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S25HS02GTDPBHV150

Infineon Technologies

S25HS02GTDPBHV150 by Infineon Technologies

S25HS02GTDPBHV150 by Infineon Technologies is a 256MX8 NOR type flash memory with a max clock frequency of 166 MHz. It operates in synchronous mode and has a min data retention time of 25 years. This flash memory is commonly used in applications such as consumer electronics, automotive systems, and industrial equipment.

Median Price

$22.080

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 139 parts In-Stock

1+ parts

$20.540

100+ parts

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139

$20.540

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Chip1Stop

Japan . 244 parts In-Stock

1+ parts

$23.621

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244

$23.621

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Rochester

USA . 974 parts In-Stock

1+ parts

-

100+ parts

$19.050

1k+ parts

$17.040

10k+ parts

$16.040

974

-

$19.050

$17.040

$16.040

Verical

USA . 318 parts In-Stock

1+ parts

-

100+ parts

$23.813

1k+ parts

$21.300

10k+ parts

$20.050

318

-

$23.813

$21.300

$20.050

Distributors (In-Stock)

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Digiode

USA . 887 parts In-Stock

1+ parts

$22.440

100+ parts

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887

$22.440

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Nova Conductors

Japan . 500 parts In-Stock

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$24.861

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500

$24.861

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Vyrian

USA . 4,083 parts In-Stock

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4,083

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Flip Electronics

USA . 520 parts In-Stock

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520

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 2,582 parts In-Stock

1+ parts

$5.527

100+ parts

$5.306

1k+ parts

$5.085

10k+ parts

-

2,582

$5.527

$5.306

$5.085

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AZTECH Wire

Italy . 648 parts In-Stock

1+ parts

$18.199

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648

$18.199

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Corphita

USA . 836 parts In-Stock

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$21.259

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836

$21.259

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Continental Prestige Electronics

USA . 6,162 parts In-Stock

1+ parts

$24.861

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$24.364

6,162

$24.861

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$24.364

Netroflash

USA . 100 parts In-Stock

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$24.861

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$23.618

10k+ parts

$23.121

100

$24.861

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$23.618

$23.121

Ampacity Inc.

Singapore . 297 parts In-Stock

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$43.700

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$43.700

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Argo Parts USA

USA . 1,514 parts In-Stock

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1,514

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Overview

Experience the next level of performance and reliability with the S25HS02GTDPBHV150 by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies delivers exceptional quality and innovation. This flash memory solution is perfect for a wide range of applications, offering fast and efficient data storage. With its synchronous operation and high clock frequency of 166 MHz, you can trust this product to deliver optimal performance. Its compact design and thin profile make it easy to integrate into any project. Plus, with its hardware write protection feature and endurance of 300,000 write/erase cycles, your data will always be secure. Upgrade your technology today with the S25HS02GTDPBHV150 and experience a new level of excellence.

Feature Benefit Bullets

Synchronous Operating Mode

The flash memory operates synchronously, allowing for faster and more efficient data transfers. This results in quicker access to stored information, saving the customer's time and improving overall performance.

Nominal Supply Voltage of 1.8V

The low supply voltage of the flash memory minimizes power consumption, leading to longer battery life in devices that use this product. Customers can enjoy extended usage without the need for frequent recharging or replacement of batteries.

Hardware Write Protection

The flash memory features hardware write protection, ensuring that important data cannot be accidentally overwritten or modified. This provides peace of mind to customers, knowing that their valuable information is secure and protected from unintentional changes.

Serial Bus Type: SPI

The Serial Peripheral Interface (SPI) allows for easy integration with various microcontrollers and other devices. This simplifies the connection and communication process, making it effortless for customers to incorporate the flash memory into their projects or systems.

Endurance of 300,000 Write/Erase Cycles

With a high endurance level, this flash memory can withstand numerous write and erase operations without compromising its reliability or performance. Customers can confidently utilize this product for applications that require frequent data modifications without worrying about premature failure.

Memory Density of 2,147,483,648 bits

The large memory density of the flash memory provides ample storage capacity for extensive data needs. Customers can store a vast amount of information, such as documents, media files, or program code, without having to worry about running out of space.

Wide Operating Temperature Range (-40°C to 105°C)

The flash memory is designed to operate reliably in both extreme cold and hot temperatures. This makes it suitable for a wide range of environments and applications, ensuring uninterrupted functionality regardless of the climate conditions.

Thin Profile Package Style

The flash memory has a thin profile package style, making it ideal for space-constrained devices or systems. Customers can integrate this product into compact designs without compromising on performance or functionality.

High Clock Frequency of 166 MHz

The flash memory supports a high clock frequency, enabling faster data transfers and access speeds. This results in improved overall system performance and responsiveness, enhancing the user experience.

Moisture Sensitivity Level 3

The flash memory is designed to withstand moisture exposure up to level 3, providing resistance against environmental humidity. This ensures the longevity and reliability of the product, particularly in applications where moisture may be present.

Technical Specifications

Flash Memory S25HS02GTDPBHV150 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies

Specs

Maximum Clock Frequency (fCLK):

166 MHz

Minimum Data Retention Time:

25

Endurance:

300000 Write/Erase Cycles

JESD-30 Code:

S-PBGA-B24

Length:

8 mm

Memory Density:

2147483648 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

No. of Words:

268435456 words

No. of Words Code:

256M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256MX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA24,5X5,40

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE

Parallel or Serial:

SERIAL

Programming Voltage (V):

1.8

Maximum Seated Height:

1.2 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00045 Amp

Maximum Supply Current:

110 mA

Maximum Supply Voltage (Vsup):

2 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Type:

NOR TYPE

Width:

8 mm

Write Protection:

HARDWARE

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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