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XF2800157QPHPQ1

Texas Instruments

XF2800157QPHPQ1 by Texas Instruments

Texas Instruments XF2800157QPHPQ1 microcontroller features 32-bit architecture, 131072 ROM words, and 36864 RAM bytes. Ideal for automotive applications due to AEC-Q100 screening, with CAN, I2C, LIN connectivity options. Operates b/w -40°C to 125°C temperature range.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 6,263 parts In-Stock

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Digiode

USA . 1,909 parts In-Stock

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AZTECH Wire

Italy . 572 parts In-Stock

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$13.912

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572

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Ampacity Inc.

Singapore . 936 parts In-Stock

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$16.000

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One Stop Electronics

USA . 521 parts In-Stock

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$19.000

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521

$19.000

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Semicontronic

India . 852 parts In-Stock

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$29.000

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$28.275

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$28.130

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852

$29.000

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Corphita

USA . 2,475 parts In-Stock

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Corohmni

South Africa . 412 parts In-Stock

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Overview

Unlock the power of innovative technology with the XF2800157QPHPQ1 microcontroller by Texas Instruments. Designed with precision and quality in mind, this device offers superior performance for a wide range of applications. With its advanced features and high reliability, customers can trust in the value and benefits that this product brings to their projects. From automotive to industrial automation, this microcontroller delivers unmatched advantages, making it the ideal choice for your next innovation. Trust Texas Instruments for excellence in microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and allows for efficient heat dissipation, making the product reliable and long-lasting.

Maximum Supply Voltage: 1.32 V

A higher maximum supply voltage allows for flexibility in powering the microcontroller, ensuring compatibility with different power sources.

Bit Size: 32

A larger bit size enables the microcontroller to handle complex calculations and data processing tasks efficiently.

ADC Channels: YES

Having Analog-to-Digital Converter channels allows the microcontroller to interface with analog sensors and devices, expanding its range of applications.

No. of Timers: 3

Multiple timers provide the microcontroller with precise timing capabilities, essential for various time-sensitive functions and applications.

Connectivity: CAN(2), I2C(2), LIN, SCI(3), SPI

Versatile connectivity options allow the microcontroller to communicate with a wide range of external devices and systems, enhancing its versatility.

Speed: 120 rpm

The speed of 120 rpm indicates the maximum processing speed of the microcontroller, making it suitable for applications requiring fast data processing.

Low Power Mode: YES

The low power mode capability helps in conserving energy and extending the battery life of devices powered by the microcontroller.

Technical Specifications

Microcontrollers XF2800157QPHPQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

F2800157

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

NO

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Low Power Mode:

YES

No. of External Interrupts:

5

No. of I/O Lines:

27

No. of Serial I/Os:

5

No. of Terminals:

48

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP48,.35SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

RAM Bytes:

36864

ROM Words:

131072

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

120 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Connectivity:

CAN(2), I2C(2), LIN, SCI(3), SPI

Peripherals:

BOR, CAP(2), COMPARATOR(4), POR, PWM(14), RTC, TIMER(3), WDT(2)

Analog To Digital Convertors:

17-Ch 12-Bit

Digital To Analog Convertors:

2 Ch 12-Bit

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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