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TMX320DM6446AZWTA

Texas Instruments

TMX320DM6446AZWTA by Texas Instruments

TMX320DM6446AZWTA by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-85 °C, with supply voltage range of 1.14-1.26 V. Ideal for applications requiring low profile GRID ARRAY package style and surface mount compatibility.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,623 parts In-Stock

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Digiode

USA . 1,184 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 407 parts In-Stock

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$9.667

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One Stop Electronics

USA . 768 parts In-Stock

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$19.000

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Parana Technologies

USA . 2,049 parts In-Stock

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$71.852

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ChromeModa Solutions

Germany . 3,848 parts In-Stock

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$80.733

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$66.201

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IDEA Electronic Components Group

UK . 1,245 parts In-Stock

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$80.733

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$76.696

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$72.660

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Corohmni

South Africa . 577 parts In-Stock

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$85.372

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Corphita

USA . 1,503 parts In-Stock

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DigiPath Technology Company

USA . 369 parts In-Stock

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$72.789

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Overview

Discover the cutting-edge technology of the Texas Instruments TMX320DM6446AZWTA, a top-of-the-line Microprocessor Circuit designed for maximum performance. With Texas Instruments' renowned reputation for excellence in the industry, this device offers unparalleled quality and reliability. Ideal for a wide range of applications in the Other Function uPs,uCs & Peripheral ICs category, this product provides exceptional value and benefits to customers seeking superior performance and efficiency. Upgrade your projects with the TMX320DM6446AZWTA and experience the advantages of top-tier technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the components inside, ensuring durability and reliability.

Surface Mount: YES

Surface mount technology allows for efficient and compact assembly, saving space and making the product suitable for smaller electronic devices.

Maximum Supply Voltage: 1.26 V

The high maximum supply voltage ensures stable performance even under varying power input conditions.

Package Shape: SQUARE

The square shape allows for easy and uniform layout on circuit boards, facilitating assembly and enhancing overall design aesthetics.

No. of Terminals: 316

The high number of terminals enables connectivity with a wide range of external components, making the product versatile and adaptable for different applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers efficient heat dissipation, compact form factor, and precise alignment during assembly, contributing to overall performance and reliability.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage allows for efficient power consumption and operation in low-power scenarios, making the product energy-efficient.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the product can withstand elevated temperatures without compromising performance, suitable for a variety of environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature guarantees reliable operation even in colder conditions, enhancing the product's usability in diverse environments.

Terminal Position: BOTTOM

The bottom terminal position allows for easier and more secure soldering connections, improving overall assembly quality and durability.

Maximum Seated Height: 1.4 mm

The low maximum seated height contributes to the product's slim profile, making it suitable for compact electronic devices where space is limited.

Width: 16 mm

The compact width enables efficient placement on circuit boards and allows for compact overall design, ideal for space-constrained applications.

Length: 16 mm

The equal length and width dimensions facilitate symmetrical layout and easy integration with other components, enhancing the product's overall design aesthetics.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The microprocessor circuit provides advanced processing capabilities, enabling complex functions and high-speed operation, making the product suitable for demanding applications.

Technology: CMOS

The CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems, enhancing the product's performance and versatility.

Terminal Form: BALL

The ball terminal form ensures reliable connectivity and soldering connections, improving overall product durability and long-term performance.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage provides a stable operating range for the product, ensuring consistent performance and reliability under normal operating conditions.

Terminal Pitch: 0.8 mm

The fine terminal pitch allows for high-density mounting and precise connections, enhancing the product's efficiency and reliability in compact electronic designs.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMX320DM6446AZWTA attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B316

Length:

16 mm

No. of Terminals:

316

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMX320DM6446AZWTA Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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