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XF2800137RGZ

Texas Instruments

XF2800137RGZ by Texas Instruments

Texas Instruments XF2800137RGZ microcontroller features 32-bit architecture, 131072 ROM words, and 17-Ch 12-Bit ADC channels. Ideal for applications requiring low power consumption, it supports various peripherals like BOR, PWM(14), and CAN connectivity. Operating temperature ranges from -40 to 125 °C with a clock frequency of up to 25 MHz.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,514 parts In-Stock

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Digiode

USA . 4,747 parts In-Stock

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4,747

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Distributors (Availability)

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AZTECH Wire

Italy . 252 parts In-Stock

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$7.002

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$7.002

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Semicontronic

India . 1,493 parts In-Stock

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$8.000

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$7.800

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$7.760

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One Stop Electronics

USA . 1,364 parts In-Stock

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$9.000

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$9.000

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Ampacity Inc.

Singapore . 332 parts In-Stock

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$12.000

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Corphita

USA . 1,927 parts In-Stock

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Corohmni

South Africa . 258 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the XF2800137RGZ by Texas Instruments. As a leader in microcontroller manufacturing, Texas Instruments delivers unmatched quality and reliability. This versatile microcontroller is perfect for a wide range of applications, offering customers exceptional value and performance. With advanced features and a user-friendly design, the XF2800137RGZ provides the perfect solution for all your project needs. Experience the difference today and take your projects to the next level with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the microcontroller, ensuring longevity and reliability.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and enabling efficient assembly.

Maximum Supply Voltage: 1.32 V

High maximum supply voltage provides flexibility in power input options for various applications.

On Chip Data RAM Width: 8

Wide on-chip data RAM width allows for efficient data processing and storage within the microcontroller.

Package Shape: SQUARE

Square package shape enables easy mounting and placement on circuit boards, optimizing space utilization.

Bit Size: 32

32-bit architecture allows for high-performance computing and processing capabilities.

No. of Terminals: 48

Abundance of terminals provides ample connectivity options for interfacing with other components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Various package styles offer versatility in design and installation options, catering to different project requirements.

Minimum Supply Voltage: 1.14 V

Low minimum supply voltage allows for efficient power utilization and operation in low-power settings.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance even in demanding environmental conditions.

CPU Family: TMS320

Part of the TMS320 CPU family known for its robust and efficient processing capabilities, ideal for various applications.

No. of External Interrupts: 5

Multiple external interrupts enable the microcontroller to respond swiftly to external events and triggers.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for reliable performance in cold environments or during temperature fluctuations.

ADC Channels: YES

Built-in ADC channels facilitate analog-to-digital conversion, essential for interfacing with analog sensors and signals.

Terminal Position: QUAD

Quad terminal position offers secure connectivity and efficient layout for peripheral connections.

ROM Words: 131072

Large ROM capacity enables storing a significant amount of program data or instructions for execution.

Maximum Seated Height: 1 mm

Low maximum seated height allows for compact design and easy integration in space-constrained applications.

Width: 7 mm

Narrow width facilitates installation and placement flexibility in circuit board layouts and designs.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging processes during the manufacturing and development stages.

Peripherals: BOR, COMPARATOR(4), CAP(2), POR, PWM(14), QEP, TIMER(3), WDT(2)

Abundance of peripherals offers extensive functionality, catering to diverse application requirements and enhancing overall performance.

Maximum Clock Frequency: 25 MHz

High maximum clock frequency supports fast data processing and execution speed, suitable for time-sensitive applications.

Length: 7 mm

Compact length allows for space-efficient placement and integration in various electronic devices and systems.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in a microcontroller provides efficient data processing and execution, enhancing overall system performance.

No. of Timers: 3

Multiple timers offer precise timekeeping and scheduling capabilities, important for a wide range of applications.

RAM Bytes: 36864

Generous RAM capacity enables efficient data storage and retrieval during operation, supporting complex algorithms and processes.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, optimizing energy efficiency and reliability.

Terminal Form: NO LEAD

No-lead terminal form enhances durability and reliability of connectivity, ensuring secure connections for long-term operation.

Analog To Digital Convertors: 17-Ch 12-Bit

Multiple ADC channels with high resolution provide accurate analog signal conversion, crucial for precise sensor interfacing and data acquisition.

Maximum Supply Current: 50 mA

Low maximum supply current ensures efficient power usage and minimal heat generation, contributing to overall system reliability.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage ensures consistent and reliable operation of the microcontroller under varying load conditions.

No. of Serial I/Os: 4

Multiple serial I/O ports facilitate communication with a variety of external devices and peripherals, enhancing connectivity options.

PWM Channels: YES

PWM channels enable precise control of output signals, crucial for applications requiring variable voltage or frequency modulation.

Connectivity: CAN, I2C(2), SCI(3), SPI

Versatile connectivity options support seamless integration with a wide range of communication protocols and devices, enhancing interoperability.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates and modifications, ensuring adaptability and scalability of the microcontroller.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables compact design and layout, accommodating high-density circuit board configurations.

Format: FLOATING POINT

Floating-point format supports efficient computation and processing of real numbers, essential for a variety of scientific and engineering applications.

Speed: 120 rpm

High speed capability enables rapid data processing and execution, suitable for time-critical applications and tasks.

Low Power Mode: YES

Low power mode functionality allows for energy-efficient operation and extended battery life, ideal for portable and battery-powered devices.

On Chip Program ROM Width: 16

Wide on-chip program ROM width accommodates a diverse range of program instructions and data, enabling versatile functionality and performance.

No. of I/O Lines: 28

Abundance of I/O lines provides ample connectivity options for interfacing with external devices and peripherals, enhancing versatility and functionality.

Technical Specifications

Microcontrollers XF2800137RGZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TMS320

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N48

Length:

7 mm

Low Power Mode:

YES

No. of External Interrupts:

5

No. of I/O Lines:

28

No. of Serial I/Os:

4

No. of Terminals:

48

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

36864

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

120 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Connectivity:

CAN, I2C(2), SCI(3), SPI

Peripherals:

BOR, COMPARATOR(4), CAP(2), POR, PWM(14), QEP, TIMER(3), WDT(2)

Analog To Digital Convertors:

17-Ch 12-Bit

Trade Compliance

XF2800137RGZ Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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