Loading...

TMX320DM6443CZWT

Texas Instruments

TMX320DM6443CZWT by Texas Instruments

Texas Instruments TMX320DM6443CZWT is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-85 °C, with supply voltage range of 1.14-1.26 V. Ideal for applications requiring low profile GRID ARRAY package style and fine pitch terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,069 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,069

-

-

-

-

Digiode

USA . 169 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

169

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,097 parts In-Stock

1+ parts

$6.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,097

$6.000

-

-

-

AZTECH Wire

Italy . 411 parts In-Stock

1+ parts

$14.517

100+ parts

-

1k+ parts

-

10k+ parts

-

411

$14.517

-

-

-

Parana Technologies

USA . 210 parts In-Stock

1+ parts

$35.936

100+ parts

-

1k+ parts

-

10k+ parts

-

210

$35.936

-

-

-

IDEA Electronic Components Group

UK . 1,119 parts In-Stock

1+ parts

$40.377

100+ parts

$38.358

1k+ parts

$36.339

10k+ parts

-

1,119

$40.377

$38.358

$36.339

-

ChromeModa Solutions

Germany . 779 parts In-Stock

1+ parts

$40.377

100+ parts

$33.109

1k+ parts

-

10k+ parts

-

779

$40.377

$33.109

-

-

Corohmni

South Africa . 5,053 parts In-Stock

1+ parts

$73.959

100+ parts

-

1k+ parts

-

10k+ parts

-

5,053

$73.959

-

-

-

Corphita

USA . 472 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

472

-

-

-

-

DigiPath Technology Company

USA . 231 parts In-Stock

1+ parts

-

100+ parts

$36.404

1k+ parts

-

10k+ parts

-

231

-

$36.404

-

-

Overview

Upgrade your electronics with the TMX320DM6443CZWT by Texas Instruments, a top-quality manufacturer known for innovative solutions in the field of microprocessor circuits. Ideal for a range of applications, this product offers exceptional value and benefits to customers seeking high-performance technology. With a reliable package body material, surface mount capabilities, and advanced CMOS technology, this product is sure to exceed your expectations. Embrace the advantages of the TMX320DM6443CZWT and elevate your projects to new heights of excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the internal components of the product, ensuring long-term reliability.

Surface Mount: YES

Allows for easy installation onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.26 V

Ensures that the product can handle a higher voltage input without getting damaged, making it suitable for a variety of applications.

Package Shape: SQUARE

Provides a compact form factor, saving space in electronic devices where space is limited.

No. of Terminals: 316

Offers a wide range of connectivity options for interfacing with other components, enhancing the product's versatility.

Minimum Supply Voltage: 1.14 V

Allows the product to operate efficiently even at lower voltage levels, improving energy efficiency.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, making it suitable for use in a variety of environments and applications.

Minimum Operating Temperature: 0 °C

Capable of functioning in colder temperatures, ensuring reliable performance in different climatic conditions.

Terminal Position: BOTTOM

Facilitates easy connection to external circuits or components, simplifying the installation process.

Maximum Seated Height: 1.4 mm

Low profile design allows for a compact assembly, ideal for space-constrained applications.

Width: 16 mm

Compact width contributes to the overall small form factor of the product, enabling integration into various electronic devices.

Length: 16 mm

Square shape and equal dimensions offer a symmetrical layout, enhancing the product's aesthetics and ease of installation.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Incorporates advanced processing capabilities, enabling the product to perform complex tasks efficiently and accurately.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing the product's energy efficiency and reliability.

Terminal Form: BALL

Ball terminals offer reliable and secure connections, ensuring stable operation and preventing signal loss.

Nominal Supply Voltage: 1.2 V

Optimal voltage level for efficient and stable operation, ensuring consistent performance across various operating conditions.

Terminal Pitch: 0.8 mm

Provides a fine pitch for terminals, allowing for high-density mounting and enabling compact designs for space-saving applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMX320DM6443CZWT attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B316

Length:

16 mm

No. of Terminals:

316

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMX320DM6443CZWT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 14