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TMS9981JDL

Texas Instruments

TMS9981JDL by Texas Instruments

TMS9981JDL by Texas Instruments is a 16-bit CMOS microprocessor with 40 terminals in an IN-LINE package. Operating temperature range is 0-70°C, suitable for commercial applications. Its ceramic rectangular package and through-hole terminals make it ideal for various embedded systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Vyrian

USA . 6,298 parts In-Stock

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Digiode

USA . 879 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 4 parts In-Stock

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Electronic Expediters

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ECAB

Sweden . 2 parts In-Stock

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Microfarads

USA . 1 parts In-Stock

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Sunrise Surplus Inc.

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ABC Electronics Ltd.

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AZTECH Wire

Italy . 708 parts In-Stock

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$11.350

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One Stop Electronics

USA . 238 parts In-Stock

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$16.000

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Advanced Electronics

New Zealand . 50 parts In-Stock

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$42.367

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$41.944

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$40.249

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Parana Technologies

USA . 276 parts In-Stock

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$70.320

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IDEA Electronic Components Group

UK . 2,194 parts In-Stock

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ChromeModa Solutions

Germany . 360 parts In-Stock

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Corphita

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Assy Fe

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DigiPath Technology Company

USA . 2 parts In-Stock

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Overview

Discover the unmatched quality and reliability of the TMS9981JDL microprocessor by Texas Instruments, a leader in semiconductor technology. This innovative product offers exceptional performance and versatility in various applications. Whether you're designing consumer electronics, industrial automation systems, or medical devices, this microprocessor delivers top-notch functionality and efficiency. Trust Texas Instruments to provide cutting-edge solutions that exceed your expectations. Elevate your projects with the TMS9981JDL and experience the difference today.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic is known for its high thermal conductivity and resistance to heat, making it an excellent choice for a microprocessor that needs to operate at high temperatures.

Bit Size: 16

A 16-bit microprocessor can handle larger chunks of data at once, leading to faster processing speed and improved overall performance.

No. of Terminals: 40

Having 40 terminals allows for more connectivity options and peripherals to be integrated into the microprocessor, increasing its versatility.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this microprocessor can reliably function in a wide range of environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this microprocessor energy efficient and reliable in various applications.

Technical Specifications

Microprocessors TMS9981JDL attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Bit Size:

16

JESD-30 Code:

R-XDIP-T40

No. of Terminals:

40

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Sub-Category:

Microprocessors

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Trade Compliance

TMS9981JDL Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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