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W25N02KVZEIU

Winbond Electronics

W25N02KVZEIU by Winbond Electronics

W25N02KVZEIU by Winbond Electronics is a 256MX8 SLC NAND flash memory with 104 MHz clock frequency, SPI serial bus type, and 60000 write/erase cycles endurance. It operates at -40 to 85 °C, suitable for applications requiring high-speed data storage in compact devices like smartphones and IoT gadgets.

Median Price

$2.892

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 399 parts In-Stock

1+ parts

$1.292

100+ parts

$1.260

1k+ parts

-

10k+ parts

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399

$1.292

$1.260

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Chip1Stop

Japan . 430 parts In-Stock

1+ parts

$4.492

100+ parts

$3.811

1k+ parts

$3.793

10k+ parts

-

430

$4.492

$3.811

$3.793

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Verical

USA . 399 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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399

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 450 parts In-Stock

1+ parts

$3.963

100+ parts

-

1k+ parts

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450

$3.963

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Vyrian

USA . 2,339 parts In-Stock

1+ parts

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2,339

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$3.963

100+ parts

$3.884

1k+ parts

-

10k+ parts

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2,000

$3.963

$3.884

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AZTECH Wire

Italy . 660 parts In-Stock

1+ parts

$11.740

100+ parts

-

1k+ parts

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10k+ parts

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660

$11.740

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

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1,000

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Overview

Experience unmatched reliability and performance with the W25N02KVZEIU by Winbond Electronics. As a leading manufacturer in the industry, Winbond Electronics provides top-quality flash memory products that are perfect for a wide range of applications. With its compact design, high-speed operation, and hardware/software write protection, this SLC NAND type memory device offers unparalleled value and benefits to customers. Trust Winbond Electronics for all your memory needs and elevate your projects to the next level.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and secure mounting on printed circuit boards, saving space and simplifying assembly process.

Operating Mode: SYNCHRONOUS

Enables faster data transfer and more efficient utilization of the memory module.

Nominal Supply Voltage (Vsup): 3V

Common and stable voltage supply for reliable operation.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Optimal design for compact devices with efficient heat dissipation and minimal height limitations.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high temperature environments.

Organization: 256MX8

Efficient organization of memory cells for high capacity and fast access.

Write Protection: HARDWARE/SOFTWARE

Enhanced security features to prevent accidental data corruption or unauthorized access.

Maximum Clock Frequency (fCLK): 104 MHz

Supports high-speed data processing and rapid access to memory content.

Technology: CMOS

Low power consumption and high reliability for extended product lifespan.

Endurance: 60000 Write/Erase Cycles

Long-lasting durability for frequent data read/write operations without degradation.

Technical Specifications

Flash Memory W25N02KVZEIU attributes and parameters. Explore more Flash Memory devices from Winbond Electronics

Specs

Maximum Clock Frequency (fCLK):

104 MHz

Minimum Data Retention Time:

10

Endurance:

60000 Write/Erase Cycles

JESD-30 Code:

R-XDSO-N8

Length:

8 mm

Memory Density:

2147483648 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

268435456 words

No. of Words Code:

256M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256MX8

Output Characteristics:

3-STATE

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC8,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Programming Voltage (V):

3

Maximum Seated Height:

.8 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00005 Amp

Maximum Supply Current:

35 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Type:

SLC NAND TYPE

Width:

6 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

W25N02KVZEIU Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Winbond Electronics

Winbond was established in September 1987 and listed on Taiwan Stock Exchange in 1995, and is headquartered in Central Taiwan Science Park, Taichung, Taiwan. Winbond's 12-inch fabs, which are the factories with high levels of intelligent technology and automation, are located in Taichung and Kaohsiung Science Park. Winbond is a Specialty memory IC company. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele with total memory solutions. Winbond's major product lines include Code Storage Flash Memory, TrustME® Secure Flash,Specialty DRAM and Mobile DRAM. The Company is the only one in Taiwan with the ability to develop DRAM and FLASH products in-house. Our advantages of technological autonomy and prudent capacity strategies enable us to build a highly flexible production system and create synergy among product lines, which allows us to meet the diverse demands of customers while building our brand image. Winbond’s products are used extensively in handheld devices, consumer electronics, and computer peripherals. We also focus on high-barrier, high-quality applications, such automotive and industrial electronics. Winbond has set up operations and distributor networks in the USA, Japan, China, Hong Kong , Israel ,and Germany to serve clients better and expand the depth and breadth of product sales. With regard to quality, Winbond pursues excellence and zero defects, and is certified in a number of quality and environmental safety management systems. It is also the first memory manufacturer in Taiwan to obtain the ISO 26262 certification, which is the highest standard for automotive functional safety. Winbond also always adheres to high standards of corporate governance; we have been evaluated by the Taiwan Stock Exchange as one of the top 20% listed corporate governance. Winbond will continue to provide customer-oriented services. Furthermore, by leveraging the strength of our advanced semiconductor design and manufacturing know-how, observing the core values of "accountability, innovation and synergy" and incorporating the corporate spirit of "execution, innovation and passion" in all operational activities, Winbond will strive towards the goal of becoming a hidden champion in providing sustainable semiconductors technology to enrich human life.

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