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S25HL01GTFAMHI010

Infineon Technologies

S25HL01GTFAMHI010 by Infineon Technologies

S25HL01GTFAMHI010 by Infineon Technologies is a NOR type Flash Memory with 128Mx8 organization, operating at 166 MHz clock frequency. It has a small outline package style, synchronous mode, and SPI serial bus type. Ideal for applications requiring high-speed data transfer and reliable non-volatile memory storage in compact electronic devices.

Median Price

$14.212

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 2,009 parts In-Stock

1+ parts

$9.930

100+ parts

$9.930

1k+ parts

$9.930

10k+ parts

-

2,009

$9.930

$9.930

$9.930

-

DigiKey

USA . 5,672 parts In-Stock

1+ parts

$16.850

100+ parts

$14.781

1k+ parts

$13.407

10k+ parts

-

5,672

$16.850

$14.781

$13.407

-

Farnell

UK . 1,415 parts In-Stock

1+ parts

$18.350

100+ parts

$14.420

1k+ parts

-

10k+ parts

-

1,415

$18.350

$14.420

-

-

Element14

Singapore . 1,415 parts In-Stock

1+ parts

$23.640

100+ parts

$20.150

1k+ parts

-

10k+ parts

-

1,415

$23.640

$20.150

-

-

Rochester

USA . 180,492 parts In-Stock

1+ parts

-

100+ parts

$9.260

1k+ parts

$8.290

10k+ parts

$7.800

180,492

-

$9.260

$8.290

$7.800

Flip Electronics (Authorized)

USA . 9,817 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,817

-

-

-

-

Verical

USA . 2,265 parts In-Stock

1+ parts

-

100+ parts

$11.575

1k+ parts

$10.363

10k+ parts

$9.750

2,265

-

$11.575

$10.363

$9.750

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 760 parts In-Stock

1+ parts

$7.087

100+ parts

-

1k+ parts

-

10k+ parts

-

760

$7.087

-

-

-

Nova Conductors

Japan . 95 parts In-Stock

1+ parts

$15.343

100+ parts

-

1k+ parts

-

10k+ parts

-

95

$15.343

-

-

-

Flip Electronics

USA . 9,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,600

-

-

-

-

Vyrian

USA . 3,538 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,538

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 4,914 parts In-Stock

1+ parts

$3.087

100+ parts

$2.964

1k+ parts

$2.840

10k+ parts

-

4,914

$3.087

$2.964

$2.840

-

Ampacity Inc.

Singapore . 3,487 parts In-Stock

1+ parts

$6.340

100+ parts

-

1k+ parts

-

10k+ parts

-

3,487

$6.340

-

-

-

Corphita

USA . 752 parts In-Stock

1+ parts

$6.714

100+ parts

-

1k+ parts

-

10k+ parts

-

752

$6.714

-

-

-

Netroflash

USA . 500 parts In-Stock

1+ parts

$15.343

100+ parts

-

1k+ parts

$14.576

10k+ parts

$14.269

500

$15.343

-

$14.576

$14.269

Continental Prestige Electronics

USA . 1,433 parts In-Stock

1+ parts

$17.890

100+ parts

$13.060

1k+ parts

-

10k+ parts

-

1,433

$17.890

$13.060

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 18,004 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

18,004

-

-

-

-

Eastek

USA . 2,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$20.400

10k+ parts

-

2,400

-

-

$20.400

-

Argo Parts USA

USA . 770 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

770

-

-

-

-

Overview

Unlock the power of reliable and high-performance flash memory with the S25HL01GTFAMHI010 by Infineon Technologies. Designed with precision and expertise, this flash memory device offers seamless operation in synchronous mode, ensuring optimal performance at a clock frequency of up to 166 MHz. Ideal for a wide range of applications, from consumer electronics to industrial automation, this small outline package boasts a 128MX8 organization for efficient data storage. Trust Infineon Technologies to deliver top-notch quality and value with the S25HL01GTFAMHI010, providing customers with unparalleled benefits and advantages for their memory storage needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this flash memory lightweight and durable, making it a good choice for portable devices.

Surface Mount: YES

Being surface mountable, this flash memory is easy to integrate onto circuit boards, saving space and making assembly more efficient.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy placement and alignment on a circuit board, providing a more streamlined design.

Operating Mode: SYNCHRONOUS

With synchronous operation, this flash memory offers faster data transfer speeds and improved system performance, making it ideal for high-speed applications.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal voltage of 3V, this flash memory is energy efficient and compatible with a wide range of devices.

No. of Terminals: 16

With 16 terminals, this flash memory provides a secure and stable connection to the circuit board, reducing the risk of signal interference.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making this flash memory suitable for compact electronic devices.

Technical Specifications

Flash Memory S25HL01GTFAMHI010 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies

Specs

Maximum Clock Frequency (fCLK):

166 MHz

Minimum Data Retention Time:

25

Endurance:

2560000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G16

Length:

10.3 mm

Memory Density:

1073741824 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

No. of Words:

134217728 words

No. of Words Code:

128M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Programming Voltage (V):

3

Maximum Seated Height:

2.65 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00056 Amp

Maximum Supply Current:

69 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Type:

NOR TYPE

Width:

7.5 mm

Write Protection:

HARDWARE

Trade Compliance

S25HL01GTFAMHI010 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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