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TMX320DM6443ZWT

Texas Instruments

TMX320DM6443ZWT by Texas Instruments

Texas Instruments TMX320DM6443ZWT is a 32-bit microprocessor with 16mm width and length. It operates at temperatures from 0 to 85°C, with power supplies of 1.2V, 1.8V, and 3.3V. This MICROPROCESSOR CIRCUIT is ideal for applications requiring high performance in a compact package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,204 parts In-Stock

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3,204

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Digiode

USA . 350 parts In-Stock

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350

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 468 parts In-Stock

1+ parts

$11.398

100+ parts

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468

$11.398

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One Stop Electronics

USA . 714 parts In-Stock

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$32.000

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714

$32.000

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Parana Technologies

USA . 852 parts In-Stock

1+ parts

$36.285

100+ parts

$3,369.640

1k+ parts

$32.657

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852

$36.285

$3,369.640

$32.657

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DigiPath Technology Company

USA . 504 parts In-Stock

1+ parts

$39.955

100+ parts

$36.758

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504

$39.955

$36.758

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ChromeModa Solutions

Germany . 3,348 parts In-Stock

1+ parts

$40.770

100+ parts

$33.431

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3,348

$40.770

$33.431

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IDEA Electronic Components Group

UK . 893 parts In-Stock

1+ parts

$40.770

100+ parts

$38.732

1k+ parts

$36.693

10k+ parts

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893

$40.770

$38.732

$36.693

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Corohmni

South Africa . 4,868 parts In-Stock

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$81.068

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4,868

$81.068

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Corphita

USA . 3,568 parts In-Stock

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3,568

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Overview

Experience the power and precision of Texas Instruments with the TMX320DM6443ZWT. This cutting-edge microprocessor circuit offers unparalleled performance in a compact package, making it perfect for a wide range of applications. Whether you're looking to enhance your embedded systems or streamline your digital signal processing, this product delivers exceptional quality and reliability. Trust Texas Instruments to provide the technology you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic is a durable and cost-effective material for packaging electronic components, making this product reliable and affordable.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto circuit boards, saving time and reducing production costs.

Maximum Supply Voltage: 1.26 V

This low maximum supply voltage ensures safe operation and protects the components from over-voltage damage.

Package Shape: SQUARE

A square package shape offers better space utilization on a circuit board and allows for easier alignment during assembly.

Bit Size: 32

With a 32-bit architecture, this product can handle complex calculations and operations efficiently, suitable for a wide range of applications.

Power Supplies (V): 1.2, 1.8, 3.3

Support for multiple power supply voltages ensures compatibility with various systems and allows for flexibility in design.

No. of Terminals: 361

Having a high number of terminals enables connectivity with a large number of external devices, expanding the product's functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The combination of grid array, low profile, and fine pitch package styles offers high density integration, reducing the overall size of the product and improving performance.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures reliable operation even under low power conditions, making this product suitable for portable and energy-efficient devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows for reliable operation in a wide range of environments, ensuring the product's performance under varying conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the product can operate in cold environments without any performance issues, making it suitable for a variety of applications.

Terminal Position: BOTTOM

Bottom terminal position makes it easier to connect the product to other components on the circuit board, simplifying installation and maintenance.

Maximum Seated Height: 1.4 mm

With a low maximum seated height, this product can be integrated into compact devices without compromising on performance or functionality.

RAM Words: 16384

Having a large RAM capacity of 16,384 words allows the product to store and process a significant amount of data efficiently, making it suitable for advanced applications.

Width: 16 mm

Compact width of 16 mm allows for easy integration of the product into space-constrained devices, saving valuable board space.

Length: 16 mm

Compact length of 16 mm ensures the product can fit into small enclosures or devices without sacrificing functionality or performance.

Temperature Grade: COMMERCIAL EXTENDED

Being rated for commercial extended temperature range ensures the product can operate reliably in a wide range of temperature conditions, making it versatile for different applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

As a microprocessor circuit, this product can handle complex tasks, interface with various peripherals, and provide advanced computing capabilities, making it a powerful and versatile choice.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliability, making this product energy-efficient and suitable for battery-powered or portable devices.

Terminal Form: BALL

Having ball terminals simplifies the soldering process during assembly, ensuring reliable connections and efficient manufacturing.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2 V ensures compatibility with standard power sources and allows for stable and efficient operation.

Terminal Pitch: 0.8 mm

A small terminal pitch of 0.8 mm allows for high-density packaging and finer connections, enabling advanced features and functionality in a compact form factor.

Format: FIXED POINT

Being a fixed-point format, this product is optimized for integer arithmetic and operations, making it suitable for applications where precision and efficiency are critical.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMX320DM6443ZWT attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

Bit Size:

32

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B361

Length:

16 mm

No. of Terminals:

361

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMX320DM6443ZWT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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