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TMS9995JDL

Texas Instruments

TMS9995JDL by Texas Instruments

TMS9995JDL by Texas Instruments is an 8-bit RISC microprocessor with CMOS technology. It features 40 terminals in a ceramic rectangular package, suitable for commercial applications. Operating temperature ranges from 0°C to 70°C, making it ideal for various embedded systems and industrial automation projects.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,178 parts In-Stock

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7,178

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Digiode

USA . 1,165 parts In-Stock

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1,165

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LWI Electronics Inc

India . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 737 parts In-Stock

1+ parts

$15.000

100+ parts

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737

$15.000

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AZTECH Wire

Italy . 527 parts In-Stock

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$17.526

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527

$17.526

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Parana Technologies

USA . 1,059 parts In-Stock

1+ parts

$70.190

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1,059

$70.190

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DigiPath Technology Company

USA . 387 parts In-Stock

1+ parts

$77.288

100+ parts

$71.105

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387

$77.288

$71.105

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ChromeModa Solutions

Germany . 6,392 parts In-Stock

1+ parts

$78.865

100+ parts

$64.669

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6,392

$78.865

$64.669

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IDEA Electronic Components Group

UK . 729 parts In-Stock

1+ parts

$78.865

100+ parts

$74.922

1k+ parts

$70.978

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729

$78.865

$74.922

$70.978

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Corphita

USA . 2,405 parts In-Stock

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2,405

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Assy Fe

Spain . 150 parts In-Stock

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150

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Overview

Unleash the power of innovation with the TMS9995JDL microprocessor by Texas Instruments. This cutting-edge technology offers unparalleled quality and reliability, backed by the trusted reputation of its manufacturer. Ideal for a wide range of applications, this versatile product delivers exceptional value and performance to customers seeking efficient solutions for their projects. Embrace the future of technology with the TMS9995JDL and experience the advantages it brings to your designs.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages offer excellent thermal conductivity, helping to dissipate heat efficiently and increase the lifespan of the microprocessor.

Package Shape: RECTANGULAR

Rectangular shapes are often easier to integrate into circuit board designs and allow for efficient use of space in the overall system.

Bit Size: 8

An 8-bit microprocessor is well-suited for simpler applications where lower computational power is sufficient, making it a cost-effective choice for certain projects.

No. of Terminals: 40

Having a higher number of terminals allows for more connectivity options and versatility in the design and integration of the microprocessor within a system.

Package Style (Meter): IN-LINE

The in-line package style is convenient for applications where space may be limited, as it allows for a more compact form factor and efficient use of board real estate.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this microprocessor can function reliably in a variety of environments without risk of overheating or performance degradation.

Minimum Operating Temperature: 0 °C

The ability to operate at temperatures as low as 0°C ensures that this microprocessor is suitable for use in both indoor and outdoor applications, even in colder climates.

Terminal Position: DUAL

Dual terminal positions provide increased flexibility in how the microprocessor is connected within a circuit, allowing for various configurations and integration options.

Temperature Grade: COMMERCIAL

Designed for commercial use, this microprocessor meets industry standards for temperature performance and reliability under normal operating conditions.

Peripheral IC Type: MICROPROCESSOR, RISC

Utilizing a RISC architecture, this microprocessor offers efficient and streamlined processing capabilities, ideal for applications that require fast execution of instructions.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making this microprocessor energy-efficient and reliable in noisy electronic environments.

Terminal Form: THROUGH-HOLE

Through-hole terminals are durable and provide a strong mechanical connection, ensuring stable and reliable connectivity in various operating conditions.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54mm allows for easy soldering and assembly, making this microprocessor user-friendly and simplifying the manufacturing process.

Technical Specifications

Microprocessors TMS9995JDL attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Bit Size:

8

JESD-30 Code:

R-XDIP-T40

No. of Terminals:

40

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Sub-Category:

Microprocessors

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Trade Compliance

TMS9995JDL Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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