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XF28M36P63C2ZWTT

Texas Instruments

XF28M36P63C2ZWTT by Texas Instruments

Texas Instruments XF28M36P63C2ZWTT microcontroller features 32-bit CPU, 8-bit DAC, and 12-channel 12-bit ADC. Ideal for industrial applications with CAN, Ethernet, I2C, SSI, UART, USB connectivity and low power mode. Operating temperature range from -40 to 105°C makes it versatile for various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,609 parts In-Stock

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Digiode

USA . 1,792 parts In-Stock

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Nova Conductors

Japan . 24 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 2 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 747 parts In-Stock

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$17.678

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747

$17.678

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Parana Technologies

USA . 2,043 parts In-Stock

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$20.668

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$20.784

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$20.668

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$20.784

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DigiPath Technology Company

USA . 1,072 parts In-Stock

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$22.758

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$22.758

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ChromeModa Solutions

Germany . 3,503 parts In-Stock

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$23.222

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$19.042

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$23.222

$19.042

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IDEA Electronic Components Group

UK . 1,447 parts In-Stock

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$23.222

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$22.061

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$20.900

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$23.222

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$20.900

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Ampacity Inc.

Singapore . 971 parts In-Stock

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$31.000

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971

$31.000

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One Stop Electronics

USA . 923 parts In-Stock

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$35.000

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$35.000

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Corohmni

South Africa . 40 parts In-Stock

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$72.621

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Argo Parts USA

USA . 2,978 parts In-Stock

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Corphita

USA . 2,322 parts In-Stock

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Microchip USA

USA . 2,297 parts In-Stock

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Continental Prestige Electronics

USA . 1,010 parts In-Stock

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Bastille Electronics

Australia . 120 parts In-Stock

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Overview

Unlock unlimited possibilities with the XF28M36P63C2ZWTT microcontroller by Texas Instruments. This cutting-edge device offers unparalleled quality and reliability, backed by the trusted legacy of its manufacturer. Ideal for a wide range of applications, this microcontroller boasts impressive features like low power mode, advanced connectivity options, and a high clock frequency of 100 MHz. Experience seamless performance and innovative solutions with the XF28M36P63C2ZWTT, delivering exceptional value and unmatched benefits to customers seeking top-of-the-line technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, suitable for electronic components.

Maximum Supply Voltage: 1.32 V

Provides flexibility in power supply options.

ADC Channels: YES

Ability to convert analog signals to digital, essential for sensor interfacing.

ROM Words: 1572864

Large amount of Read-Only Memory for storing program code.

Maximum Clock Frequency: 100 MHz

High clock speed for fast processing capabilities.

Connectivity: CAN(2), ETHERNET, I2C(2), SSI(4), UART(5), USB

Multiple communication options for versatile connectivity.

Speed: 125 rpm

Efficient processing speed for various applications.

Low Power Mode: YES

Energy-efficient operation for extended battery life.

Technical Specifications

Microcontrollers XF28M36P63C2ZWTT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

100 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

28

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B289

Length:

16 mm

Low Power Mode:

YES

No. of DMA Channels:

32

No. of External Interrupts:

1

No. of I/O Lines:

136

No. of Serial I/Os:

11

No. of Terminals:

289

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA289,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

RAM Bytes:

237568

ROM Words:

1572864

ROM Programmability:

FLASH

Maximum Seated Height:

1.4 mm

Speed:

125 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

16 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), ETHERNET, I2C(2), SSI(4), UART(5), USB

Peripherals:

COMPARATOR(6), DMA(32), POR, PWM(12), TIMER(7), WDT(2)

Analog To Digital Convertors:

12-Ch 12-Bit (2)

Digital To Analog Convertors:

1-Ch 10-Bit

Trade Compliance

XF28M36P63C2ZWTT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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