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XF280049MPZS

Texas Instruments

XF280049MPZS by Texas Instruments

XF280049MPZS by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 51200 RAM bytes. It features 21-Ch 12-Bit ADC channels, 16 PWM channels, and peripherals like BOR, DMA(6), and TIMER(3). Ideal for automotive applications due to its temperature grade and connectivity options including CAN, I2C, LIN, SCI(2), and SPI(2).

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,833 parts In-Stock

1+ parts

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100+ parts

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4,833

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Digiode

USA . 2,704 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,704

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 764 parts In-Stock

1+ parts

$7.085

100+ parts

-

1k+ parts

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10k+ parts

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764

$7.085

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One Stop Electronics

USA . 1,084 parts In-Stock

1+ parts

$35.000

100+ parts

-

1k+ parts

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1,084

$35.000

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Parana Technologies

USA . 1,125 parts In-Stock

1+ parts

$51.251

100+ parts

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1,125

$51.251

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DigiPath Technology Company

USA . 324 parts In-Stock

1+ parts

$56.433

100+ parts

$51.919

1k+ parts

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10k+ parts

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324

$56.433

$51.919

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ChromeModa Solutions

Germany . 4,946 parts In-Stock

1+ parts

$57.585

100+ parts

$47.220

1k+ parts

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10k+ parts

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4,946

$57.585

$47.220

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IDEA Electronic Components Group

UK . 1,550 parts In-Stock

1+ parts

$57.585

100+ parts

$54.706

1k+ parts

$51.826

10k+ parts

-

1,550

$57.585

$54.706

$51.826

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Corphita

USA . 2,859 parts In-Stock

1+ parts

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2,859

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Overview

Discover the XF280049MPZS by Texas Instruments, a cutting-edge microcontroller designed to deliver top-notch performance and reliability. With a wide range of applications in automotive and industrial settings, this product offers customers unparalleled value and benefits. Texas Instruments, known for its superior quality and innovation, has crafted this microcontroller with precision and excellence in mind. Experience the advantages of advanced peripherals, high-speed connectivity options, and efficient power management, making the XF280049MPZS a must-have for your next project. Trust in Texas Instruments to provide you with the tools you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This package body material provides durability and protection to the microcontroller, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, enhancing the overall production process.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage allows for flexibility in power input, accommodating various voltage requirements.

Package Shape: SQUARE

The square package shape helps in efficient space utilization on the PCB, making it ideal for compact designs.

Bit Size: 32

The 32-bit architecture provides high computational power and performance for demanding applications.

DAC Channels: YES

The presence of DAC channels allows for analog output generation, enabling the microcontroller to interface with external analog devices.

No. of Terminals: 100

With a large number of terminals, this microcontroller can support a wide range of connectivity options and peripheral interfaces.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures efficient power consumption and compatibility with low-power applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature range ensures reliability and performance in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The wide minimum operating temperature range allows for operation in extreme cold environments, making it versatile for various applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to convert analog signals into digital data for processing.

DMA Channels: YES

DMA channels allow for efficient data transfer between peripherals and memory, improving overall system performance.

Terminal Position: QUAD

The quad terminal position offers versatility in PCB layout and connectivity options, enhancing design flexibility.

ROM Words: 131072

The large ROM size provides ample storage for program code and data, accommodating complex algorithms and applications.

Maximum Seated Height: 1.6 mm

The low profile design with a maximum seated height of 1.6 mm enables compact and slim device designs.

Width: 14 mm

The compact width size allows for space-efficient PCB layout and integration in small form factor applications.

Peripherals: BOR, DMA(6), PWM(16), TEMPERATURE SENSOR, TIMER(3), WDT(2)

A wide range of peripherals including brown-out reset, DMA, PWM, temperature sensor, timers, and watchdog timer enhance the microcontroller's functionality and versatility.

Maximum Clock Frequency: 20 MHz

The high maximum clock frequency of 20 MHz enables fast and efficient processing of instructions, enhancing overall system performance.

Maximum Time At Peak Reflow Temperature (s): 30

The specified time at peak reflow temperature ensures proper soldering of the microcontroller during manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C indicates superior soldering reliability and durability of the microcontroller.

Length: 14 mm

The compact length size facilitates space-saving PCB designs, particularly in applications with size constraints.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures reliable operation in automotive applications, where temperature variations are common.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers simplified instruction set and high performance for computing-intensive tasks.

RAM Bytes: 51200

The large RAM size of 51200 bytes enables efficient data storage and manipulation, supporting complex algorithms and multitasking.

Technology: CMOS

The CMOS technology offers low power consumption, high speed, and reliability, making it suitable for battery-operated devices and power-sensitive applications.

Terminal Form: GULL WING

The gull wing terminal form provides ease of soldering during assembly, ensuring reliable electrical connections.

Analog To Digital Convertors: 21-Ch 12-Bit

With 21 ADC channels of 12-bit resolution, the microcontroller can accurately convert analog signals into digital data for precise measurement and control.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2 V ensures compatibility with standard power sources and efficient power utilization.

PWM Channels: YES

The presence of PWM channels allows for precise control of analog output signals, making the microcontroller suitable for motor control and power management applications.

Connectivity: CAN(2), I2C, LIN, SCI(2), SPI(2)

A variety of connectivity options including CAN, I2C, LIN, SCI, and SPI interfaces enable seamless communication with external devices and peripherals.

ROM Programmability: FLASH

The flash programmable ROM allows for easy and fast updates of firmware and software, facilitating product customization and maintenance.

Terminal Pitch: 0.5 mm

The fine pitch terminal spacing of 0.5 mm enables high-density integration on the PCB, optimizing space usage and enhancing design compactness.

Moisture Sensitivity Level (MSL): 3

The MSL level of 3 indicates that the microcontroller is suitable for reflow soldering processes with a peak temperature of 260°C, ensuring reliable solder joints.

Speed: 100 rpm

The specified speed of 100 rpm indicates the maximum rotational speed of the microcontroller, which is important for motor control and speed-sensitive applications.

On Chip Program ROM Width: 16

The on-chip program ROM width of 16 bits allows for efficient storage and retrieval of program instructions, contributing to overall system performance.

No. of I/O Lines: 40

A total of 40 I/O lines provide ample connectivity options for interfacing with external devices and peripherals, enhancing the microcontroller's versatility.

Technical Specifications

Microcontrollers XF280049MPZS attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

20 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

40

No. of Terminals:

100

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

51200

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

100 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C, LIN, SCI(2), SPI(2)

Peripherals:

BOR, DMA(6), PWM(16), TEMPERATURE SENSOR, TIMER(3), WDT(2)

Analog To Digital Convertors:

21-Ch 12-Bit

Trade Compliance

XF280049MPZS Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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