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XF28388DZWTS

Texas Instruments

XF28388DZWTS by Texas Instruments

XF28388DZWTS by Texas Instruments is a 32-bit microcontroller with a max clock frequency of 100 MHz. It features 3-channel 12-bit DACs and 24-channel 16-bit ADCs, making it suitable for applications requiring precise analog-to-digital conversion. With its wide range of connectivity options including CAN, I2C, SCI, SPI, SSI, UART, and USB, it offers versatile communication capabilities.

Median Price

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3

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1k+

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Vyrian

USA . 8,822 parts In-Stock

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Digiode

USA . 3,603 parts In-Stock

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Nova Conductors

Japan . 650 parts In-Stock

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650

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Semicontronic

India . 1,232 parts In-Stock

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$11.000

100+ parts

$10.725

1k+ parts

$10.670

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1,232

$11.000

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$10.670

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AZTECH Wire

Italy . 563 parts In-Stock

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$13.180

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563

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Ampacity Inc.

Singapore . 374 parts In-Stock

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$20.000

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374

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Parana Technologies

USA . 1,844 parts In-Stock

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$20.176

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$20.132

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$20.176

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DigiPath Technology Company

USA . 596 parts In-Stock

1+ parts

$22.217

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$20.439

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596

$22.217

$20.439

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ChromeModa Solutions

Germany . 5,449 parts In-Stock

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$22.670

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$18.589

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$22.670

$18.589

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IDEA Electronic Components Group

UK . 1,199 parts In-Stock

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$22.670

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$21.536

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$20.403

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$22.670

$21.536

$20.403

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$29.597

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$28.117

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$28.117

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$29.597

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Corohmni

South Africa . 515 parts In-Stock

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$31.377

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515

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One Stop Electronics

USA . 777 parts In-Stock

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$35.000

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Argo Parts USA

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Continental Prestige Electronics

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Corphita

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A-Z Elektronik GmbH

Germany . 1,257 parts In-Stock

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Modulus Dynamics

Lithuania . 900 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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Robosynatics

Brazil . 10 parts In-Stock

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Lucentia Tech

USA . 10 parts In-Stock

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$1.501

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$1.501

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$1.501

10

-

$1.501

$1.501

$1.501

Overview

Experience the power of the XF28388DZWTS by Texas Instruments, the ultimate microcontroller for all your electronic needs. Built with the highest quality materials and expertise from Texas Instruments, this product offers unparalleled performance and reliability. With its wide range of applications, from automotive to industrial, the XF28388DZWTS is the perfect choice for any project. Enjoy the benefits of its advanced features, including multiple ADC and DAC channels, DMA capabilities, and a vast array of peripherals. Trust in Texas Instruments and unlock the true potential of your designs with the XF28388DZWTS.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - The use of plastic/epoxy material in the package body makes this microcontroller durable and lightweight, making it a good choice for various applications.

Surface Mount:

YES - With surface mount technology, this microcontroller provides easy and efficient installation, making it suitable for PCB designs and compact devices.

Maximum Supply Voltage:

1.26 V - The higher maximum supply voltage allows the microcontroller to handle a wider range of power inputs, making it versatile for different power supply options.

Address Bus Width:

13 - The larger address bus width of 13 enables this microcontroller to access a larger memory space, allowing for complex tasks and extensive data storage capabilities.

Package Shape:

SQUARE - The square package shape provides a compact form factor, making it easier to integrate into space-constrained designs, making it a practical choice for small-scale applications.

Bit Size:

32 - With a bit size of 32, this microcontroller offers a higher processing power and can handle more complex calculations, making it suitable for demanding applications.

DAC Channels:

YES - The presence of DAC (Digital-to-Analog Converters) channels allows this microcontroller to generate analog output signals, making it ideal for applications requiring precise control of analog devices.

No. of Terminals:

337 - The larger number of terminals ensures sufficient connectivity options for peripheral devices and components, providing flexibility and expansion possibilities.

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH - This package style offers a grid array configuration with low profile and fine pitch, enabling higher density integration and ensuring efficient use of space on the board.

Minimum Supply Voltage:

1.14 V - The lower minimum supply voltage allows for energy-efficient operations and expands the range of battery-powered applications that can benefit from this microcontroller.

Maximum Operating Temperature:

125 °C - The higher maximum operating temperature ensures reliable performance in extreme temperature environments, making it suitable for industrial and automotive applications.

Minimum Operating Temperature:

40 °C - The lower minimum operating temperature allows for reliable performance in cold environments, making it suitable for outdoor and low-temperature applications.

Terminal Finish:

TIN SILVER COPPER - The terminal finish of tin silver copper offers better conductivity, corrosion resistance, and solderability, ensuring reliable connections and long-term durability of the microcontroller.

ADC Channels:

YES - The availability of ADC (Analog-to-Digital Converters) channels allows this microcontroller to convert analog signals into digital data, making it suitable for applications requiring precise analog signal measurements.

DMA Channels:

YES - The presence of DMA (Direct Memory Access) channels allows this microcontroller to efficiently transfer data between peripherals and memory, reducing CPU overhead and enhancing performance for data-intensive operations.

Terminal Position:

BOTTOM - The terminal position at the bottom of the microcontroller simplifies PCB layout design and enables easy integration into various systems and devices.

ROM Words:

1572864 - With a large ROM (Read-Only Memory) capacity of 1572864 words, this microcontroller can store a significant amount of program instructions, data, and constants, allowing for complex firmware and application implementations.

Maximum Seated Height:

1.4 mm - The low maximum seated height ensures a slim profile when the microcontroller is mounted on the PCB, making it suitable for applications with height restrictions or compact designs.

Digital To Analog Convertors:

3-Ch 12-Bit - The presence of three 12-bit digital-to-analog converters allows for precise and accurate generation of analog output signals, making this microcontroller suitable for applications requiring high-resolution analog outputs.

Width:

16 mm - The compact width of 16 mm allows for easy integration and space-saving designs, making it suitable for applications with size constraints or where compactness is desired.

External Data Bus Width:

32 - With a 32-bit external data bus width, this microcontroller can efficiently transfer large chunks of data, enhancing overall system performance and supporting data-intensive applications.

Peripherals:

DMA(44), PWM(32), TEMPERATURE SENSOR, TIMER(9), WDT(5) - The availability of a wide range of peripherals such as DMA, PWM, Temperature Sensor, Timer, and WDT (Watchdog Timer) expands the capabilities and flexibility of this microcontroller, making it suitable for diverse application requirements.

Maximum Clock Frequency:

100 MHz - With a high maximum clock frequency of 100 MHz, this microcontroller offers fast execution speed, enabling efficient processing of data and real-time operations in demanding applications.

Maximum Time At Peak Reflow Temperature (s):

30 - The microcontroller can withstand the peak reflow temperature of 260°C for up to 30 seconds, ensuring reliable soldering during the manufacturing process.

Peak Reflow Temperature °C:

260 - The high peak reflow temperature of 260°C allows for effective soldering during the assembly process, ensuring strong and reliable connections between the microcontroller and the PCB.

Length:

16 mm - The compact length of 16 mm makes this microcontroller suitable for space-constrained designs, enabling integration into small form factor devices or applications with limited physical space.

Temperature Grade:

AUTOMOTIVE - With an automotive temperature grade, this microcontroller is designed to operate reliably in automotive applications, meeting the stringent temperature and reliability requirements of the automotive industry.

Peripheral IC Type:

MICROCONTROLLER, RISC - This microcontroller belongs to the RISC (Reduced Instruction Set Computer) architecture, providing efficient instruction execution and making it suitable for applications requiring high-speed processing and low power consumption.

RAM Bytes:

346112 - With a large RAM (Random Access Memory) capacity of 346112 bytes, this microcontroller can easily store and access data during runtime, providing ample workspace for complex data manipulation and processing.

Technology:

CMOS - The use of CMOS (Complementary Metal-Oxide-Semiconductor) technology in this microcontroller offers low power consumption, high noise immunity, and excellent performance, making it an optimal choice for battery-powered and noise-sensitive applications.

Terminal Form:

BALL - The terminal form of ball provides reliable contact and allows for high-density interconnection, making it suitable for various applications and enhancing the overall robustness of the microcontroller.

Analog To Digital Convertors:

24-Ch 16-Bit - The presence of twenty-four 16-bit analog-to-digital converters enables this microcontroller to accurately convert analog signals into digital data, making it ideal for applications requiring high-precision analog measurements.

Nominal Supply Voltage:

1.2 V - The nominal supply voltage of 1.2 V offers compatibility with low-power systems and contributes to energy-efficient operations, making it suitable for applications demanding power optimization.

No. of DMA Channels:

44 - The availability of 44 DMA (Direct Memory Access) channels allows for efficient data transfer between peripherals and memory, reducing CPU load and enhancing system performance for data-intensive tasks.

PWM Channels:

YES - With PWM (Pulse-Width Modulation) channels, this microcontroller can generate precise and adjustable pulse signals, making it suitable for controlling motors, lighting systems, and other applications requiring precise timing control.

Connectivity:

CAN(3), I2C(3), SCI(4), SPI(4), SSI, UART, USB - The microcontroller offers a wide range of connectivity options, including CAN, I2C, SCI, SPI, SSI, UART, and USB, enabling seamless integration with various communication protocols and facilitating data exchange between different devices and systems.

ROM Programmability:

FLASH - The programmability of the ROM (Read-Only Memory) using FLASH technology allows for easy firmware updates and flexibility in adapting to changing application requirements, making it a suitable choice for dynamic and evolving systems.

Terminal Pitch:

0.8 mm - The compact terminal pitch of 0.8 mm allows for high-density component placement and contributes to space-saving designs, making it suitable for applications requiring miniaturization or high interconnect density.

Moisture Sensitivity Level (MSL):

3 - With a moisture sensitivity level of 3, this microcontroller can withstand standard moisture exposure during the manufacturing process, ensuring reliable performance and avoiding long-term damage.

Speed:

200 rpm - The speed of 200 revolutions per minute provides an indication of the maximum operational speed or rotation rate that can be achieved with this microcontroller, making it suitable for applications requiring precise rotational control or speed regulation.

On Chip Program ROM Width:

8 - The on-chip program ROM width of 8 allows for efficient storage and retrieval of program instructions, contributing to quick and responsive execution of code, and making it suitable for time-sensitive applications.

No. of I/O Lines:

169 - The abundant number of I/O (Input/Output) lines provides sufficient connectivity options for external devices and peripherals, allowing for versatile and expandable system configurations.

Technical Specifications

Microcontrollers XF28388DZWTS attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

13

Bit Size:

32

Maximum Clock Frequency:

100 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

44

No. of I/O Lines:

169

No. of Terminals:

337

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

346112

ROM Words:

1572864

ROM Programmability:

FLASH

Maximum Seated Height:

1.4 mm

Speed:

200 rpm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(3), I2C(3), SCI(4), SPI(4), SSI, UART, USB

Peripherals:

DMA(44), PWM(32), TEMPERATURE SENSOR, TIMER(9), WDT(5)

Analog To Digital Convertors:

24-Ch 16-Bit

Digital To Analog Convertors:

3-Ch 12-Bit

Trade Compliance

XF28388DZWTS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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