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TMX320DM6443AZWT

Texas Instruments

TMX320DM6443AZWT by Texas Instruments

Texas Instruments TMX320DM6443AZWT is a 32-bit microprocessor with 16mm width and length. It operates b/w 0-85°C, with supply voltages of 1.14-1.26V. This MICROPROCESSOR CIRCUIT is ideal for applications requiring fixed point format and CMOS technology in commercial extended temperature grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,504 parts In-Stock

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Digiode

USA . 1,291 parts In-Stock

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A2Z Electronics, Inc.

USA . 105 parts In-Stock

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Bristol Electronics

USA . 105 parts In-Stock

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105

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Distributors (Availability)

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AZTECH Wire

Italy . 500 parts In-Stock

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$18.222

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$18.222

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One Stop Electronics

USA . 825 parts In-Stock

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$34.000

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Parana Technologies

USA . 2,033 parts In-Stock

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$57.198

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DigiPath Technology Company

USA . 1,297 parts In-Stock

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$62.982

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IDEA Electronic Components Group

UK . 2,262 parts In-Stock

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$64.267

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$61.054

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$57.840

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ChromeModa Solutions

Germany . 1,992 parts In-Stock

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$64.267

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$52.699

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Corohmni

South Africa . 2,358 parts In-Stock

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$74.832

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Corphita

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Overview

Unleash the power of cutting-edge technology with the TMX320DM6443AZWT by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality products that redefine innovation. The TMX320DM6443AZWT falls under the category of Other Function uPs,uCs & Peripheral ICs, offering unparalleled performance and versatility. With its advanced features and superior functionality, this product opens up endless possibilities for applications in various industries. Experience the value and benefits that Texas Instruments brings to the table, and elevate your projects to new heights with the TMX320DM6443AZWT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and cost-effectiveness.

Surface Mount: YES

This allows for easy and efficient installation on PCBs, saving time and effort.

Maximum Supply Voltage: 1.26 V

This ensures safe operation within a specified voltage range.

Package Shape: SQUARE

The square shape allows for efficient use of space on the PCB.

Bit Size: 32

This indicates the processing power and capability of the microprocessor.

Power Supplies (V): 1.2,1.8,3.3

This provides flexibility in powering the device with different voltage options.

No. of Terminals: 361

A high number of terminals allows for more connectivity options.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This style offers efficient thermal management and space-saving design.

Minimum Supply Voltage: 1.14 V

Ensures that the device can operate reliably even at lower voltages.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the device can withstand harsh environments.

Minimum Operating Temperature: 0 °C

This wide temperature range allows for operation in various conditions.

Terminal Position: BOTTOM

The bottom terminal position makes it easier to integrate into PCB layouts.

Maximum Seated Height: 1.4 mm

The low profile design saves space and allows for compact system designs.

RAM Words: 16384

The ample RAM capacity allows for efficient data processing and storage.

Width: 16 mm

The compact width allows for efficient placement on the PCB.

Length: 16 mm

The square shape and small length contribute to space-saving design.

Temperature Grade: COMMERCIAL EXTENDED

This temperature grade ensures reliable performance in commercial and extended temperature ranges.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The inclusion of a microprocessor circuit enhances the functionality and processing capabilities of the device.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminals provide reliable connections and ease of soldering.

Nominal Supply Voltage: 1.2 V

This specified voltage ensures optimal performance and power efficiency.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for high-density mounting and efficient use of space.

Format: FIXED POINT

Fixed-point format simplifies numerical computations and enhances processing speed.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMX320DM6443AZWT attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

Bit Size:

32

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B361

Length:

16 mm

No. of Terminals:

361

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMX320DM6443AZWT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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