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TMX320DM6443BZWT

Texas Instruments

TMX320DM6443BZWT by Texas Instruments

TMX320DM6443BZWT by Texas Instruments is a 32-bit microprocessor with 16384 RAM words. Operating at temperatures from 0 to 85°C, it has a max supply voltage of 1.26V and supports power supplies of 1.2V, 1.8V, and 3.3V. Ideal for applications requiring a MICROPROCESSOR CIRCUIT in a SQUARE package style with PLASTIC/EPOXY material and BALL terminal form.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,354 parts In-Stock

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Digiode

USA . 3,083 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 265 parts In-Stock

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$6.251

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One Stop Electronics

USA . 200 parts In-Stock

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$15.000

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Corohmni

South Africa . 1,116 parts In-Stock

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$16.689

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Parana Technologies

USA . 1,238 parts In-Stock

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$55.899

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ChromeModa Solutions

Germany . 1,522 parts In-Stock

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$62.808

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$51.503

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IDEA Electronic Components Group

UK . 569 parts In-Stock

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$62.808

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$59.668

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$56.527

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569

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A-Z Elektronik GmbH

Germany . 6,251 parts In-Stock

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Corphita

USA . 1,073 parts In-Stock

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DigiPath Technology Company

USA . 1,046 parts In-Stock

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Overview

Elevate your projects with the TMX320DM6443BZWT by Texas Instruments, a cutting-edge microprocessor circuit that offers unparalleled performance and reliability. With Texas Instruments' reputation for excellence in manufacturing, you can trust that this product is designed to exceed your expectations. From advanced audio and video processing to industrial control applications, this versatile device is sure to bring value and efficiency to your projects. Experience the benefits of seamless integration, efficient power management, and top-notch quality with the TMX320DM6443BZWT. Elevate your work today with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a variety of applications.

Surface Mount: YES

Allows for easy and secure mounting on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 1.26 V

Provides a safe operating range for the product, ensuring stability and reliability.

Package Shape: SQUARE

Square packages are easier to handle and align on circuit boards, improving manufacturing efficiency.

Bit Size: 32

Offers high processing power and capability for complex operations and calculations.

Power Supplies (V): 1.2,1.8,3.3

Supports multiple voltage options, allowing for flexibility in design and power consumption.

No. of Terminals: 361

Provides a large number of connection points for interfacing with other components and peripherals.

Minimum Supply Voltage: 1.14 V

Ensures stable operation at lower voltage levels, conserving power and improving efficiency.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for use in various environmental conditions.

Minimum Operating Temperature: 0 °C

Can operate in cold environments without any issues, ensuring reliability under different temperature conditions.

Terminal Position: BOTTOM

Bottom terminal position makes it easier to access and connect to other components on the circuit board.

RAM Words: 16384

Large RAM capacity for storing and accessing data quickly and efficiently.

Width: 16 mm

Compact width size allows for efficient use of space on the circuit board.

Length: 16 mm

Square shape with equal length and width allows for uniform and symmetrical layout on the board.

Temperature Grade: COMMERCIAL EXTENDED

Designed to operate reliably over an extended temperature range, suitable for various industrial applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Enables the product to interface with external devices and sensors, expanding its functionality and versatility.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving overall performance.

Terminal Form: BALL

Ball terminals provide a secure connection and easy soldering on the circuit board.

Nominal Supply Voltage: 1.2 V

Stable supply voltage for optimal performance and reliability of the product.

Terminal Pitch: 0.8 mm

Fine pitch terminals allow for high-density mounting and compact design, saving space on the board.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and enhances processing speed for various applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMX320DM6443BZWT attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

Bit Size:

32

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B361

Length:

16 mm

No. of Terminals:

361

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMX320DM6443BZWT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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