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TMS9900JDL

Texas Instruments

TMS9900JDL by Texas Instruments

TMS9900JDL by Texas Instruments is a 16-bit microprocessor with 64 terminals, operating at speeds up to 3.3 rpm. Housed in a ceramic rectangular package, it operates b/w 0-70°C and is ideal for commercial applications requiring RISC technology.

Median Price

$130.780

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 614 parts In-Stock

1+ parts

$130.780

100+ parts

$122.930

1k+ parts

$115.090

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614

$130.780

$122.930

$115.090

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DigiKey

USA . 614 parts In-Stock

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614

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Ace Electronics

USA . 4 parts In-Stock

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$100.000

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4

$100.000

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Freelance Electronics

USA . 1 parts In-Stock

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$115.961

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1

$115.961

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Forefront Electronics and Design

USA . 7 parts In-Stock

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$122.500

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7

$122.500

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Component Electronics Inc.

Canada . 1 parts In-Stock

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$134.620

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$100.960

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$87.500

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1

$134.620

$100.960

$87.500

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Digiode

USA . 4,405 parts In-Stock

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$144.628

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4,405

$144.628

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DigiKey Marketplace

USA . 616 parts In-Stock

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$158.330

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616

$158.330

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Vyrian

USA . 7,700 parts In-Stock

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7,700

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Digital Electronic Gebert Verwaltungs UG

Germany . 16 parts In-Stock

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Electronics Depot

USA . 13 parts In-Stock

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Q Components

USA . 10 parts In-Stock

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10

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Fibra_Brandt Electronic GMBH

Germany . 4 parts In-Stock

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Electronic Expediters

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Bristol Electronics

USA . 3 parts In-Stock

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J & M Industries LLC

USA . 2 parts In-Stock

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Sunrise Surplus Inc.

USA . 1 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 324 parts In-Stock

1+ parts

$46.697

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324

$46.697

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DigiPath Technology Company

USA . 745 parts In-Stock

1+ parts

$51.419

100+ parts

$47.305

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745

$51.419

$47.305

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ChromeModa Solutions

Germany . 5,841 parts In-Stock

1+ parts

$52.468

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$43.024

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5,841

$52.468

$43.024

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IDEA Electronic Components Group

UK . 1,212 parts In-Stock

1+ parts

$52.468

100+ parts

$49.845

1k+ parts

$47.221

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1,212

$52.468

$49.845

$47.221

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Corphita

USA . 3,277 parts In-Stock

1+ parts

$137.016

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3,277

$137.016

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Vigor

Singapore . 616 parts In-Stock

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616

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Kepictronics

USA . 200 parts In-Stock

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200

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A-Plus Industry Inc.

USA . 6 parts In-Stock

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Perfect Parts

USA . 4 parts In-Stock

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Overview

Unlock next-level performance with the TMS9900JDL microprocessor by Texas Instruments. Renowned for their superior quality and cutting-edge technology, Texas Instruments delivers unmatched reliability and innovation. Ideal for a wide range of applications, this powerful 16-bit microprocessor offers exceptional speed and efficiency. Experience seamless operation and enhanced functionality with the TMS9900JDL, setting new standards in performance and value for customers seeking top-of-the-line microprocessors.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages offer excellent thermal conductivity and stability, making them ideal for high-performance applications.

Bit Size: 16

A 16-bit architecture allows for more complex and precise calculations, making the microprocessor suitable for tasks that require higher computational power.

No. of Terminals: 64

Having 64 terminals provides ample connectivity options for peripherals and external devices, enhancing the versatility of the microprocessor.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this microprocessor can handle demanding tasks without overheating.

Technology: MOS

MOS technology offers low power consumption and high integration density, making the microprocessor energy-efficient and suitable for compact designs.

Technical Specifications

Microprocessors TMS9900JDL attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Bit Size:

16

JESD-30 Code:

R-XDIP-T64

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP64,.9

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Speed:

3.3 rpm

Sub-Category:

Microprocessors

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

TMS9900JDL Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

NSN

5962-01-082-7434, 5962010827434, 5962-01-146-4292, 5962011464292

NIIN

010827434, 011464292

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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