3

1 mm

SPI

.00034 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HL512TDPMHB010 by Infineon Technologies

S25HL512TDPMHB010

Infineon Technologies

FLASH; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; Terminal Form: GULL WING;

133 MHz

25

1280000 Write/Erase Cycles

R-PDSO-G16

10.3 mm

536870912 bit

FLASH

8

3

1

16

67108864 words

64M

SYNCHRONOUS

105 Cel

-40 Cel

64MX8

PLASTIC/EPOXY

SOP

SOP16,.4

RECTANGULAR

SMALL OUTLINE

SERIAL

3

AEC-Q100

2.65 mm

SPI

.00034 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

GULL WING

1.27 mm

DUAL

NOR TYPE

7.5 mm

HARDWARE

S25HL512TDPMHB013 by Infineon Technologies

S25HL512TDPMHB013

Infineon Technologies

FLASH; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G16; Package Equivalence Code: SOP16,.4;

133 MHz

25

1280000 Write/Erase Cycles

R-PDSO-G16

10.3 mm

536870912 bit

FLASH

8

3

1

16

67108864 words

64M

SYNCHRONOUS

105 Cel

-40 Cel

64MX8

PLASTIC/EPOXY

SOP

SOP16,.4

RECTANGULAR

SMALL OUTLINE

SERIAL

3

AEC-Q100

2.65 mm

SPI

.00034 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

GULL WING

1.27 mm

DUAL

NOR TYPE

7.5 mm

HARDWARE

S25HL512TDPMHM010 by Infineon Technologies

S25HL512TDPMHM010

Infineon Technologies

FLASH; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G16; Package Equivalence Code: SOP16,.4;

133 MHz

25

1280000 Write/Erase Cycles

R-PDSO-G16

10.3 mm

536870912 bit

FLASH

8

3

1

16

67108864 words

64M

SYNCHRONOUS

125 Cel

-40 Cel

64MX8

PLASTIC/EPOXY

SOP

SOP16,.4

RECTANGULAR

SMALL OUTLINE

SERIAL

3

AEC-Q100

2.65 mm

SPI

.00034 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

GULL WING

1.27 mm

DUAL

NOR TYPE

7.5 mm

HARDWARE

S25HL512TDPNHM010 by Infineon Technologies

S25HL512TDPNHM010

Infineon Technologies

FLASH; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Maximum Seated Height: .8 mm; Width: 6 mm;

133 MHz

25

1280000 Write/Erase Cycles

R-XDSO-N8

8 mm

536870912 bit

FLASH

8

3

1

8

67108864 words

64M

SYNCHRONOUS

125 Cel

-40 Cel

64MX8

HVSON

SOLCC8,.3

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SERIAL

3

AEC-Q100

.8 mm

SPI

.00034 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

NO LEAD

1.27 mm

DUAL

NOR TYPE

6 mm

HARDWARE

S25HL512TDPNHV010 by Infineon Technologies

S25HL512TDPNHV010

Infineon Technologies

FLASH; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Surface Mount: YES; Width: 6 mm;

133 MHz

25

1280000 Write/Erase Cycles

R-XDSO-N8

8 mm

536870912 bit

FLASH

8

3

1

8

67108864 words

64M

SYNCHRONOUS

105 Cel

-40 Cel

64MX8

HVSON

SOLCC8,.3

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SERIAL

3

.8 mm

SPI

.00034 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

NO LEAD

1.27 mm

DUAL

NOR TYPE

6 mm

HARDWARE

S25HL512TFABHB013 by Infineon Technologies

S25HL512TFABHB013

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Maximum Seated Height: 1 mm; Minimum Data Retention Time: 25;

166 MHz

25

1280000 Write/Erase Cycles

S-PBGA-B24

8 mm

536870912 bit

FLASH

8

3

1

24

67108864 words

64M

SYNCHRONOUS

105 Cel

-40 Cel

64MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

3

AEC-Q100

1 mm

SPI

.00034 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HL512TFABHM013 by Infineon Technologies

S25HL512TFABHM013

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Operating Mode: SYNCHRONOUS; Minimum Data Retention Time: 25;

166 MHz

25

1280000 Write/Erase Cycles

S-PBGA-B24

8 mm

536870912 bit

FLASH

8

3

1

24

67108864 words

64M

SYNCHRONOUS

125 Cel

-40 Cel

64MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

3

AEC-Q100

1 mm

SPI

.00034 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HL512TFANHM010 by Infineon Technologies

S25HL512TFANHM010

Infineon Technologies

FLASH; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3; Operating Mode: SYNCHRONOUS;

166 MHz

25

1280000 Write/Erase Cycles

R-XDSO-N8

8 mm

536870912 bit

FLASH

8

3

1

8

67108864 words

64M

SYNCHRONOUS

125 Cel

-40 Cel

64MX8

HVSON

SOLCC8,.3

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SERIAL

3

AEC-Q100

.8 mm

SPI

.00034 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

NO LEAD

1.27 mm

DUAL

NOR TYPE

6 mm

HARDWARE

S25HL512TFANHV013 by Infineon Technologies

S25HL512TFANHV013

Infineon Technologies

FLASH; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Programming Voltage (V): 3; No. of Words: 67108864 words;

166 MHz

25

1280000 Write/Erase Cycles

R-XDSO-N8

8 mm

536870912 bit

FLASH

8

3

1

8

67108864 words

64M

SYNCHRONOUS

105 Cel

-40 Cel

64MX8

HVSON

SOLCC8,.3

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SERIAL

3

.8 mm

SPI

.00034 Amp

69 mA

3.6 V

2.7 V

3

YES

CMOS

NO LEAD

1.27 mm

DUAL

NOR TYPE

6 mm

HARDWARE

S25HS01GTDPBHB030 by Infineon Technologies

S25HS01GTDPBHB030

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Terminal Form: BALL; Package Style (Meter): GRID ARRAY, VERY THIN PROFILE;

133 MHz

25

2560000 Write/Erase Cycles

S-PBGA-B24

8 mm

1073741824 bit

FLASH

8

3

1

24

134217728 words

128M

SYNCHRONOUS

105 Cel

-40 Cel

128MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

1.8

AEC-Q100

1 mm

SPI

.00051 Amp

72 mA

2 V

1.7 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HS01GTDPBHV033 by Infineon Technologies

S25HS01GTDPBHV033

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Write Protection: HARDWARE; Maximum Seated Height: 1 mm;

133 MHz

25

2560000 Write/Erase Cycles

S-PBGA-B24

8 mm

1073741824 bit

FLASH

8

3

1

24

134217728 words

128M

SYNCHRONOUS

105 Cel

-40 Cel

128MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

1.8

1 mm

SPI

.00051 Amp

72 mA

2 V

1.7 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HS01GTFABHA033 by Infineon Technologies

S25HS01GTFABHA033

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Maximum Clock Frequency (fCLK): 166 MHz; Maximum Seated Height: 1 mm;

166 MHz

25

2560000 Write/Erase Cycles

S-PBGA-B24

8 mm

1073741824 bit

FLASH

8

3

1

24

134217728 words

128M

SYNCHRONOUS

85 Cel

-40 Cel

128MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

1.8

AEC-Q100

1 mm

SPI

.00051 Amp

72 mA

2 V

1.7 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HS01GTFABHB030 by Infineon Technologies

S25HS01GTFABHB030

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Maximum Seated Height: 1 mm; No. of Words Code: 128M;

166 MHz

25

2560000 Write/Erase Cycles

S-PBGA-B24

8 mm

1073741824 bit

FLASH

8

3

1

24

134217728 words

128M

SYNCHRONOUS

105 Cel

-40 Cel

128MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

1.8

AEC-Q100

1 mm

SPI

.00051 Amp

72 mA

2 V

1.7 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HS512TDPBHB010 by Infineon Technologies

S25HS512TDPBHB010

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B24; Package Body Material: PLASTIC/EPOXY;

133 MHz

25

1280000 Write/Erase Cycles

S-PBGA-B24

8 mm

536870912 bit

FLASH

8

3

1

24

67108864 words

64M

SYNCHRONOUS

105 Cel

-40 Cel

64MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

1.8

AEC-Q100

1 mm

SPI

.00034 Amp

69 mA

2 V

1.7 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HS512TDPBHM010 by Infineon Technologies

S25HS512TDPBHM010

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Technology: CMOS; Minimum Supply Voltage (Vsup): 1.7 V;

133 MHz

25

1280000 Write/Erase Cycles

S-PBGA-B24

8 mm

536870912 bit

FLASH

8

3

1

24

67108864 words

64M

SYNCHRONOUS

125 Cel

-40 Cel

64MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

1.8

AEC-Q100

1 mm

SPI

.00034 Amp

69 mA

2 V

1.7 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HS512TDPBHV010 by Infineon Technologies

S25HS512TDPBHV010

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: VBGA; Package Shape: SQUARE; Parallel or Serial: SERIAL; Maximum Clock Frequency (fCLK): 133 MHz;

133 MHz

25

1280000 Write/Erase Cycles

S-PBGA-B24

8 mm

536870912 bit

FLASH

8

3

1

24

67108864 words

64M

SYNCHRONOUS

105 Cel

-40 Cel

64MX8

PLASTIC/EPOXY

VBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, VERY THIN PROFILE

SERIAL

1.8

1 mm

SPI

.00034 Amp

69 mA

2 V

1.7 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HS02GTDZBHB050 by Infineon Technologies

S25HS02GTDZBHB050

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: SQUARE; Terminal Position: BOTTOM; Maximum Clock Frequency (fCLK): 166 MHz;

166 MHz

25

300000 Write/Erase Cycles

S-PBGA-B24

8 mm

2147483648 bit

FLASH

8

3

1

24

268435456 words

256M

SYNCHRONOUS

105 Cel

-40 Cel

256MX8

3-STATE

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, THIN PROFILE

SERIAL

1.8

AEC-Q100

1.2 mm

SPI

.00045 Amp

110 mA

2 V

1.7 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HS02GTDZBHM053 by Infineon Technologies

S25HS02GTDZBHM053

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: SQUARE; Length: 8 mm; Maximum Operating Temperature: 125 Cel;

166 MHz

25

300000 Write/Erase Cycles

S-PBGA-B24

8 mm

2147483648 bit

FLASH

8

3

1

24

268435456 words

256M

SYNCHRONOUS

125 Cel

-40 Cel

256MX8

3-STATE

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, THIN PROFILE

SERIAL

1.8

AEC-Q100

1.2 mm

SPI

.001 Amp

110 mA

2 V

1.7 V

1.8

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HL02GTFABHV150 by Infineon Technologies

S25HL02GTFABHV150

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: SQUARE; Nominal Supply Voltage / Vsup (V): 3; Programming Voltage (V): 3;

166 MHz

25

2560000 Write/Erase Cycles

S-PBGA-B24

8 mm

2147483648 bit

FLASH

8

1

24

268435456 words

256M

SYNCHRONOUS

105 Cel

-40 Cel

256MX8

3-STATE

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, THIN PROFILE

SERIAL

3

1.2 mm

SPI

.000045 Amp

130 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HL02GTFABHV153 by Infineon Technologies

S25HL02GTFABHV153

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: SQUARE; Maximum Operating Temperature: 105 Cel; Type: NOR TYPE;

166 MHz

25

2560000 Write/Erase Cycles

S-PBGA-B24

8 mm

2147483648 bit

FLASH

8

1

24

268435456 words

256M

SYNCHRONOUS

105 Cel

-40 Cel

256MX8

3-STATE

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, THIN PROFILE

SERIAL

3

1.2 mm

SPI

.000045 Amp

130 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HL02GTDPBHV153 by Infineon Technologies

S25HL02GTDPBHV153

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, THIN PROFILE; JESD-30 Code: S-PBGA-B24;

133 MHz

25

2560000 Write/Erase Cycles

S-PBGA-B24

8 mm

2147483648 bit

FLASH

8

1

24

268435456 words

256M

SYNCHRONOUS

105 Cel

-40 Cel

256MX8

3-STATE

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, THIN PROFILE

SERIAL

3

1.2 mm

SPI

.000045 Amp

110 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE

S25HL02GTDZBHB050 by Infineon Technologies

S25HL02GTDZBHB050

Infineon Technologies

FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: SQUARE; Minimum Supply Voltage (Vsup): 2.7 V; Package Equivalence Code: BGA24,5X5,40;

166 MHz

25

300000 Write/Erase Cycles

S-PBGA-B24

8 mm

2147483648 bit

FLASH

8

3

1

24

268435456 words

256M

SYNCHRONOUS

105 Cel

-40 Cel

256MX8

3-STATE

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

SQUARE

GRID ARRAY, THIN PROFILE

SERIAL

3

AEC-Q100

1.2 mm

SPI

.000655 Amp

110 mA

3.6 V

2.7 V

3

YES

CMOS

BALL

1 mm

BOTTOM

NOR TYPE

8 mm

HARDWARE