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W25N01GVTCIG

Winbond Electronics

W25N01GVTCIG by Winbond Electronics

W25N01GVTCIG by Winbond Electronics is a 1G SLC NAND Flash Memory with SPI Serial Bus, offering 100000 Write/Erase Cycles. Operating at 3V, it supports a max Clock Frequency of 104 MHz and has a temperature range of -40 to 85 °C. Ideal for industrial applications requiring high endurance and reliable data storage.

Median Price

$0.152

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 127 parts In-Stock

1+ parts

$0.206

100+ parts

-

1k+ parts

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10k+ parts

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127

$0.206

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Verical

USA . 127 parts In-Stock

1+ parts

-

100+ parts

$0.099

1k+ parts

-

10k+ parts

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127

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$0.099

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$0.744

100+ parts

-

1k+ parts

-

10k+ parts

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200

$0.744

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Vyrian

USA . 7,578 parts In-Stock

1+ parts

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10k+ parts

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7,578

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 500 parts In-Stock

1+ parts

$0.744

100+ parts

-

1k+ parts

$0.707

10k+ parts

$0.692

500

$0.744

-

$0.707

$0.692

AZTECH Wire

Italy . 842 parts In-Stock

1+ parts

$10.718

100+ parts

-

1k+ parts

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842

$10.718

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Overview

Unlock the power of reliable and high-performance flash memory with the W25N01GVTCIG by Winbond Electronics. This cutting-edge product offers unparalleled quality and durability, making it ideal for a wide range of applications. With Winbond's reputation for excellence in manufacturing, you can trust that this flash memory will meet your needs seamlessly. Experience lightning-fast data transfer speeds and seamless operation with the W25N01GVTCIG, providing unbeatable value and benefits to customers seeking top-notch performance in their devices.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the flash memory, ensuring long-term reliability.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for high-speed data transfer, making this flash memory efficient for quick read and write operations.

Nominal Supply Voltage: 3V

Operating at a nominal supply voltage of 3V makes this flash memory compatible with a wide range of systems and devices.

Write Protection: HARDWARE/SOFTWARE

With both hardware and software write protection features, this flash memory ensures data security and prevents accidental overwriting.

Endurance: 100000 Write/Erase Cycles

The high endurance of 100,000 write/erase cycles ensures longevity and reliability for frequent data read and write operations.

Technical Specifications

Flash Memory W25N01GVTCIG attributes and parameters. Explore more Flash Memory devices from Winbond Electronics

Specs

Maximum Clock Frequency (fCLK):

104 MHz

Minimum Data Retention Time:

10

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PBGA-B24

Length:

8 mm

Memory Density:

1073741824 bit

Memory IC Type:

Memory Width:

1

No. of Functions:

1

No. of Terminals:

24

No. of Words:

1073741824 words

No. of Words Code:

1G

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1GX1

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA24,4X6,40

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00005 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

35 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Type:

SLC NAND TYPE

Width:

6 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

W25N01GVTCIG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Winbond Electronics

Winbond was established in September 1987 and listed on Taiwan Stock Exchange in 1995, and is headquartered in Central Taiwan Science Park, Taichung, Taiwan. Winbond's 12-inch fabs, which are the factories with high levels of intelligent technology and automation, are located in Taichung and Kaohsiung Science Park. Winbond is a Specialty memory IC company. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele with total memory solutions. Winbond's major product lines include Code Storage Flash Memory, TrustME® Secure Flash,Specialty DRAM and Mobile DRAM. The Company is the only one in Taiwan with the ability to develop DRAM and FLASH products in-house. Our advantages of technological autonomy and prudent capacity strategies enable us to build a highly flexible production system and create synergy among product lines, which allows us to meet the diverse demands of customers while building our brand image. Winbond’s products are used extensively in handheld devices, consumer electronics, and computer peripherals. We also focus on high-barrier, high-quality applications, such automotive and industrial electronics. Winbond has set up operations and distributor networks in the USA, Japan, China, Hong Kong , Israel ,and Germany to serve clients better and expand the depth and breadth of product sales. With regard to quality, Winbond pursues excellence and zero defects, and is certified in a number of quality and environmental safety management systems. It is also the first memory manufacturer in Taiwan to obtain the ISO 26262 certification, which is the highest standard for automotive functional safety. Winbond also always adheres to high standards of corporate governance; we have been evaluated by the Taiwan Stock Exchange as one of the top 20% listed corporate governance. Winbond will continue to provide customer-oriented services. Furthermore, by leveraging the strength of our advanced semiconductor design and manufacturing know-how, observing the core values of "accountability, innovation and synergy" and incorporating the corporate spirit of "execution, innovation and passion" in all operational activities, Winbond will strive towards the goal of becoming a hidden champion in providing sustainable semiconductors technology to enrich human life.

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