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TMX320DM6446DZWT

Texas Instruments

TMX320DM6446DZWT by Texas Instruments

TMX320DM6446DZWT by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-85 °C, with supply voltage range of 1.14-1.26 V. This IC is used in applications requiring low profile GRID ARRAY package style for high performance computing tasks.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,053 parts In-Stock

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Digiode

USA . 1,743 parts In-Stock

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AZTECH Wire

Italy . 567 parts In-Stock

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$4.967

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One Stop Electronics

USA . 1,146 parts In-Stock

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$17.000

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Corohmni

South Africa . 724 parts In-Stock

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$51.443

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Parana Technologies

USA . 2,031 parts In-Stock

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$61.092

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DigiPath Technology Company

USA . 1,266 parts In-Stock

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$67.270

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ChromeModa Solutions

Germany . 4,823 parts In-Stock

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$68.643

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$56.287

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IDEA Electronic Components Group

UK . 1,345 parts In-Stock

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$68.643

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$65.211

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$61.779

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Corphita

USA . 1,803 parts In-Stock

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Overview

Unlock limitless possibilities with the Texas Instruments TMX320DM6446DZWT, a cutting-edge microprocessor circuit that redefines innovation. Crafted with precision by Texas Instruments, this peripheral IC boasts unmatched quality and reliability. From smart home devices to automotive applications, this versatile product offers unparalleled value and performance, making it the top choice for customers seeking superior technology solutions. Experience the future today with the TMX320DM6446DZWT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures good durability and protection for the components inside the package, making it a reliable choice for long-term use.

Surface Mount: YES

Surface mount capability allows for easier and more efficient assembly onto circuit boards, saving time and effort during manufacturing.

Maximum Supply Voltage: 1.26 V

High maximum supply voltage provides flexibility in power requirements and allows for usage in various voltage settings.

Package Shape: SQUARE

Square package shape helps in optimizing space utilization on circuit boards and enhances overall design aesthetics.

No. of Terminals: 316

Large number of terminals enable connectivity to multiple components, enhancing functionality and versatility of the product.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array, low profile, and fine pitch package style offers enhanced performance in terms of signal transmission, heat dissipation, and compact design.

Minimum Supply Voltage: 1.14 V

Low minimum supply voltage helps in minimizing power consumption and ensures efficient operation in low-power settings.

Maximum Operating Temperature: 85 °C

High maximum operating temperature enables reliable performance in challenging environments with elevated temperatures.

Minimum Operating Temperature: 0 °C

Wide operating temperature range ensures operational efficiency in both extreme cold and hot conditions.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure connections during installation, improving overall reliability of the product.

Maximum Seated Height: 1.4 mm

Low maximum seated height helps in achieving a slim and compact form factor, ideal for space-constrained applications.

Width: 16 mm

Optimal width dimension allows for efficient integration into various system designs without occupying excessive space.

Length: 16 mm

Balanced length dimension contributes to a well-proportioned overall package size, ensuring compatibility with standard board layouts.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Inclusion of a microprocessor circuit expands the capabilities of the product, enabling advanced computing functions and improved performance.

Technology: CMOS

CMOS technology offers low power consumption, high speed operation, and compatibility with a wide range of digital devices, enhancing the product's efficiency and versatility.

Terminal Form: BALL

Ball terminal form provides secure and stable connections, ensuring reliable signal transmission and preventing potential issues such as signal loss or disconnections.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage simplifies power management and ensures consistent performance across various operating conditions.

Terminal Pitch: 0.8 mm

Fine terminal pitch allows for high-density packaging, enabling more terminals in a limited space and enhancing connectivity options for complex circuit designs.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMX320DM6446DZWT attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B316

Length:

16 mm

No. of Terminals:

316

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMX320DM6446DZWT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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