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S25FL256LAGNFV010

Infineon Technologies

S25FL256LAGNFV010 by Infineon Technologies

S25FL256LAGNFV010 by Infineon is a NOR type Flash Memory with 32Mx8 organization, operating at 133MHz clock frequency. It offers 100000 write/erase cycles and supports SPI serial bus type. Ideal for industrial applications requiring high endurance and reliable data storage in compact form factor.

Median Price

$3.864

Lifecycle Status

Suppliers In-Stock

20

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 3,319 parts In-Stock

1+ parts

$3.250

100+ parts

-

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3,319

$3.250

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Arrow

USA . 1,098 parts In-Stock

1+ parts

$3.557

100+ parts

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1,098

$3.557

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Newark

USA . 1,859 parts In-Stock

1+ parts

$4.170

100+ parts

$3.650

1k+ parts

$3.460

10k+ parts

-

1,859

$4.170

$3.650

$3.460

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DigiKey

USA . 7,017 parts In-Stock

1+ parts

$4.390

100+ parts

$3.788

1k+ parts

$3.538

10k+ parts

$3.486

7,017

$4.390

$3.788

$3.538

$3.486

Mouser Electronics

USA . 5,257 parts In-Stock

1+ parts

$4.390

100+ parts

$3.650

1k+ parts

$3.450

10k+ parts

$3.440

5,257

$4.390

$3.650

$3.450

$3.440

Farnell

UK . 1,827 parts In-Stock

1+ parts

$4.710

100+ parts

$4.120

1k+ parts

$3.900

10k+ parts

-

1,827

$4.710

$4.120

$3.900

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Element14

Singapore . 1,827 parts In-Stock

1+ parts

$7.360

100+ parts

$6.480

1k+ parts

$6.130

10k+ parts

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1,827

$7.360

$6.480

$6.130

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Flip Electronics (Authorized)

USA . 36,220 parts In-Stock

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36,220

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Verical

USA . 2,955 parts In-Stock

1+ parts

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100+ parts

$3.484

1k+ parts

$3.007

10k+ parts

$2.978

2,955

-

$3.484

$3.007

$2.978

Future Electronics

Canada . 1,690 parts In-Stock

1+ parts

-

100+ parts

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$2.530

10k+ parts

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1,690

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-

$2.530

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Rochester

USA . 67 parts In-Stock

1+ parts

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100+ parts

$2.310

1k+ parts

$2.070

10k+ parts

$1.940

67

-

$2.310

$2.070

$1.940

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 114 parts In-Stock

1+ parts

$2.726

100+ parts

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114

$2.726

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Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$4.810

100+ parts

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1,000

$4.810

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TME

Poland . 1,512 parts In-Stock

1+ parts

$7.140

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1,512

$7.140

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Chip Stock

USA . 26,980 parts In-Stock

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26,980

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Vyrian

USA . 6,505 parts In-Stock

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6,505

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Rutronik

Germany . 1,690 parts In-Stock

1+ parts

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$3.100

1,690

-

-

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$3.100

Mil-Aero Solutions, Inc.

USA . 1,685 parts In-Stock

1+ parts

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1,685

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Flip Electronics

USA . 270 parts In-Stock

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270

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DigiKey Marketplace

USA . 268 parts In-Stock

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268

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 5,719 parts In-Stock

1+ parts

$2.130

100+ parts

$2.077

1k+ parts

$2.066

10k+ parts

-

5,719

$2.130

$2.077

$2.066

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Ampacity Inc.

Singapore . 6,442 parts In-Stock

1+ parts

$2.440

100+ parts

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6,442

$2.440

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Corphita

USA . 804 parts In-Stock

1+ parts

$2.583

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804

$2.583

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Aztec Data Supply Inc.

USA . 4,902 parts In-Stock

1+ parts

$3.199

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4,902

$3.199

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Modulus Dynamics

Lithuania . 2,922 parts In-Stock

1+ parts

$4.710

100+ parts

$4.522

1k+ parts

$4.333

10k+ parts

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2,922

$4.710

$4.522

$4.333

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Corohmni

South Africa . 334 parts In-Stock

1+ parts

$4.710

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334

$4.710

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Netroflash

USA . 2,000 parts In-Stock

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$4.810

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2,000

$4.810

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Component Stockers USA

USA . 15,740 parts In-Stock

1+ parts

$5.340

100+ parts

$3.900

1k+ parts

$3.970

10k+ parts

$4.090

15,740

$5.340

$3.900

$3.970

$4.090

Continental Prestige Electronics

USA . 1,618 parts In-Stock

1+ parts

$6.230

100+ parts

$4.530

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1,618

$6.230

$4.530

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Lixinc

USA . 12,627 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 11,064 parts In-Stock

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Microchip USA

USA . 9,049 parts In-Stock

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9,049

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A-Z Elektronik GmbH

Germany . 7,305 parts In-Stock

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Argo Parts USA

USA . 3,362 parts In-Stock

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3,362

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Futuretech Components

Singapore . 2,000 parts In-Stock

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2,000

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GreenTree Electronics

Israel . 2,000 parts In-Stock

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2,000

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Glotronic Ltd.

UK . 236 parts In-Stock

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236

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Perfect Parts

USA . 112 parts In-Stock

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112

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Overview

Elevate your devices with the S25FL256LAGNFV010 by Infineon Technologies, a top-tier flash memory solution that promises superior performance and reliability. Crafted by a renowned manufacturer, this chip offers seamless integration into a wide range of applications, ensuring optimal functionality and efficiency. With advanced features like synchronous operation and hardware/software write protection, this product delivers unmatched value and benefits to customers seeking high-quality memory solutions. Upgrade your tech arsenal today with the Infineon S25FL256LAGNFV010 and experience next-level performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the flash memory, making it suitable for various environments.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures faster data transfer and reliable performance.

Nominal Supply Voltage / Vsup (V): 3

Operates at a standard voltage, ensuring compatibility with a wide range of devices.

Terminal Finish: MATTE TIN

Matte tin finish offers good conductivity and solderability for reliable connections.

Write Protection: HARDWARE/SOFTWARE

Provides options for write protection, ensuring data integrity and security.

Temperature Grade: INDUSTRIAL

Industrial grade temperature range makes it suitable for harsh operating conditions.

Memory IC Type: FLASH

Flash memory technology offers fast read/write speeds and non-volatile storage for data retention.

Technical Specifications

Flash Memory S25FL256LAGNFV010 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies

Specs

Maximum Clock Frequency (fCLK):

133 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e3

Length:

8 mm

Memory Density:

268435456 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

33554432 words

No. of Words Code:

32M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32MX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.3

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Programming Voltage (V):

3

Maximum Seated Height:

.8 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00006 Amp

Maximum Supply Current:

50 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Type:

NOR TYPE

Width:

6 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

S25FL256LAGNFV010 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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