Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TMX320DM6441DZWT by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-85 °C and has a supply voltage range of 1-1.1 V. This IC is ideal for applications requiring low profile, fine pitch GRID ARRAY packages in surface mount configurations.
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The use of plastic/epoxy material makes the product lightweight and cost-effective.
Surface mount technology allows for easy and efficient PCB assembly.
The high maximum supply voltage ensures stable operation of the product within safe limits.
The square shape provides a compact and space-saving design for the product.
The high number of terminals allows for versatile connectivity and functionality.
The grid array, low profile, and fine pitch package style offers high density integration and improved electrical performance.
The low minimum supply voltage ensures energy efficiency and minimizes power consumption.
The high maximum operating temperature ensures reliable performance even in harsh environmental conditions.
The low minimum operating temperature ensures the product can operate in a wide range of temperature environments.
The bottom terminal position allows for easy and secure PCB mounting.
The low maximum seated height enables a slim and compact overall product profile.
The 16mm width provides a balance between compactness and functional space for components.
The 16mm length complements the square package shape for a uniform and aesthetically pleasing design.
The microprocessor circuit type allows for advanced data processing and control capabilities.
The CMOS technology offers low power consumption and high noise immunity for reliable operation.
The ball terminal form provides reliable and secure electrical connections.
The nominal supply voltage optimizes performance and power efficiency for the product.
The 0.8mm terminal pitch allows for high-density mounting and space-saving PCB layout.
Other Function uPs,uCs & Peripheral ICs TMX320DM6441DZWT attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments
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TMX320DM6441DZWT Peripheral ICs trade compliance attributes, and parameters.
HTS
8542.31.00.01
SB
8542.31.00.00
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
M39029/58-360
Fct Electronic
CONNECTOR ACCESSORY; IEC Conformity: NO; Alternate Contact Sources: MILITARY; MIL Conformity: YES; Contact Gender: MALE; MIL-Connector Accessory Name: CONTACT;
SMBJ18CA
Weitron Technology
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WT
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
E8WSDC12-32.768KTR
Ecliptek
PARALLEL - FUNDAMENTAL; Mounting Feature: SURFACE MOUNT; Frequency Tolerance: 20 ppm; Aging: 3 PPM/YEAR; Load Capacitance: 12.5 pF; Nominal Operating Frequency: .032768 MHz;
IRLML6402TRPBF
Infineon Technologies
IRLML6402TRPBF by Infineon is a P-CHANNEL FET for SWITCHING applications. It features a 20V DS Breakdown Voltage, 22A IDM, and 0.065 ohm RDS(on). With a small outline package and matte tin finish, it operates in temperatures from -55 to 150 °C.
Secos
LM358N
Harris Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
STMicroelectronics
NE555DR
Texas Instruments
NE555DR by Texas Instruments is an Analog Waveform Generation IC with 8 terminals, operating voltage of 5V, and power supplies ranging from 5-15V. It is a versatile component for pulse generation applications due to its small outline package and commercial temperature grade suitability.
1N4148
Laube Technology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
STM32H753IIK6
STM32H753IIK6 by STMicroelectronics is a 32-bit microcontroller with 176 terminals, operating at up to 48 MHz. It features 20-Ch 16-Bit ADCs, 2-Ch 12-Bit DACs, and peripherals like CAN, ETHERNET, and USB. Ideal for industrial applications requiring high-speed processing and extensive connectivity options.
2N7002
Bytesonic Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Terminal Position: DUAL; Minimum Operating Temperature: -55 Cel;
1N4148WS
Changzhou Starsea Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
EU2B-YS3103F
Idec
ROTARY SWITCH;
LL4148
Shanghai Lunsure Electronic Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): 1 V; Maximum Non Repetitive Peak Forward Current: .5 A; No. of Elements: 1; Maximum Reverse Recovery Time: .004 us;
LM555CM
National Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
EPCS4SI8N
Altera
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL;
Yageo
BAV99
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Zetex Plc
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
MSP430F67641AIPZ
MSP430F67641AIPZ by Texas Instruments is a 100-terminal microprocessor circuit with 8192 bytes of RAM. Operating at -40 to 85°C, it supports I2C, SPI, and UART bus compatibility for industrial applications requiring a low-profile package style with a max seated height of 1.6mm.
ESP32-S3-WROOM-1U-N4R2
Espressif Systems (Shanghai)
ESP32-S3-WROOM-1U-N4R2 by Espressif Systems is a 41-terminal SoC with CMOS technology. It operates b/w -40 to 85°C, with supply voltage range of 3-3.6V. Ideal for IoT applications due to its compact size and surface mount capability.
AM6442BSEGHAALV
AM6442BSEGHAALV by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 0.715V to 0.79V. This IC has 441 terminals in a GRID ARRAY package style and is ideal for various applications requiring high-speed processing.
A2F200M3F-CSG288I
Microsemi
SoC FPGA; Terminal Form: BALL; No. of Terminals: 288; Package Code: TFBGA; Package Shape: SQUARE; Technology: CMOS;
XC7Z030-2SBG485I
Xilinx
XC7Z030-2SBG485I by Xilinx is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.95V to 1.05V. This GRID ARRAY package has 485 terminals and is ideal for various applications requiring high-performance uPs/uCs & Peripheral ICs.
DA16200MOD-AAC4WA32
Renesas Electronics
SYSTEM ON CHIP; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260;
EM357-RTR
Ember
Other uPs/uCs/Peripheral ICs;
1904
Satcon Electronics
PEX8606-BA50BCG
Plx Technology
DS8007-ENG
Maxim Integrated
DS8007-ENG by Maxim Integrated is a MICROPROCESSOR CIRCUIT with 48 terminals, operating at 2.7-6V, ideal for industrial applications. It features a FLATPACK package style, GULL WING terminal form, and operates b/w -40 to 85 °C. Suitable for various Other Function uPs,uCs & Peripheral ICs needs due to its low profile design and CMOS technology.
SCANSTA112SMX/NOPB
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 100; Package Code: LFBGA; Package Shape: SQUARE;
TDA8035HN/C1,118
NXP Semiconductors
NXP Semiconductors' TDA8035HN/C1,118 is a 32-terminal IC with a supply voltage range of 2.7V to 5.5V and operates b/w -25°C to 85°C. This MICROPROCESSOR CIRCUIT has a max supply current of 220mA and is ideal for applications requiring low power consumption in compact designs. The chip carrier package style with very thin profile makes it suitable for space-constrained environments.
MCIMX6S5DVM10AB
MCIMX6S5DVM10AB by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 624 terminals. It operates at a voltage range of 1.35V to 1.5V and has a max temperature of 95°C. This semiconductor is commonly used in other function uPs, uCs, and peripheral ICs applications.
A13
Allwinner Technology
Allwinner Technology's A13 is a CMOS microprocessor circuit with 176 terminals in a flatpack package. It is used in Other Function uPs and uCs, featuring gull wing terminal form for surface mount applications. Ideal for various peripheral IC applications requiring high performance and compact design.
NT3H2211W0FHKH
MICROPROCESSOR CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260;
ESP32-S3-WROOM-1-N16R8
ESP32-S3-WROOM-1-N16R8 by Espressif Systems is a SoC with 41 terminals, operating at 3.3V nominal voltage and up to 65°C. Its compact MICROELECTRONIC ASSEMBLY package makes it suitable for IoT devices requiring low power consumption and high performance in a small form factor. With a max supply voltage of 3.6V, it is ideal for applications where space constraints are critical.
SM-K26-XCL2GC-ED
PSoC;
CC1310F32RSMT
CC1310F32RSMT by Texas Instruments is a Cortex-M3 CPU with 28672 RAM bytes. It operates b/w -40 to 85 °C, with a supply voltage range of 1.8-3.8 V. This MICROPROCESSOR CIRCUIT is ideal for industrial applications requiring low power consumption and compact design.
XCZU4EV-1FBVB900I
XCZU4EV-1FBVB900I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has 900 terminals in a GRID ARRAY package style. Suitable for industrial applications, it requires a supply voltage of 0.825V to 0.876V.
SE051C2HQ1/Z01XDZ
SE051C2HQ1/Z01XDZ by NXP Semiconductors is a cryptographic authenticator IC with 20 terminals, operating voltage range of 1.62V to 3.6V, and temperature range from -40°C to 105°C. It features a square chip carrier package style suitable for surface mount applications in various electronic devices.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
TMX320DM355ZCE216
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 337; Package Code: LFBGA; Package Shape: SQUARE;
TMX320DM355ZCE270
TMX320DM365AZCE
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 338; Package Code: FBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, FINE PITCH;
TMX320DM365AZCE270
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 338; Package Code: LFBGA; Package Shape: SQUARE;
TMX320DM365AZCE300
TMX320DM365BZCE
TMX320DM6443AZWT
MICROPROCESSOR CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: BALL; No. of Terminals: 361; Package Code: LFBGA; Package Shape: SQUARE;
TMX320DM6443BZWT
TMX320DM6443CZWT
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 316; Package Code: LFBGA; Package Shape: SQUARE;
TMX320DM6443ZWT
TMX320DM6446AZWTA
TMX320DM6446DZWT
TMX320DM6446ZWT
TMX320DM6467ZUT
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 529; Package Code: HFBGA; Package Shape: SQUARE;
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