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S25HS512TFABHM010

Infineon Technologies

S25HS512TFABHM010 by Infineon Technologies

Infineon's S25HS512TFABHM010 is a 64MX8 NOR flash memory with 166 MHz clock frequency, suitable for automotive applications due to AEC-Q100 screening. Operating at 1.8V, it offers 1280000 write/erase cycles and features SPI serial bus interface.

Median Price

$7.755

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 219 parts In-Stock

1+ parts

$9.490

100+ parts

$7.810

1k+ parts

$7.510

10k+ parts

-

219

$9.490

$7.810

$7.510

-

Rochester

USA . 1,313 parts In-Stock

1+ parts

-

100+ parts

$6.020

1k+ parts

$5.390

10k+ parts

$5.070

1,313

-

$6.020

$5.390

$5.070

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 781 parts In-Stock

1+ parts

$14.117

100+ parts

-

1k+ parts

-

10k+ parts

-

781

$14.117

-

-

-

Vyrian

USA . 375 parts In-Stock

1+ parts

$14.860

100+ parts

-

1k+ parts

-

10k+ parts

-

375

$14.860

-

-

-

PC Components Company LLC

USA . 20 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

20

-

-

-

-

Bristol Electronics

USA . 20 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

20

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 175 parts In-Stock

1+ parts

$2.867

100+ parts

$2.752

1k+ parts

$2.638

10k+ parts

-

175

$2.867

$2.752

$2.638

-

Corphita

USA . 11 parts In-Stock

1+ parts

$13.374

100+ parts

-

1k+ parts

-

10k+ parts

-

11

$13.374

-

-

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Component Stockers USA

USA . 239 parts In-Stock

1+ parts

$14.070

100+ parts

$11.120

1k+ parts

-

10k+ parts

-

239

$14.070

$11.120

-

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,000

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Overview

Unleash the power of reliable and high-quality Flash Memory with the S25HS512TFABHM010 by Infineon Technologies. Manufactured by industry leader Infineon Technologies, this Flash Memory device offers exceptional value and benefits to customers across various applications. With a durable plastic/epoxy package body material, synchronous operating mode, and AEC-Q100 screening level, this product ensures top-notch performance and reliability. Whether used in automotive, industrial, or consumer electronics, this Flash Memory delivers superior functionality and endurance, making it the ideal choice for your memory storage needs. Experience the difference with Infineon Technologies' S25HS512TFABHM010 Flash Memory today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material ensures the product is sturdy and long-lasting.

Operating Mode: SYNCHRONOUS

Enhanced performance due to synchronous operation.

Nominal Supply Voltage (Vsup): 1.8V

Efficient power usage at a moderate voltage level.

Maximum Operating Temperature: 125°C

Capable of operating in high-temperature environments without loss of functionality.

Organization: 64MX8

Organized memory structure for efficient data storage and retrieval.

Write Protection: HARDWARE

Secure data protection with hardware-based write protection.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high speed operation.

Endurance: 1280000 Write/Erase Cycles

High endurance ensures longevity and reliability of the product.

Serial Bus Type: SPI

Efficient data transfer through the Serial Peripheral Interface (SPI) bus type.

Memory IC Type: FLASH

Flash memory type provides fast read and write speeds for data storage.

Technical Specifications

Flash Memory S25HS512TFABHM010 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies

Specs

Maximum Clock Frequency (fCLK):

166 MHz

Minimum Data Retention Time:

25

Endurance:

1280000 Write/Erase Cycles

JESD-30 Code:

S-PBGA-B24

Length:

8 mm

Memory Density:

536870912 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

No. of Words:

67108864 words

No. of Words Code:

64M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA24,5X5,40

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Programming Voltage (V):

1.8

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00034 Amp

Maximum Supply Current:

69 mA

Maximum Supply Voltage (Vsup):

2 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Type:

NOR TYPE

Width:

8 mm

Write Protection:

HARDWARE

Trade Compliance

S25HS512TFABHM010 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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