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XF280025CPNS

Texas Instruments

XF280025CPNS by Texas Instruments

Texas Instruments XF280025CPNS is a 32-bit microcontroller with 16-bit address bus width, operating at up to 25 MHz. Ideal for automotive applications, it features 16-Ch ADCs, 6 DMA channels, and peripherals like PWM and timers. With low power mode and CAN/I2C/SCI connectivity, it's suitable for various automotive control systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,822 parts In-Stock

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3,822

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Digiode

USA . 2,834 parts In-Stock

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2,834

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Distributors (Availability)

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AZTECH Wire

Italy . 319 parts In-Stock

1+ parts

$17.006

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319

$17.006

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One Stop Electronics

USA . 652 parts In-Stock

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$34.000

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652

$34.000

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Parana Technologies

USA . 1,181 parts In-Stock

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$75.614

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$75.614

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IDEA Electronic Components Group

UK . 2,107 parts In-Stock

1+ parts

$84.959

100+ parts

$80.711

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$76.463

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2,107

$84.959

$80.711

$76.463

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ChromeModa Solutions

Germany . 1,304 parts In-Stock

1+ parts

$84.959

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$69.666

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1,304

$84.959

$69.666

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DigiPath Technology Company

USA . 2,279 parts In-Stock

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$76.599

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2,279

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$76.599

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Corphita

USA . 1,414 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the XF280025CPNS by Texas Instruments, a premium microcontroller designed to elevate your projects to new heights. With a focus on quality and reliability, Texas Instruments delivers unmatched performance in the automotive industry with this product. From CAN connectivity to low power modes, this microcontroller offers a wide range of features that cater to various applications, ensuring you get the best value for your investment. Upgrade your designs with the XF280025CPNS and experience the difference Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and reliability for the microcontroller, making it a good choice for long-term usage.

Maximum Supply Voltage: 3.63 V

With a maximum supply voltage of 3.63V, this microcontroller can handle a wide range of power inputs, adding versatility to its applications.

ADC Channels: YES

Having ADC channels enables the microcontroller to convert analog signals into digital data, allowing for accurate and precise measurements in various applications.

RAM Bytes: 24576

With a large RAM size of 24576 bytes, this microcontroller can efficiently handle and process a significant amount of data, making it suitable for complex tasks.

Connectivity: CAN, FSI, I2C(2), LIN(2), PMBUS, SCI, SPI(2)

Multiple connectivity options such as CAN, I2C, SPI, and more enhance the communication capabilities of the microcontroller, enabling it to interact with a wide range of external devices and systems.

Technical Specifications

Microcontrollers XF280025CPNS attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TMS320

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

Length:

12 mm

Low Power Mode:

YES

No. of DMA Channels:

6

No. of External Interrupts:

5

No. of I/O Lines:

39

No. of Terminals:

80

No. of Timers:

3

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

24576

ROM Words:

131072

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

100 rpm

Maximum Supply Current:

65 mA

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Peripheral IC Type:

Connectivity:

CAN, FSI, I2C(2), LIN(2), PMBUS, SCI, SPI(2)

Peripherals:

COMPARATOR(4), DMA(6), PWM(14), QEP(2), TIMER(3), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

XF280025CPNS Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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