Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.
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MTFDHBA960TDF-1AW4ZABYY
Micron Technology
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; JESD-30 Code: R-XXMA-N; Package Body Material: UNSPECIFIED; Memory Density: 8246337208320 bit;
R-XXMA-N
8246337208320 bit
FLASH MODULE
8
1
1030792151040 words
960G
ASYNCHRONOUS
70 Cel
0 Cel
960GX8
UNSPECIFIED
XMA
RECTANGULAR
MICROELECTRONIC ASSEMBLY
YES
CMOS
NO LEAD
TLC NAND TYPE
MTFDHBE1T9TDF-1AW12ABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; JESD-30 Code: R-XXMA-N; Memory Density: 16888498602639 bit; Technology: CMOS;
16888498602639 bit
2111062325329 words
1.92T
1.92TX8
MTFDHBE1T9TDF-1AW1ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Memory Density: 16888498602639 bit; Surface Mount: YES; No. of Words Code: 1.92T;
MTFDHBE6T4TDG-1AW12ABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Terminal Position: UNSPECIFIED; JESD-30 Code: R-XXMA-N; Memory Density: 56294995342131 bit;
56294995342131 bit
7036874417766 words
6.4T
6.4TX8
MTFDHBE7T6TDF-1AW1ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Minimum Operating Temperature: 0 Cel; Memory Width: 8; No. of Words: 8444249301319 words;
67553994410557 bit
8444249301319 words
7.68T
7.68TX8
MTFDHBA400TDG-1AW4ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; JESD-30 Code: R-XXMA-N; Surface Mount: YES; Minimum Operating Temperature: 0 Cel;
3435973836800 bit
429496729600 words
400G
400GX8
MTFDHBA800TDG-1AW1ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Surface Mount: YES; Operating Mode: ASYNCHRONOUS; Package Body Material: UNSPECIFIED;
6871947673600 bit
858993459200 words
800G
800GX8
MTFDHBE3T8TDF-1AW4ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Package Style (Meter): MICROELECTRONIC ASSEMBLY; Organization: 3.84TX8; Surface Mount: YES;
33776997205278 bit
4222124650659 words
3.84T
3.84TX8
MTFDHBE6T4TDG-1AW1ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Minimum Operating Temperature: 0 Cel; Technology: CMOS; Memory Density: 56294995342131 bit;
MTFDHBE800TDG-1AW4ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED; Terminal Form: NO LEAD; Type: TLC NAND TYPE;
MTFDHBE960TDF-1AW4ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel; Surface Mount: YES; Memory Density: 8246337208320 bit;
MTFDHBG3T8TDF-1AW4ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Terminal Form: NO LEAD; No. of Words: 4222124650659 words; Operating Mode: ASYNCHRONOUS;
MTFDHBE1T6TDG-1AW1ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Minimum Operating Temperature: 0 Cel; Package Body Material: UNSPECIFIED; Terminal Position: UNSPECIFIED;
14073748835532 bit
1759218604441 words
1.6T
1.6TX8
MTFDHBE1T6TDG-1AW4ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS; Package Body Material: UNSPECIFIED; Terminal Form: NO LEAD;
MTFDHBE1T9TDF-1AW4ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Memory Width: 8; Package Body Material: UNSPECIFIED; Technology: CMOS;
MTFDHBA960TDF-1AW1ZABYY
FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Surface Mount: YES; Terminal Position: UNSPECIFIED; Terminal Form: NO LEAD;
MT25QL02GCBB8E12-0SITTR
Micron Technology's MT25QL02GCBB8E12-0SITTR is a 256MX8 NOR flash memory with 133 MHz clock frequency, 3V programming voltage. Ideal for industrial applications, it offers 100K write/erase cycles, SPI serial bus type, and operates in a temperature range of -40 to 85°C.
BOTTOM/TOP
133 MHz
20
100000 Write/Erase Cycles
R-PBGA-B24
8 mm
2147483648 bit
FLASH
24
268435456 words
256M
SYNCHRONOUS
85 Cel
-40 Cel
256MX8
3-STATE
PLASTIC/EPOXY
TBGA
BGA24,5X5,40
GRID ARRAY, THIN PROFILE
SERIAL
3
1.2 mm
SPI
.00013 Amp
94 mA
3.6 V
2.7 V
INDUSTRIAL
BALL
1 mm
BOTTOM
NOR TYPE
6 mm
HARDWARE/SOFTWARE
MTFC128GAZAQJP-AIT
MTFC128GAZAQJP-AIT by Micron Technology is a 128GX8 NAND flash memory with 1.8V programming voltage, operating at up to 200MHz clock frequency. It is designed for industrial applications requiring high memory density and operates in synchronous mode with a temperature range of -40 to 85°C.
200 MHz
R-PBGA-B153
13 mm
1099511627776 bit
FLASH CARD
153
137438953472 words
128G
128GX8
VFBGA
BGA153,14X14,20
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
PARALLEL
1.8
AEC-Q100
1.95 V
1.7 V
.5 mm
NAND TYPE
11.5 mm
MTFC64GAZAQHD-AIT
Micron Technology's MTFC64GAZAQHD-AIT is a 64GX8 NAND flash memory with 68719476736 words capacity. Operating at 200 MHz, it has a low profile of 0.9 mm and supports industrial temperature grade applications. With a package style of GRID ARRAY, it offers high memory density and synchronous operation for various electronic devices.
549755813888 bit
68719476736 words
64G
64GX8
.9 mm
W25R256JVFIQ
Winbond Electronics
Winbond Electronics' W25R256JVFIQ is a 32MX8 NOR type Flash Memory with 133 MHz clock frequency. Operating at 3V, it offers 100000 Write/Erase cycles via SPI serial bus. Ideal for applications requiring high-speed data storage in compact devices.
R-PDSO-G16
10.31 mm
268435456 bit
16
33554432 words
32M
32MX8
SOP
SOP16,.4
SMALL OUTLINE
2.64 mm
.00012 Amp
20 mA
GULL WING
1.27 mm
DUAL
7.49 mm
SOFTWARE
SQF-SMSM4-128G-SBC
Advantech
Advantech's SQF-SMSM4-128G-SBC is a 128GX8 MLC NAND flash module with 137.44TB memory density. It operates in commercial temperature range of 0-70°C, ideal for microelectronic assemblies requiring high-speed serial memory solutions. Measuring 30x50.8 mm, it offers 52 terminals and NO LEAD terminal form for compact designs.
R-XSMA-N52
50.8 mm
52
4.2 mm
NO
COMMERCIAL
SINGLE
MLC NAND TYPE
30 mm
SQF-SMSM2-64G-SBE
Advantech SQF-SMSM2-64G-SBE is a 64GX8 MLC NAND flash module with 52 terminals. It operates in industrial temperature range (-40 to 85°C) and offers high memory density of 549755813888 bits. Ideal for applications requiring reliable serial flash memory storage solutions.
SQF-SMSM4-256G-SBC
Advantech SQF-SMSM4-256G-SBC Flash Memory features 256GX8 organization, MLC NAND type, and 2199023255552 bit memory density. Ideal for commercial applications requiring high-speed serial memory with a compact MICROELECTRONIC ASSEMBLY package.
2199023255552 bit
274877906944 words
256G
256GX8
SQF-SMSM2-64G-SBC
Advantech's SQF-SMSM2-64G-SBC is a 64GX8 MLC NAND flash module with 52 terminals. It operates b/w 0-70°C, measures 30x50.8 mm, and has a memory density of 549755813888 bits. Ideal for commercial applications requiring high-speed serial memory solutions.
SQF-SMSM4-256G-SBE
Advantech SQF-SMSM4-256G-SBE is a 256GX8 MLC NAND flash module with 52 terminals. Operating temp: -40 to 85°C, ideal for industrial applications. Serial interface, compact size (30x50.8 mm), and high memory density of 2199023255552 bits make it suitable for embedded systems.
SQF-SMSM4-512G-SBE
Advantech SQF-SMSM4-512G-SBE is a 512GX8 MLC NAND flash module with 52 terminals. Operating temp: -40 to 85°C, size: 30x50.8 mm, height: 4.2 mm. Ideal for industrial applications requiring high memory density and serial interface technology.
4398046511104 bit
549755813888 words
512G
512GX8
W25X05CLUXIGTR
W25X05CLUXIGTR by Winbond Electronics is a NOR flash memory with 64Kx8 organization, SPI serial bus type, and 104 MHz clock frequency. It operates at -40 to 85 °C, has 100000 write/erase cycles endurance, and is ideal for applications requiring fast data transfer in compact electronic devices.
104 MHz
R-PDSO-N8
3 mm
524288 bit
65536 words
64K
64KX8
HVSON
SOLCC8,.11,20
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
.6 mm
.00005 Amp
12 mA
2.3 V
2 mm
MTFC128GASAQJP-AIT
FLASH CARD; No. of Terminals: 153; Package Code: VFBGA; Package Shape: RECTANGULAR; Length: 13 mm; Maximum Supply Voltage (Vsup): 3.6 V;
AEC-Q104
MTFC128GASAQJP-AAT
FLASH CARD; No. of Terminals: 153; Package Code: VFBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH; Data Polling: NO;
105 Cel
MTFC64GASAQHD-AAT
MTFC64GASAQHD-AAT by Micron Technology is a 64GX8 NAND flash memory with 549755813888 bit density. Operating at 200 MHz, it offers synchronous operation and a very thin profile package style. Ideal for automotive applications due to AEC-Q104 screening level and wide temperature range from -40°C to 105°C.
e1
260
TIN SILVER COPPER
30
MTFC32GASAQHD-AIT
FLASH CARD; No. of Terminals: 153; Package Code: VFBGA; Package Shape: RECTANGULAR; Screening Level: AEC-Q104; Command User Interface: NO;
274877906944 bit
34359738368 words
32G
32GX8
MTFC64GASAQHD-AIT
Micron Technology's MTFC64GASAQHD-AIT is a 64GX8 NAND flash memory with 549755813888 bit density. Operating at up to 200 MHz, it suits applications requiring high-speed data storage. With AEC-Q104 screening and -40 to 85 °C temp range, it's ideal for automotive electronics.
MTFC32GASAQHD-AAT
Micron's MTFC32GASAQHD-AAT is a 32GX8 NAND flash memory with 34359738368 words. Operating in synchronous mode at up to 200 MHz, it offers a memory density of 274877906944 bits. Ideal for applications requiring high-speed data storage and retrieval in automotive electronics due to AEC-Q104 screening level.
MTFC64GAZAQHD-WT
MTFC64GAZAQHD-WT by Micron Technology is a 64GX8 NAND flash memory with 549755813888 bit density. Operating in synchronous mode, it has a package style of GRID ARRAY, suitable for applications requiring high-speed data storage. With a very thin profile and fine pitch, it offers parallel operation at temperatures ranging from -25 to 85 °C.
-25 Cel
SFEM032GB1EA1TO-I-HG-12P-STD
Swissbit Ag
Swissbit Ag's SFEM032GB1EA1TO-I-HG-12P-STD is a 32GX8 SLC NAND flash memory with 20000 Write/Erase Cycles endurance. Operating at 3.3V, it offers 34359738368 words capacity and supports up to 200 MHz clock frequency. Ideal for applications requiring high-speed synchronous memory in compact form factors.
20000 Write/Erase Cycles
3.3
SLC NAND TYPE
MT29F1G08ABBEAH4-ITX:E
Micron Technology's MT29F1G08ABBEAH4-ITX:E is a 128Mx8 SLC NAND flash memory with 1.8V supply voltage, operating from -40 to 85°C. Featuring 100K write/erase cycles, it has a page size of 2K words and sector size of 128K words. Ideal for applications requiring high endurance and reliable data storage in compact devices.
R-PBGA-B63
11 mm
1073741824 bit
1K
63
134217728 words
128M
128MX8
BGA63,10X12,32
2K
128K
.8 mm
9 mm
S29GL256S10GHB010
Infineon Technologies
FLASH; No. of Terminals: 56; Package Code: VFBGA; Package Shape: RECTANGULAR; Memory Density: 268435456 bit; Parallel or Serial: PARALLEL;
100 ns
20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES
2
R-PBGA-B56
256
56
BGA56,8X8,32
32
AEC-Q100; TS 16949
.0002 Amp
100 mA
7 mm
S29GL128S10GHB010
FLASH; No. of Terminals: 56; Package Code: VFBGA; Package Shape: RECTANGULAR; Ready or Busy: YES; No. of Words: 16777216 words;
134217728 bit
128
16777216 words
16M
16MX8
S29GL256S10GHB013
FLASH; No. of Terminals: 56; Package Code: VFBGA; Package Shape: RECTANGULAR; Maximum Access Time: 100 ns; Programming Voltage (V): 3;
W25N02KVZEIU
W25N02KVZEIU by Winbond Electronics is a 256MX8 SLC NAND flash memory with 104 MHz clock frequency, SPI serial bus type, and 60000 write/erase cycles endurance. It operates at -40 to 85 °C, suitable for applications requiring high-speed data storage in compact devices like smartphones and IoT gadgets.
10
60000 Write/Erase Cycles
R-XDSO-N8
SOLCC8,.3
35 mA
W25N02KVZEIR
W25N02KVZEIR by Winbond Electronics is a 256MX8 SLC NAND flash memory with 104 MHz clock frequency and SPI serial bus type. It operates at -40 to 85 °C, has 60000 write/erase cycles endurance, and is suitable for applications requiring high-speed data storage in compact devices.
SFSD0512N1BM1TO-I-ME-221-STD
Swissbit Ag's SFSD0512N1BM1TO-I-ME-221-STD is a 512MX8 SLC NAND flash memory chip with 208 MHz clock frequency. It operates at 3.3V, has 100K write/erase cycles endurance, and serial interface. Ideal for applications requiring high-speed data storage in compact devices due to its small form factor and low power consumption.
208 MHz
R-XUUC-N8
15 mm
4294967296 bit
536870912 words
512M
512MX8
DIE
UNCASED CHIP
.015 Amp
80 mA
UPPER
IS25WX256-JHLA3
Integrated Silicon Solution
FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Width: 6 mm; Serial Bus Type: SPI;
100
125 Cel
NOT SPECIFIED
9
70 mA
MT25QL128ABB1EW7-CSIT
Micron Technology's MT25QL128ABB1EW7-CSIT is a 16MX8 NOR flash memory with 133 MHz clock frequency, SPI serial bus type. It operates at -40 to 85 °C, has 100000 write/erase cycles endurance, and is suitable for applications requiring high-speed data storage in compact devices.
SOLCC8,.25
.00003 Amp
5 mm
MT29F8G08ADADAH4-IT:DTR
Micron Technology's MT29F8G08ADADAH4-IT:DTR is a 3.3V SLC NAND flash memory with 1GX8 organization, offering 2K page size and 128K sector size. It features a very thin profile grid array package suitable for applications requiring high endurance of up to 100,000 write/erase cycles. Operating in asynchronous mode, it has a max temperature of 85°C and min of -40°C, making it ideal for various industrial and automotive uses.
8589934592 bit
8K
1073741824 words
1G
1GX8
.0001 Amp
2701185
Phoenix Contact
CONFIGURATION MEMORY; Package Code: DIE; Package Shape: RECTANGULAR; Maximum Seated Height: 3.3 mm; JESD-30 Code: R-XUUC-N; Maximum Operating Temperature: 85 Cel;
R-XUUC-N
42.8 mm
17179869184 bit
CONFIGURATION MEMORY
2147483648 words
2G
2GX8
3.3 mm
3.465 V
3.135 V
36.4 mm
MT29F8G08AAAWP:ATR
FLASH; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Length: 18.4 mm; Page Size (words): 2K;
R-PDSO-G48
18.4 mm
48
TSOP1
TSSOP48,.8,20
SMALL OUTLINE, THIN PROFILE
12 mm
S29AL016J70TFM020
FLASH; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; No. of Words Code: 1M; Maximum Access Time: 70 ns;
70 ns
1000000 Write/Erase Cycles
16777216 bit
1,2,1,31
1048576 words
1M
1MX16
16K,8K,32K,64K
.000005 Amp
30 mA
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