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XF280039CSPM

Texas Instruments

XF280039CSPM by Texas Instruments

Texas Instruments XF280039CSPM is a 32-bit microcontroller with 64 terminals, operating at up to 25 MHz. Featuring 16-Ch 12-Bit ADC and 2-Ch 12-Bit DAC, it's ideal for applications requiring CAN, I2C, LIN connectivity and low power mode. With ROM of 196608 words and RAM of 70656 bytes, this CMOS device offers high performance in a compact package.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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ComSIT Distribution GmbH

Germany . 33,809 parts In-Stock

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Vyrian

USA . 5,144 parts In-Stock

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Digiode

USA . 1,663 parts In-Stock

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Nova Conductors

Japan . 49 parts In-Stock

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Semicontronic

India . 1,249 parts In-Stock

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$2.000

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$1.950

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$1.940

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1,249

$2.000

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$1.940

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AZTECH Wire

Italy . 510 parts In-Stock

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$7.736

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510

$7.736

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Ampacity Inc.

Singapore . 1,269 parts In-Stock

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$25.000

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One Stop Electronics

USA . 983 parts In-Stock

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$30.000

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Corohmni

South Africa . 193 parts In-Stock

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$66.748

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Parana Technologies

USA . 1,769 parts In-Stock

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$67.234

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$68.894

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$65.449

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$65.449

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DigiPath Technology Company

USA . 1,729 parts In-Stock

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$74.033

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$68.110

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IDEA Electronic Components Group

UK . 2,000 parts In-Stock

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$75.544

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$71.767

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$67.990

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2,000

$75.544

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ChromeModa Solutions

Germany . 1,882 parts In-Stock

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$75.544

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$61.946

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Continental Prestige Electronics

USA . 2,503 parts In-Stock

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Corphita

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Argo Parts USA

USA . 588 parts In-Stock

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Bastille Electronics

Australia . 47 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the XF280039CSPM microcontroller by Texas Instruments. Crafted with precision and expertise, this device offers unparalleled performance and reliability in a variety of applications. From automotive to industrial automation, this microcontroller is designed to exceed expectations and deliver superior results. Experience seamless integration, advanced features, and unmatched efficiency with the XF280039CSPM. Elevate your projects to new heights with Texas Instruments' trusted quality and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and protection for the microcontroller, making it suitable for various environments and applications.

Maximum Supply Voltage: 1.32 V

Higher maximum supply voltage allows for flexibility in power sources, ensuring stable operation even with varying voltage inputs.

Bit Size: 32

32-bit architecture provides enhanced processing power and capability for handling complex tasks efficiently.

DAC Channels: YES

Digital-to-analog converter channels enable the microcontroller to interface with analog devices and sensors, expanding its functionality.

No. of Terminals: 64

Higher number of terminals allow for more connectivity options and interfaces, making the microcontroller versatile for different applications.

Maximum Clock Frequency: 25 MHz

High clock frequency ensures fast and responsive operation, making the microcontroller suitable for real-time processing and applications that require quick computation.

Analog To Digital Convertors: 16-Ch 12-Bit

Multiple analog-to-digital converter channels with 12-bit resolution allow for accurate and precise analog signal processing, making the microcontroller ideal for sensor interfacing and data acquisition.

Connectivity: CAN(2), FSI, I2C(2), LIN(2), SCI(2), SPI(2)

Various connectivity options including CAN, I2C, LIN, and SPI enable the microcontroller to communicate with different devices and systems, enhancing its compatibility and versatility.

Technical Specifications

Microcontrollers XF280039CSPM attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

6

No. of External Interrupts:

5

No. of I/O Lines:

26

No. of Serial I/Os:

7

No. of Terminals:

64

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

70656

ROM Words:

196608

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

120 rpm

Maximum Supply Current:

108 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), FSI, I2C(2), LIN(2), SCI(2), SPI(2)

Peripherals:

BOR, COMPARATOR(4), DMA(6), POR, PWM(16), TIMER(3), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

XF280039CSPM Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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