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XF28M35H52C1RFPT

Texas Instruments

XF28M35H52C1RFPT by Texas Instruments

Texas Instruments XF28M35H52C1RFPT is a 32-bit microcontroller with 144 terminals, operating at -40 to 105 °C. Features include DAC and ADC channels, PWM support, and ROM programmability for industrial applications requiring a max clock frequency of 20 MHz.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 1,460 parts In-Stock

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Digiode

USA . 567 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Speed Components Ltd

Israel . 1 parts In-Stock

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AZTECH Wire

Italy . 690 parts In-Stock

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$8.165

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690

$8.165

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Ampacity Inc.

Singapore . 1,460 parts In-Stock

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$12.000

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One Stop Electronics

USA . 893 parts In-Stock

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$19.000

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Corohmni

South Africa . 730 parts In-Stock

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$21.743

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Semicontronic

India . 1,133 parts In-Stock

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$27.000

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$26.325

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$26.190

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Parana Technologies

USA . 1,789 parts In-Stock

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$52.201

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DigiPath Technology Company

USA . 1,726 parts In-Stock

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$57.480

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$52.882

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ChromeModa Solutions

Germany . 1,875 parts In-Stock

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$58.653

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$48.095

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IDEA Electronic Components Group

UK . 561 parts In-Stock

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$55.720

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$52.788

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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Continental Prestige Electronics

USA . 4,658 parts In-Stock

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Argo Parts USA

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Corphita

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Microchip USA

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Bastille Electronics

Australia . 92 parts In-Stock

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Overview

Unlock endless possibilities with the XF28M35H52C1RFPT microcontroller by Texas Instruments. Known for their commitment to quality and innovation, Texas Instruments delivers cutting-edge technology that redefines the limits of what is possible. This versatile microcontroller is ideal for a wide range of applications, offering unmatched performance and reliability. Experience the value of seamless integration, high-speed processing, and superior functionality with the XF28M35H52C1RFPT. Elevate your projects to new heights with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is durable and provides good protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and convenient installation onto circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 1.26 V

The microcontroller can operate efficiently within a safe voltage range, ensuring reliable performance.

Bit Size: 32

A 32-bit architecture allows for faster processing and more memory space, making the microcontroller suitable for complex applications.

DAC Channels: YES

Digital-to-analog converter channels enable the microcontroller to interface with analog devices, expanding its compatibility and functionality.

No. of Terminals: 144

Having a high number of terminals provides flexibility in connecting external components and peripherals to the microcontroller.

Minimum Operating Temperature: -40 °C

The microcontroller can operate in extreme cold conditions, making it suitable for a wide range of environments.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, the microcontroller can withstand heat stress and operate reliably in demanding conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances the microcontroller's speed and efficiency, making it ideal for real-time processing applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to the energy efficiency and reliability of the microcontroller.

Technical Specifications

Microcontrollers XF28M35H52C1RFPT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

SUPPLY VOLTAGE ALSO OPERATES AT 1.8 V, 3.3 V I/O

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

20 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

74

No. of Terminals:

144

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

100 rpm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

XF28M35H52C1RFPT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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