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TMX320DM6441DZWT

Texas Instruments

TMX320DM6441DZWT by Texas Instruments

TMX320DM6441DZWT by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-85 °C and has a supply voltage range of 1-1.1 V. This IC is ideal for applications requiring low profile, fine pitch GRID ARRAY packages in surface mount configurations.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,729 parts In-Stock

1+ parts

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5,729

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Digiode

USA . 546 parts In-Stock

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546

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 622 parts In-Stock

1+ parts

$16.219

100+ parts

-

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622

$16.219

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One Stop Electronics

USA . 652 parts In-Stock

1+ parts

$32.000

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652

$32.000

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Corohmni

South Africa . 960 parts In-Stock

1+ parts

$54.427

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960

$54.427

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Parana Technologies

USA . 820 parts In-Stock

1+ parts

$65.735

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820

$65.735

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DigiPath Technology Company

USA . 1,618 parts In-Stock

1+ parts

$72.382

100+ parts

$66.591

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1,618

$72.382

$66.591

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ChromeModa Solutions

Germany . 4,630 parts In-Stock

1+ parts

$73.859

100+ parts

$60.564

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4,630

$73.859

$60.564

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IDEA Electronic Components Group

UK . 1,412 parts In-Stock

1+ parts

$73.859

100+ parts

$70.166

1k+ parts

$66.473

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1,412

$73.859

$70.166

$66.473

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Corphita

USA . 3,037 parts In-Stock

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3,037

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Overview

Unlock the power of cutting-edge technology with the TMX320DM6441DZWT by Texas Instruments. As a leader in semiconductor manufacturing, Texas Instruments ensures top-notch quality and reliability in all their products. This microprocessor circuit is perfect for a wide range of applications, providing seamless performance and efficiency. With its advanced features and innovative design, customers can expect nothing but superior value and benefits. Experience the advantages of Texas Instruments with the TMX320DM6441DZWT and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 1.1 V

The high maximum supply voltage ensures stable operation of the product within safe limits.

Package Shape: SQUARE

The square shape provides a compact and space-saving design for the product.

No. of Terminals: 316

The high number of terminals allows for versatile connectivity and functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style offers high density integration and improved electrical performance.

Minimum Supply Voltage: 1 V

The low minimum supply voltage ensures energy efficiency and minimizes power consumption.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the product can operate in a wide range of temperature environments.

Terminal Position: BOTTOM

The bottom terminal position allows for easy and secure PCB mounting.

Maximum Seated Height: 1.4 mm

The low maximum seated height enables a slim and compact overall product profile.

Width: 16 mm

The 16mm width provides a balance between compactness and functional space for components.

Length: 16 mm

The 16mm length complements the square package shape for a uniform and aesthetically pleasing design.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The microprocessor circuit type allows for advanced data processing and control capabilities.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity for reliable operation.

Terminal Form: BALL

The ball terminal form provides reliable and secure electrical connections.

Nominal Supply Voltage: 1.05 V

The nominal supply voltage optimizes performance and power efficiency for the product.

Terminal Pitch: 0.8 mm

The 0.8mm terminal pitch allows for high-density mounting and space-saving PCB layout.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMX320DM6441DZWT attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 1.2 V AND 1.1 V TYP

JESD-30 Code:

S-PBGA-B316

Length:

16 mm

No. of Terminals:

316

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.1 V

Minimum Supply Voltage:

1 V

Nominal Supply Voltage:

1.05 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMX320DM6441DZWT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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