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XCZU5EG-1FBVB900E

Xilinx

XCZU5EG-1FBVB900E by Xilinx

XCZU5EG-1FBVB900E by Xilinx is a programmable SoC with 900 terminals, operating temperature range of 0 to 100°C, and a supply voltage range of 0.825 to 0.876V. It is commonly used in Other Function uPs,uCs & Peripheral ICs applications.

Median Price

$2,259.250

Lifecycle Status

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5

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1k+

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Nova Conductors

Japan . 10 parts In-Stock

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Vyrian

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Chip Stock

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VNN

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Digiode

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Ampacity Inc.

Singapore . 319 parts In-Stock

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AZTECH Wire

Italy . 605 parts In-Stock

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Semicontronic

India . 779 parts In-Stock

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$9.700

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One Stop Electronics

USA . 366 parts In-Stock

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$32.000

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Modulus Dynamics

Lithuania . 789 parts In-Stock

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MARBEL Systems

Belgium . 550 parts In-Stock

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Texas Native Microelectronics

USA . 30 parts In-Stock

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Kenton Components

USA . 7,659 parts In-Stock

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Corohmni

South Africa . 238 parts In-Stock

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Microchip USA

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Netroflash

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Qasali Group International

UK . 3,143 parts In-Stock

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Supply Digital

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Corphita

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Vigor

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Overview

Experience innovation like never before with the XCZU5EG-1FBVB900E by Xilinx. As a leading manufacturer in the industry, Xilinx delivers unmatched quality and reliability in their products. Designed for Other Function uPs, uCs & Peripheral ICs, this cutting-edge device offers endless possibilities for various applications. With its advanced technology and versatile programming capabilities, customers can unlock limitless potential in their projects. Discover the value of seamless integration, enhanced performance, and unparalleled functionality. Don't settle for ordinary, choose the XCZU5EG-1FBVB900E and revolutionize your designs today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides excellent durability and protection for the product, making it a reliable choice for various applications.

Surface Mount: YES

This feature allows for easy and efficient installation of the product, saving time and effort during assembly.

Maximum Supply Voltage: 0.876 V

With a high maximum supply voltage, this product is suitable for applications that require a robust power source, ensuring stable performance.

Package Shape: RECTANGULAR

The rectangular shape of the package offers versatility in mounting options, allowing for flexible integration into different systems.

No. of Terminals: 900

The large number of terminals provides extensive connectivity options, enabling complex circuit configurations and expanded functionality.

Package Style (Meter): GRID ARRAY

The grid array package style offers optimal electrical performance and efficient heat dissipation, making it an excellent choice for high-performance applications.

Minimum Supply Voltage: 0.825 V

The low minimum supply voltage makes this product energy-efficient, suitable for battery-operated devices and reducing power consumption.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this product can withstand demanding environments, ensuring reliability and long-lasting performance.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures allows this product to be used in various climates and environments without compromising functionality.

Terminal Finish: TIN SILVER COPPER

The combination of tin, silver, and copper ensures excellent conductivity, enhancing signal transmission and overall performance.

Terminal Position: BOTTOM

The terminal position at the bottom of the package allows for convenient and organized circuit board layout, facilitating efficient system design and assembly.

Maximum Seated Height: 2.88 mm

The compact maximum seated height of the product enables space-saving designs and integration into compact electronic devices.

Width: 31 mm

With a moderate width, this product can be easily integrated into different electronic systems and PCB layouts, providing design flexibility.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures safe and efficient soldering during assembly, minimizing the risk of damage to the product.

Peak Reflow Temperature °C: 245

The high peak reflow temperature allows for proper soldering and strong bonds, ensuring reliable connections between the product and the circuit board.

Length: 31 mm

The moderate length of the product makes it easy to fit into various electronic enclosures and designs, maximizing compatibility and versatility.

Peripheral IC Type: PROGRAMMABLE SoC

Being a programmable System-on-Chip (SoC), this product offers versatility and customization options, making it ideal for a wide range of applications.

Technology: CMOS

The use of CMOS technology ensures low power consumption, high-speed operation, and compatibility with various digital systems, making it an efficient and reliable choice.

Terminal Form: BALL

The ball terminal form provides excellent electrical connection and reliability, making it suitable for applications with high vibration or mechanical stress.

Nominal Supply Voltage: 0.85 V

With a stable nominal supply voltage, this product ensures consistent and reliable performance in various operating conditions.

Terminal Pitch: 1 mm

The 1 mm terminal pitch offers compatibility with standard PCB layouts and allows for easy integration into existing electronic systems.

Moisture Sensitivity Level (MSL): 4

With a moisture sensitivity level of 4, this product can withstand exposure to ambient moisture during handling, ensuring its long-term reliability and functionality.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU5EG-1FBVB900E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B900

JESD-609 Code:

e1

Length:

31 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

900

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA900,30X30,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Seated Height:

2.88 mm

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

31 mm

Peripheral IC Type:

Trade Compliance

XCZU5EG-1FBVB900E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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