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XF280025CPMS

Texas Instruments

XF280025CPMS by Texas Instruments

Texas Instruments XF280025CPMS microcontroller features 32-bit architecture, 16-bit address bus, and 3.63V max supply voltage. Ideal for automotive applications with AEC-Q100 screening level, offering 16 ADC channels and 6 DMA channels for efficient data processing at up to 25MHz clock frequency.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,869 parts In-Stock

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Vyrian

USA . 4,852 parts In-Stock

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AZTECH Wire

Italy . 254 parts In-Stock

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$16.808

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One Stop Electronics

USA . 235 parts In-Stock

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$31.000

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Parana Technologies

USA . 191 parts In-Stock

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$73.061

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DigiPath Technology Company

USA . 1,233 parts In-Stock

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$80.449

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$74.013

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ChromeModa Solutions

Germany . 4,094 parts In-Stock

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$82.091

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$67.315

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IDEA Electronic Components Group

UK . 1,145 parts In-Stock

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$82.091

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$77.986

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$73.882

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Corphita

USA . 2,582 parts In-Stock

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Perfect Parts

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Overview

Discover the cutting-edge XF280025CPMS microcontroller by Texas Instruments, setting new standards in performance and reliability. As a leader in semiconductor manufacturing, Texas Instruments ensures top-notch quality in every product. This versatile microcontroller excels in a wide range of applications, offering unparalleled value with its advanced features and robust design. From automotive to industrial automation, the XF280025CPMS delivers unmatched benefits, making it the ideal choice for your next project. Unlock limitless possibilities with Texas Instruments XF280025CPMS microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and protection for the microcontroller, making it suitable for various applications.

Maximum Clock Frequency: 25 MHz

High clock frequency allows for fast processing and response times, making the microcontroller efficient in handling tasks efficiently.

RAM Bytes: 24576

Ample RAM capacity allows for smooth and efficient data processing, enabling the microcontroller to handle complex tasks without slowdowns.

Peripheral IC Type: MICROCONTROLLER, RISC

The microcontroller being RISC-based ensures efficient and streamlined processing, optimizing performance and power consumption.

ADC Channels: YES

Having Analog to Digital Converters allows the microcontroller to interface with sensors and other analog devices, expanding its applicability in various systems.

Connectivity: CAN, FSI, I2C(2), LIN(2), PMBUS, SCI, SPI(2)

Multiple connectivity options enable the microcontroller to communicate with a wide range of devices and systems, enhancing its versatility for different applications.

Low Power Mode: YES

Low power mode capability helps in optimizing energy consumption, making the microcontroller suitable for battery-powered or energy-efficient applications.

ROM Programmability: FLASH

Flash programmability allows for easy and quick updates to the microcontroller's firmware, ensuring flexibility and adaptability to changing requirements.

Technical Specifications

Microcontrollers XF280025CPMS attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TMS320

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

6

No. of External Interrupts:

5

No. of I/O Lines:

26

No. of Terminals:

64

No. of Timers:

3

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

24576

ROM Words:

131072

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

100 rpm

Maximum Supply Current:

65 mA

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Connectivity:

CAN, FSI, I2C(2), LIN(2), PMBUS, SCI, SPI(2)

Peripherals:

COMPARATOR(4), DMA(6), PWM(14), QEP(2), TIMER(3), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

XF280025CPMS Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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