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XF2800157SPN

Texas Instruments

XF2800157SPN by Texas Instruments

Texas Instruments XF2800157SPN microcontroller features 32-bit architecture, 131072 ROM words, and 36864 RAM bytes. With 21-Ch 12-Bit ADCs, it's ideal for applications requiring CAN, I2C, LIN connectivity and low power mode at a max clock frequency of 25 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,785 parts In-Stock

1+ parts

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9,785

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Digiode

USA . 2,825 parts In-Stock

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2,825

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Distributors (Availability)

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Semicontronic

India . 1,276 parts In-Stock

1+ parts

$11.000

100+ parts

$10.725

1k+ parts

$10.670

10k+ parts

-

1,276

$11.000

$10.725

$10.670

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AZTECH Wire

Italy . 534 parts In-Stock

1+ parts

$15.504

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534

$15.504

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One Stop Electronics

USA . 1,587 parts In-Stock

1+ parts

$32.000

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1,587

$32.000

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Ampacity Inc.

Singapore . 333 parts In-Stock

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$32.000

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333

$32.000

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Corphita

USA . 1,050 parts In-Stock

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1,050

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Corohmni

South Africa . 463 parts In-Stock

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463

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Overview

Unleash the power of cutting-edge technology with the XF2800157SPN by Texas Instruments. Designed with precision and expertise, this microcontroller offers unparalleled performance for a wide range of applications. From automotive to industrial automation, this product delivers seamless functionality and reliability. With advanced features like multiple DAC and ADC channels, boundary scan capabilities, and low power mode, customers can trust in the quality and value that Texas Instruments provides. Upgrade your projects today with the XF2800157SPN and experience the difference that superior technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Surface mount capability allows for easy integration into compact PCB designs, saving space and facilitating assembly.

Maximum Supply Voltage: 1.32 V

A higher maximum supply voltage allows for compatibility with a wider range of power sources, increasing versatility.

On Chip Data RAM Width: 8

8-bit data RAM width provides sufficient memory storage for processing tasks, enhancing performance.

Package Shape: SQUARE

Square package shape simplifies layout and placement on the PCB, optimizing use of available space.

Bit Size: 32

32-bit architecture enables the microcontroller to handle complex computations and data processing efficiently.

DAC Channels: YES

DAC channels allow for analog signal generation, which is essential for many control and communication applications.

No. of Terminals: 80

Having 80 terminals provides ample connectivity options for peripherals, sensors, and interfaces, making the microcontroller versatile.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile, and fine pitch package style offers a compact form factor and ease of installation on PCBs.

Minimum Supply Voltage: 1.14 V

A low minimum supply voltage allows the microcontroller to operate efficiently even with lower power sources, improving energy efficiency.

Maximum Operating Temperature: 125 °C

High maximum operating temperature tolerance ensures reliable performance in various environmental conditions, enhancing durability.

Technical Specifications

Microcontrollers XF2800157SPN attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

F2800157

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

NO

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

Length:

12 mm

Low Power Mode:

YES

No. of External Interrupts:

5

No. of I/O Lines:

52

No. of Serial I/Os:

5

No. of Terminals:

80

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

36864

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

120 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Peripheral IC Type:

Connectivity:

CAN(2), I2C(2), LIN, SCI(3), SPI

Peripherals:

BOR, CAP(2), COMPARATOR(4), POR, PWM(14), RTC, TIMER(3), WDT(2)

Analog To Digital Convertors:

21-Ch 12-Bit

Digital To Analog Convertors:

2 Ch 12-Bit

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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