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W25N01GVSFIG

Winbond Electronics

W25N01GVSFIG by Winbond Electronics

W25N01GVSFIG by Winbond Electronics is a 128MX8 SLC NAND flash memory with 1.07Gb density, operating at up to 104MHz clock frequency. It features a small outline package, synchronous mode, and industrial temperature grade suitability. Ideal for applications requiring high-speed data storage in compact electronic devices.

Median Price

$4.500

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,210 parts In-Stock

1+ parts

$4.500

100+ parts

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1,210

$4.500

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 15 parts In-Stock

1+ parts

$2.495

100+ parts

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15

$2.495

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Vyrian

USA . 3,036 parts In-Stock

1+ parts

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3,036

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Prism Electronics

USA . 25 parts In-Stock

1+ parts

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25

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 50 parts In-Stock

1+ parts

$2.495

100+ parts

$2.445

1k+ parts

-

10k+ parts

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50

$2.495

$2.445

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AZTECH Wire

Italy . 520 parts In-Stock

1+ parts

$18.317

100+ parts

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520

$18.317

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

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1,500

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Overview

Unlock the power of seamless data storage with the W25N01GVSFIG Flash Memory by Winbond Electronics. Renowned for their high-quality products, Winbond Electronics delivers cutting-edge solutions for a wide range of applications. This SLC NAND type memory device offers industrial-grade reliability and a compact design, making it ideal for demanding environments. Experience faster data transfer speeds and increased efficiency with this advanced flash memory solution. Trust Winbond Electronics to elevate your technology experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage during handling or installation.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for faster data transfer and more efficient use of power, enhancing overall performance of the flash memory.

Nominal Supply Voltage: 3V

A stable supply voltage of 3V ensures proper functioning of the flash memory and compatibility with other devices in the same voltage range.

Maximum Clock Frequency: 104 MHz

High clock frequency allows for quick access and retrieval of data, leading to improved responsiveness and speed of the flash memory.

Memory IC Type: FLASH

Being a Flash memory ensures high-speed read/write operations, reliability, and endurance, making it suitable for various applications.

Technical Specifications

Flash Memory W25N01GVSFIG attributes and parameters. Explore more Flash Memory devices from Winbond Electronics

Specs

Maximum Clock Frequency (fCLK):

104 MHz

JESD-30 Code:

R-PDSO-G16

Length:

10.31 mm

Memory Density:

1073741824 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

16

No. of Words:

134217728 words

No. of Words Code:

128M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Programming Voltage (V):

3

Maximum Seated Height:

2.64 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Type:

SLC NAND TYPE

Width:

7.49 mm

Trade Compliance

W25N01GVSFIG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Winbond Electronics

Winbond was established in September 1987 and listed on Taiwan Stock Exchange in 1995, and is headquartered in Central Taiwan Science Park, Taichung, Taiwan. Winbond's 12-inch fabs, which are the factories with high levels of intelligent technology and automation, are located in Taichung and Kaohsiung Science Park. Winbond is a Specialty memory IC company. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele with total memory solutions. Winbond's major product lines include Code Storage Flash Memory, TrustME® Secure Flash,Specialty DRAM and Mobile DRAM. The Company is the only one in Taiwan with the ability to develop DRAM and FLASH products in-house. Our advantages of technological autonomy and prudent capacity strategies enable us to build a highly flexible production system and create synergy among product lines, which allows us to meet the diverse demands of customers while building our brand image. Winbond’s products are used extensively in handheld devices, consumer electronics, and computer peripherals. We also focus on high-barrier, high-quality applications, such automotive and industrial electronics. Winbond has set up operations and distributor networks in the USA, Japan, China, Hong Kong , Israel ,and Germany to serve clients better and expand the depth and breadth of product sales. With regard to quality, Winbond pursues excellence and zero defects, and is certified in a number of quality and environmental safety management systems. It is also the first memory manufacturer in Taiwan to obtain the ISO 26262 certification, which is the highest standard for automotive functional safety. Winbond also always adheres to high standards of corporate governance; we have been evaluated by the Taiwan Stock Exchange as one of the top 20% listed corporate governance. Winbond will continue to provide customer-oriented services. Furthermore, by leveraging the strength of our advanced semiconductor design and manufacturing know-how, observing the core values of "accountability, innovation and synergy" and incorporating the corporate spirit of "execution, innovation and passion" in all operational activities, Winbond will strive towards the goal of becoming a hidden champion in providing sustainable semiconductors technology to enrich human life.

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