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XF2800137PM

Texas Instruments

XF2800137PM by Texas Instruments

Texas Instruments XF2800137PM microcontroller features 32-bit architecture, 131072 ROM words, and 36864 RAM bytes. With a max clock frequency of 25 MHz, it is ideal for applications requiring low power mode and connectivity options like CAN, I2C, SCI, and SPI. The device also offers 21-Ch 12-Bit ADC channels for precise analog to digital conversion.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,875 parts In-Stock

1+ parts

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7,875

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Digiode

USA . 155 parts In-Stock

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155

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,244 parts In-Stock

1+ parts

$3.000

100+ parts

$2.925

1k+ parts

$2.910

10k+ parts

-

1,244

$3.000

$2.925

$2.910

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One Stop Electronics

USA . 1,049 parts In-Stock

1+ parts

$4.000

100+ parts

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1,049

$4.000

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Ampacity Inc.

Singapore . 772 parts In-Stock

1+ parts

$6.000

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772

$6.000

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AZTECH Wire

Italy . 334 parts In-Stock

1+ parts

$12.205

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334

$12.205

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Corphita

USA . 4,046 parts In-Stock

1+ parts

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4,046

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Corohmni

South Africa . 263 parts In-Stock

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263

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Overview

Unlock the potential of your projects with the XF2800137PM microcontroller by Texas Instruments. With a reputation for manufacturing high-quality products, Texas Instruments delivers reliable solutions for a variety of applications. This microcontroller offers unparalleled value with its advanced features and performance capabilities. Experience the benefits of enhanced connectivity, low power mode, and versatile peripherals, providing you with the flexibility to bring your ideas to life. Trust in Texas Instruments to provide you with the tools you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller suitable for various applications without adding extra weight.

Surface Mount: YES

Ease of installation and space-saving design, making it suitable for compact electronic devices.

Maximum Supply Voltage: 1.32 V

Efficient power management and reduced risk of damage from voltage spikes.

On Chip Data RAM Width: 8

Enhanced data processing capabilities and improved performance for applications that require quick access to data.

Package Shape: SQUARE

Uniform layout and easy integration into circuit designs, optimizing space usage.

Bit Size: 32

Higher processing power and ability to handle complex calculations, making the microcontroller suitable for demanding tasks.

No. of Terminals: 64

Sufficient connectivity options for interfacing with other components and peripherals, enhancing the versatility of the microcontroller.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Compact design for space-constrained applications and efficient heat dissipation.

Minimum Supply Voltage: 1.14 V

Operational flexibility with a wide range of supply voltage support for different power supply configurations.

Maximum Operating Temperature: 125 °C

Reliable performance in high-temperature environments without the risk of overheating or malfunctioning.

CPU Family: TMS320

Well-established CPU family known for its high performance and reliability, ensuring efficient operation of the microcontroller.

No. of External Interrupts: 5

Ability to respond to external events promptly, improving real-time processing capabilities for time-sensitive applications.

Minimum Operating Temperature: -40 °C

Wide temperature range support for operation in extreme cold conditions, making the microcontroller suitable for various environments.

ADC Channels: YES

Analog-to-digital conversion capabilities for interfacing with analog sensors and signals, expanding the range of applications for the microcontroller.

Terminal Position: QUAD

Efficient layout for improved connectivity and ease of external component integration, enhancing the overall functionality.

ROM Words: 131072

Large memory capacity for storing program instructions and data, enabling complex applications and multitasking capabilities.

Maximum Seated Height: 1.6 mm

Low-profile design for space-constrained applications and compact electronic devices.

Width: 10 mm

Compact form factor for easy integration into various electronic designs without occupying excessive space.

Boundary Scan: YES

Built-in testing capability for ensuring the integrity of connections and identifying faults during manufacturing or operation.

Peripherals: BOR, COMPARATOR(4), CAP(2), POR, PWM(14), QEP, TIMER(3), WDT(2)

Diverse set of peripherals for enhanced functionality and connectivity options, enabling a wide range of applications.

Maximum Clock Frequency: 25 MHz

High clock frequency for speedy processing and real-time operation, suitable for applications requiring quick response times.

Length: 10 mm

Compact design for space-efficient integration into electronic devices and circuit layouts.

Peripheral IC Type: MICROCONTROLLER, RISC

Efficient RISC architecture for fast and reliable processing, suitable for high-performance applications.

No. of Timers: 3

Multiple timers for precise timing control and event scheduling, enhancing the microcontroller's capabilities in time-sensitive applications.

RAM Bytes: 36864

Sufficient random access memory for storing temporary data and variables, enabling efficient data processing and multitasking.

Technology: CMOS

Low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Terminal Form: GULL WING

Secure and reliable terminal design for robust connections and ease of soldering during assembly.

Analog To Digital Convertors: 21-Ch 12-Bit

Multiple analog-to-digital converters for accurate and high-resolution signal conversion, suitable for precise sensor data acquisition.

Maximum Supply Current: 50 mA

Efficient power management with low current consumption, prolonging battery life and reducing heat dissipation.

Nominal Supply Voltage: 1.2 V

Stable supply voltage for consistent and reliable operation, ensuring the microcontroller's performance under various operating conditions.

No. of Serial I/Os: 4

Serial communication interfaces for data exchange with external devices, expanding connectivity options for the microcontroller.

PWM Channels: YES

Pulse width modulation capabilities for precise control of analog signals and motor speed, suitable for applications requiring accurate voltage regulation.

Connectivity: CAN, I2C(2), SCI(3), SPI

Versatile connectivity options for interfacing with different communication protocols and external devices, enhancing the microcontroller's compatibility.

ROM Programmability: FLASH

Reprogrammable flash memory for easy firmware updates and flexibility in modifying program instructions without replacing the chip.

Terminal Pitch: 0.5 mm

Fine pitch for precise and secure connections, suitable for high-density circuit designs and miniaturized electronic devices.

Format: FLOATING POINT

Support for floating-point calculations for handling complex mathematical operations and algorithms, making the microcontroller suitable for scientific and engineering applications.

Speed: 120 rpm

High speed capabilities for controlling motors and mechanical systems, suitable for applications requiring precise speed regulation.

Low Power Mode: YES

Power-saving mode for reducing energy consumption during idle or low-activity periods, extending battery life and enhancing energy efficiency.

On Chip Program ROM Width: 16

Wider program ROM width for storing more instructions and data within the chip, enabling complex applications and multitasking.

No. of I/O Lines: 38

Sufficient input/output lines for connecting to external devices and peripherals, enhancing the microcontroller's versatility and connectivity options.

Technical Specifications

Microcontrollers XF2800137PM attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TMS320

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Low Power Mode:

YES

No. of External Interrupts:

5

No. of I/O Lines:

38

No. of Serial I/Os:

4

No. of Terminals:

64

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

36864

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

120 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Connectivity:

CAN, I2C(2), SCI(3), SPI

Peripherals:

BOR, COMPARATOR(4), CAP(2), POR, PWM(14), QEP, TIMER(3), WDT(2)

Analog To Digital Convertors:

21-Ch 12-Bit

Trade Compliance

XF2800137PM Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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