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XF280037CSPT

Texas Instruments

XF280037CSPT by Texas Instruments

Texas Instruments XF280037CSPT is a 32-bit microcontroller with 131072 ROM words and 70656 RAM bytes. Featuring 14-Ch 12-Bit ADC, it offers low power mode and operates at up to 25 MHz. Ideal for applications requiring CAN, I2C, LIN connectivity and multiple PWM channels.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,173 parts In-Stock

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Digiode

USA . 3,008 parts In-Stock

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3,008

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Nova Conductors

Japan . 98 parts In-Stock

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98

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Distributors (Availability)

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AZTECH Wire

Italy . 281 parts In-Stock

1+ parts

$4.915

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281

$4.915

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Semicontronic

India . 560 parts In-Stock

1+ parts

$7.000

100+ parts

$6.825

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$6.790

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-

560

$7.000

$6.825

$6.790

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Ampacity Inc.

Singapore . 1,301 parts In-Stock

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$12.000

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1,301

$12.000

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One Stop Electronics

USA . 1,310 parts In-Stock

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$18.000

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1,310

$18.000

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Parana Technologies

USA . 174 parts In-Stock

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$48.606

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174

$48.606

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DigiPath Technology Company

USA . 668 parts In-Stock

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$53.522

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$49.240

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668

$53.522

$49.240

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IDEA Electronic Components Group

UK . 1,935 parts In-Stock

1+ parts

$54.614

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$51.883

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$49.153

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1,935

$54.614

$51.883

$49.153

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ChromeModa Solutions

Germany . 743 parts In-Stock

1+ parts

$54.614

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$44.783

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743

$54.614

$44.783

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Corohmni

South Africa . 14 parts In-Stock

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$76.003

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14

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Argo Parts USA

USA . 3,148 parts In-Stock

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Corphita

USA . 2,720 parts In-Stock

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Continental Prestige Electronics

USA . 805 parts In-Stock

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805

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Overview

Experience the cutting-edge technology of the XF280037CSPT microcontroller by Texas Instruments, a leader in the industry known for quality and innovation. Ideal for a wide range of applications, this product offers unparalleled value with its advanced features and high performance capabilities. With a focus on reliability and efficiency, this microcontroller is sure to enhance your projects and provide you with the competitive edge you need. Upgrade to the XF280037CSPT today and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for the package body, ensuring the microcontroller is protected and can be easily integrated into various electronic devices.

Maximum Supply Voltage: 1.32 V

Operates efficiently within a low maximum supply voltage range, reducing power consumption and heat generation.

Bit Size: 32

Higher bit size allows for more complex computations and processing capabilities, making the microcontroller suitable for advanced applications.

ADC Channels: YES

Presence of Analog to Digital Converters allows for accurate conversion of analog signals to digital data, enabling precise sensing and measurement functionalities.

No. of Timers: 3

Multiple timer channels enable efficient time-based operations and scheduling within the microcontroller, enhancing its versatility in managing tasks.

Connectivity: CAN(2), FSI, I2C(2), LIN(2), SCI(2), SPI(2)

Offers a wide range of communication options including CAN, I2C, LIN, and SPI, making the microcontroller compatible with various interfaces and devices.

Low Power Mode: YES

Capability to operate in low power mode conserves energy and extends battery life, making the microcontroller suitable for power-efficient applications.

Technical Specifications

Microcontrollers XF280037CSPT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

6

No. of External Interrupts:

5

No. of I/O Lines:

14

No. of Serial I/Os:

7

No. of Terminals:

48

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

70656

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

120 rpm

Maximum Supply Current:

108 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), FSI, I2C(2), LIN(2), SCI(2), SPI(2)

Peripherals:

BOR, COMPARATOR(4), DMA(6), POR, PWM(16), TIMER(3), WDT(2)

Analog To Digital Convertors:

14-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

XF280037CSPT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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