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XCZU7CG-1FBVB900I

Xilinx

XCZU7CG-1FBVB900I by Xilinx

The Xilinx XCZU7CG-1FBVB900I is a CMOS microprocessor circuit with 900 terminals in a grid array package. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. Ideal for industrial applications requiring high-performance processing capabilities.

Median Price

$3,178.380

Lifecycle Status

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5

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1k+

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Mouser Electronics

USA . 3 parts In-Stock

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$3,178.380

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Digiode

USA . 418 parts In-Stock

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$3,028.400

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Nova Conductors

Japan . 50 parts In-Stock

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$3,129.660

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VNN

France . 644 parts In-Stock

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$3,187.790

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Vyrian

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AZTECH Wire

Italy . 813 parts In-Stock

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$5.503

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Corohmni

South Africa . 3,053 parts In-Stock

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$22.025

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MARBEL Systems

Belgium . 3,610 parts In-Stock

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$55.177

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$52.970

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Texas Native Microelectronics

USA . 25 parts In-Stock

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$63.422

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$60.885

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$58.982

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Kenton Components

USA . 32 parts In-Stock

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$76.106

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$66.974

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Modulus Dynamics

Lithuania . 318 parts In-Stock

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$87.836

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$87.836

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Microchip USA

USA . 100 parts In-Stock

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$2,500.000

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One Stop Electronics

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$2,709.620

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Ampacity Inc.

Singapore . 3 parts In-Stock

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Semicontronic

India . 3 parts In-Stock

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$2,709.620

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$2,641.880

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$2,628.331

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Corphita

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$2,869.011

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Continental Prestige Electronics

USA . 3,547 parts In-Stock

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$3,129.660

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$3,067.067

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Argo Parts USA

USA . 490 parts In-Stock

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$3,129.660

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$3,098.363

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$3,067.067

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$3,035.770

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Netroflash

USA . 50 parts In-Stock

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$3,129.660

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$2,973.177

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$2,910.584

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Qasali Group International

UK . 491 parts In-Stock

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$164.390

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$150.691

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Vigor

Singapore . 441 parts In-Stock

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Supply Digital

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Overview

Experience cutting-edge technology with the XCZU7CG-1FBVB900I by Xilinx, a leading manufacturer in the field of Other Function uPs,uCs & Peripheral ICs. This innovative product boasts unparalleled quality and reliability, with applications ranging from microprocessor circuits to industrial-grade technology. With a maximum supply voltage of 0.876 V and a temperature range of -40°C to 100°C, this versatile device offers customers exceptional value and performance. Upgrade your projects with the XCZU7CG-1FBVB900I and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components due to its durability and cost-effectiveness.

Surface Mount: YES

Makes it easier for automated assembly processes, saving time and reducing costs.

Maximum Supply Voltage: 0.876 V

Higher maximum supply voltage provides flexibility in power supply options.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on a circuit board.

No. of Terminals: 900

High number of terminals allows for a complex circuit design and connectivity options.

Package Style (Meter): GRID ARRAY

Grid array style makes soldering and mounting easier and more secure.

Minimum Supply Voltage: 0.825 V

Low minimum supply voltage helps in reducing power consumption and heat dissipation.

Maximum Operating Temperature: 100 °C

Can operate at high temperatures, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Can operate at low temperatures, suitable for a wide range of environments.

Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

This terminal finish provides good conductivity and solderability.

Terminal Position: BOTTOM

Bottom terminal position allows for more efficient heat dissipation.

Maximum Time At Peak Reflow Temperature (s): 30

Short peak reflow time helps in preventing damage to the component during soldering.

Peak Reflow Temperature °C: 245

High peak reflow temperature ensures proper soldering and component reliability.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial environments with varying temperature conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit allows for complex computations and control functions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: BALL

Ball form terminals provide good electrical connections and reliability.

Nominal Supply Voltage: 0.85 V

Stable nominal supply voltage ensures consistent operation of the product.

Moisture Sensitivity Level (MSL): 4

MSL level 4 indicates that the product can withstand standard humidity conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU7CG-1FBVB900I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B900

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

900

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU7CG-1FBVB900I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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