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W25N01GVTCIT

Winbond Electronics

W25N01GVTCIT by Winbond Electronics

W25N01GVTCIT by Winbond Electronics is a 1Gx1 SLC NAND flash memory with 3V nominal voltage, operating at up to 104MHz clock frequency. It features hardware/software write protection and SPI serial bus type, suitable for industrial applications requiring high endurance of 100K cycles.

Median Price

$2.540

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$2.540

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$2.540

-

-

-

Vyrian

USA . 6,237 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,237

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bastille Electronics

Australia . 300 parts In-Stock

1+ parts

$2.540

100+ parts

$2.413

1k+ parts

$2.292

10k+ parts

$2.261

300

$2.540

$2.413

$2.292

$2.261

AZTECH Wire

Italy . 725 parts In-Stock

1+ parts

$11.664

100+ parts

-

1k+ parts

-

10k+ parts

-

725

$11.664

-

-

-

Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Overview

Unlock limitless possibilities with the W25N01GVTCIT Flash Memory by Winbond Electronics. Boasting top-notch quality and reliability, this product is the perfect choice for a wide range of applications in the tech industry. From data storage to system boot-up, this SLC NAND type memory offers lightning-fast performance and unparalleled endurance with 100,000 write/erase cycles. Trust Winbond Electronics to deliver cutting-edge technology that exceeds your expectations. Choose the W25N01GVTCIT for unrivaled value and seamless integration into your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and reliable material for the package body, ensuring long-lasting performance.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for faster data transfer and processing speeds.

Nominal Supply Voltage / Vsup (V): 3

Optimal supply voltage for efficient performance and compatibility with various systems.

Write Protection: HARDWARE/SOFTWARE

Multiple write protection options provide enhanced security for the stored data.

Maximum Clock Frequency (fCLK): 104 MHz

High clock frequency enables quick access to the memory for faster data retrieval.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with a wide operating temperature range from -40 to 85°C.

Endurance: 100000 Write/Erase Cycles

High endurance rating ensures longevity and reliability for frequent data read/write operations.

Memory Density: 1073741824 bit

Large memory density provides ample storage capacity for data-intensive applications.

Technical Specifications

Flash Memory W25N01GVTCIT attributes and parameters. Explore more Flash Memory devices from Winbond Electronics

Specs

Maximum Clock Frequency (fCLK):

104 MHz

Minimum Data Retention Time:

10

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PBGA-B24

Length:

8 mm

Memory Density:

1073741824 bit

Memory IC Type:

Memory Width:

1

No. of Functions:

1

No. of Terminals:

24

No. of Words:

1073741824 words

No. of Words Code:

1G

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1GX1

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA24,4X6,40

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00005 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

35 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Type:

SLC NAND TYPE

Width:

6 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

W25N01GVTCIT Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Winbond Electronics

Winbond was established in September 1987 and listed on Taiwan Stock Exchange in 1995, and is headquartered in Central Taiwan Science Park, Taichung, Taiwan. Winbond's 12-inch fabs, which are the factories with high levels of intelligent technology and automation, are located in Taichung and Kaohsiung Science Park. Winbond is a Specialty memory IC company. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele with total memory solutions. Winbond's major product lines include Code Storage Flash Memory, TrustME® Secure Flash,Specialty DRAM and Mobile DRAM. The Company is the only one in Taiwan with the ability to develop DRAM and FLASH products in-house. Our advantages of technological autonomy and prudent capacity strategies enable us to build a highly flexible production system and create synergy among product lines, which allows us to meet the diverse demands of customers while building our brand image. Winbond’s products are used extensively in handheld devices, consumer electronics, and computer peripherals. We also focus on high-barrier, high-quality applications, such automotive and industrial electronics. Winbond has set up operations and distributor networks in the USA, Japan, China, Hong Kong , Israel ,and Germany to serve clients better and expand the depth and breadth of product sales. With regard to quality, Winbond pursues excellence and zero defects, and is certified in a number of quality and environmental safety management systems. It is also the first memory manufacturer in Taiwan to obtain the ISO 26262 certification, which is the highest standard for automotive functional safety. Winbond also always adheres to high standards of corporate governance; we have been evaluated by the Taiwan Stock Exchange as one of the top 20% listed corporate governance. Winbond will continue to provide customer-oriented services. Furthermore, by leveraging the strength of our advanced semiconductor design and manufacturing know-how, observing the core values of "accountability, innovation and synergy" and incorporating the corporate spirit of "execution, innovation and passion" in all operational activities, Winbond will strive towards the goal of becoming a hidden champion in providing sustainable semiconductors technology to enrich human life.

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