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W25N01GVTBIG

Winbond Electronics

W25N01GVTBIG by Winbond Electronics

Winbond Electronics' W25N01GVTBIG is a 1GX1 SLC NAND Flash Memory with 3V supply, 104 MHz clock frequency, and SPI serial bus. Ideal for industrial applications, it offers 100K write/erase cycles, -40 to 85°C operating range, and compact GRID ARRAY package.

Median Price

$0.740

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 50 parts In-Stock

1+ parts

$0.740

100+ parts

-

1k+ parts

$0.738

10k+ parts

$0.737

50

$0.740

-

$0.738

$0.737

Mouser Electronics

USA . 462 parts In-Stock

1+ parts

$5.180

100+ parts

-

1k+ parts

-

10k+ parts

-

462

$5.180

-

-

-

Verical

USA . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.738

10k+ parts

$0.737

50

-

-

$0.738

$0.737

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$0.761

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$0.761

-

-

-

Vyrian

USA . 7,002 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,002

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 665 parts In-Stock

1+ parts

$16.762

100+ parts

-

1k+ parts

-

10k+ parts

-

665

$16.762

-

-

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$0.746

1k+ parts

$0.723

10k+ parts

$0.708

2,000

-

$0.746

$0.723

$0.708

Authorized Procurement Solutions

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,500

-

-

-

-

Overview

Unlock the power of reliable and high-performance Flash Memory with the W25N01GVTBIG by Winbond Electronics. Manufactured by a trusted industry leader, this innovative product offers unparalleled value and benefits to customers in various applications. Its durable plastic/epoxy package, synchronous operating mode, and 1GX1 organization make it ideal for industrial use. With a maximum clock frequency of 104 MHz and 100,000 write/erase cycles endurance, this Flash Memory guarantees optimal performance and long-term reliability. Upgrade your projects with Winbond Electronics and experience seamless operation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and reliability, making this flash memory a good choice for long-term use.

Surface Mount: YES

With surface mount capabilities, this flash memory can easily be integrated into various electronic devices, making it a versatile and convenient option.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy placement and installation of the flash memory, making it a simple and user-friendly choice.

Operating Mode: SYNCHRONOUS

Operating in synchronous mode ensures efficient and synchronized data processing, making this flash memory an ideal option for high-performance applications.

Nominal Supply Voltage / Vsup (V): 3

With a nominal supply voltage of 3V, this flash memory is compatible with common power sources, offering easy integration and operation in various systems.

Technical Specifications

Flash Memory W25N01GVTBIG attributes and parameters. Explore more Flash Memory devices from Winbond Electronics

Specs

Maximum Clock Frequency (fCLK):

104 MHz

Minimum Data Retention Time:

10

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PBGA-B24

Length:

8 mm

Memory Density:

1073741824 bit

Memory IC Type:

Memory Width:

1

No. of Functions:

1

No. of Terminals:

24

No. of Words:

1073741824 words

No. of Words Code:

1G

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1GX1

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA24,5X5,40

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00005 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

35 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Type:

SLC NAND TYPE

Width:

6 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

W25N01GVTBIG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Winbond Electronics

Winbond was established in September 1987 and listed on Taiwan Stock Exchange in 1995, and is headquartered in Central Taiwan Science Park, Taichung, Taiwan. Winbond's 12-inch fabs, which are the factories with high levels of intelligent technology and automation, are located in Taichung and Kaohsiung Science Park. Winbond is a Specialty memory IC company. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele with total memory solutions. Winbond's major product lines include Code Storage Flash Memory, TrustME® Secure Flash,Specialty DRAM and Mobile DRAM. The Company is the only one in Taiwan with the ability to develop DRAM and FLASH products in-house. Our advantages of technological autonomy and prudent capacity strategies enable us to build a highly flexible production system and create synergy among product lines, which allows us to meet the diverse demands of customers while building our brand image. Winbond’s products are used extensively in handheld devices, consumer electronics, and computer peripherals. We also focus on high-barrier, high-quality applications, such automotive and industrial electronics. Winbond has set up operations and distributor networks in the USA, Japan, China, Hong Kong , Israel ,and Germany to serve clients better and expand the depth and breadth of product sales. With regard to quality, Winbond pursues excellence and zero defects, and is certified in a number of quality and environmental safety management systems. It is also the first memory manufacturer in Taiwan to obtain the ISO 26262 certification, which is the highest standard for automotive functional safety. Winbond also always adheres to high standards of corporate governance; we have been evaluated by the Taiwan Stock Exchange as one of the top 20% listed corporate governance. Winbond will continue to provide customer-oriented services. Furthermore, by leveraging the strength of our advanced semiconductor design and manufacturing know-how, observing the core values of "accountability, innovation and synergy" and incorporating the corporate spirit of "execution, innovation and passion" in all operational activities, Winbond will strive towards the goal of becoming a hidden champion in providing sustainable semiconductors technology to enrich human life.

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