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XF2800157QRHBQ1

Texas Instruments

XF2800157QRHBQ1 by Texas Instruments

Texas Instruments XF2800157QRHBQ1 microcontroller features 32-bit CPU, 131072 ROM words, and 36864 RAM bytes. Ideal for automotive applications with AEC-Q100 screening level, offering CAN, I2C, LIN connectivity and low power mode at -40 to 125 °C temperature range.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,515 parts In-Stock

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4,515

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Digiode

USA . 4,424 parts In-Stock

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4,424

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Distributors (Availability)

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Ampacity Inc.

Singapore . 289 parts In-Stock

1+ parts

$1.000

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289

$1.000

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Semicontronic

India . 1,034 parts In-Stock

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$2.000

100+ parts

$1.950

1k+ parts

$1.940

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1,034

$2.000

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$1.940

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AZTECH Wire

Italy . 738 parts In-Stock

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$8.715

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738

$8.715

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One Stop Electronics

USA . 525 parts In-Stock

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$26.000

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525

$26.000

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Corphita

USA . 1,685 parts In-Stock

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1,685

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Corohmni

South Africa . 105 parts In-Stock

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105

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Overview

Discover the XF2800157QRHBQ1 by Texas Instruments, a top-quality microcontroller designed to meet all your needs. With a focus on innovation and reliability, Texas Instruments ensures that this product delivers outstanding performance in various applications. From its advanced technology to its low power mode, this microcontroller offers unmatched value and benefits for customers looking for a high-performing solution. Trust Texas Instruments to provide you with the tools you need to bring your projects to life seamlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and cost-effectiveness for the product.

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards, saving time during assembly.

Maximum Supply Voltage: 1.32 V

Provides sufficient voltage for the product to operate effectively without risking damage.

On Chip Data RAM Width: 8

Allows for efficient storage and processing of data within the microcontroller.

Screening Level: AEC-Q100

Ensures high reliability and quality standards for automotive applications.

Package Shape: SQUARE

Provides a compact form factor for space-constrained designs.

Bit Size: 32

Enables processing of larger data sets and instructions, suitable for diverse applications.

DAC Channels: YES

Allows for analog signal output, useful for interfacing with sensors and actuators.

No. of Terminals: 32

Provides ample connectivity options for interfacing with external components.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Offers flexibility in packaging options for different application requirements.

Minimum Supply Voltage: 1.14 V

Supports low-power operation while maintaining stable performance.

Maximum Operating Temperature: 125 °C

Ensures reliable operation in high-temperature environments.

CPU Family: F2800157

Part of a well-established and reliable microcontroller family for consistent performance.

No. of External Interrupts: 5

Allows for timely response to external events, enhancing system responsiveness.

Minimum Operating Temperature: -40 °C

Suitable for operation in harsh environmental conditions.

ADC Channels: YES

Enables analog signal input for monitoring and control applications.

Terminal Position: QUAD

Facilitates easy arrangement and connection of external components.

ROM Words: 131072

Provides ample storage for program instructions and data.

Maximum Seated Height: 1 mm

Allows for low-profile designs and compact product form factor.

Digital To Analog Convertors: 2 Ch 12-Bit

Provides high-resolution analog output capabilities for precise control.

Width: 5 mm

Compact size enables integration into small electronic devices.

Boundary Scan: YES

Facilitates testing and debugging during production and maintenance.

Peripherals: BOR, CAP(2), COMPARATOR(4), POR, PWM(14), RTC, TIMER(3), WDT(2)

Offers a wide range of peripherals for versatile functionality and application support.

Maximum Clock Frequency: 25 MHz

Allows for fast processing speeds and responsive system behavior.

Length: 5 mm

Balances form factor with functionality for efficient board layout.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a RISC architecture for efficient instruction execution and performance.

No. of Timers: 3

Enables scheduling and timing functions for various system tasks.

RAM Bytes: 36864

Sufficient memory for data storage and processing in various applications.

Technology: CMOS

Uses CMOS technology for low power consumption and efficient operation.

Terminal Form: NO LEAD

Improves reliability and durability of connections in demanding environments.

Analog To Digital Convertors: 11-Ch 12-Bit

Offers multiple channels for accurate analog signal conversion.

Nominal Supply Voltage: 1.2 V

Optimal voltage level for stable and efficient operation.

No. of Serial I/Os: 5

Supports serial communication interfaces for data exchange with external devices.

PWM Channels: YES

Enables precise control of connected devices through pulse-width modulation.

Connectivity: CAN(2), I2C(2), LIN, SCI(3), SPI

Provides versatile communication options for interfacing with different components and systems.

ROM Programmability: FLASH

Allows for flexible and easy reprogramming of the microcontroller's memory.

Terminal Pitch: 0.5 mm

Enables compact and space-efficient board layout for integration.

Format: FLOATING POINT

Supports floating-point arithmetic for accurate calculations in diverse applications.

Speed: 120 rpm

Suitable for applications requiring precise timing and control at this speed.

Low Power Mode: YES

Provides power-saving options for energy-efficient operation.

On Chip Program ROM Width: 16

Sufficient width for storing program instructions on the chip.

No. of I/O Lines: 18

Plenty of input/output options for connecting to external devices and sensors.

Technical Specifications

Microcontrollers XF2800157QRHBQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

F2800157

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

NO

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N32

Length:

5 mm

Low Power Mode:

YES

No. of External Interrupts:

5

No. of I/O Lines:

18

No. of Serial I/Os:

5

No. of Terminals:

32

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

36864

ROM Words:

131072

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Speed:

120 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Peripheral IC Type:

Connectivity:

CAN(2), I2C(2), LIN, SCI(3), SPI

Peripherals:

BOR, CAP(2), COMPARATOR(4), POR, PWM(14), RTC, TIMER(3), WDT(2)

Analog To Digital Convertors:

11-Ch 12-Bit

Digital To Analog Convertors:

2 Ch 12-Bit

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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