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TMS9981NL

Texas Instruments

TMS9981NL by Texas Instruments

TMS9981NL by Texas Instruments is a 16-bit microprocessor with 40 terminals in a rectangular plastic/epoxy package. Operating temperature range is 0-70°C, suitable for commercial-grade applications. Ideal for RISC-based systems requiring CMOS technology and through-hole mounting.

Median Price

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Lifecycle Status

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7

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1k+

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Vyrian

USA . 7,981 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 209 parts In-Stock

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Holdelec - ElecDif-Pro

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Digiode

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Digital Electronic Gebert Verwaltungs UG

Germany . 35 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 20 parts In-Stock

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Zilex Electronics Inc.

Canada . 2 parts In-Stock

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AZTECH Wire

Italy . 490 parts In-Stock

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$9.369

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One Stop Electronics

USA . 1,319 parts In-Stock

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$28.000

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Parana Technologies

USA . 108 parts In-Stock

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$33.773

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$3,136.320

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$30.396

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DigiPath Technology Company

USA . 1,466 parts In-Stock

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$34.213

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ChromeModa Solutions

Germany . 3,913 parts In-Stock

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IDEA Electronic Components Group

UK . 1,202 parts In-Stock

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Corphita

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Assy Fe

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Overview

Discover the power of the TMS9981NL microprocessor by Texas Instruments, a top-quality product offering unmatched performance and reliability. With its advanced technology and commercial-grade temperature grade, this microprocessor is perfect for a wide range of applications. From industrial automation to consumer electronics, the TMS9981NL provides exceptional value and benefits to customers seeking cutting-edge solutions. Trust in Texas Instruments to deliver innovative products that exceed expectations and enhance your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the microprocessor, ensuring it can withstand various environmental conditions.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to integrate this microprocessor into different electronic devices and circuit designs.

Bit Size: 16

The 16-bit architecture allows for efficient processing of data and instructions, making this microprocessor suitable for tasks that require moderate computational power.

No. of Terminals: 40

Having 40 terminals provides ample connectivity options for interfacing with other components and peripherals in a system.

Package Style: IN-LINE

The in-line package style makes it easy to mount and solder this microprocessor onto a circuit board, simplifying the assembly process.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this microprocessor can handle moderate to high thermal conditions without compromising performance.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures reliable performance even in colder environments.

Terminal Position: DUAL

Having dual terminal positions enhances the versatility of this microprocessor, allowing for different mounting orientations and configurations.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature ranges makes this microprocessor suitable for a wide range of consumer electronics and industrial applications.

Peripheral IC Type: MICROPROCESSOR, RISC

The RISC architecture of this microprocessor enables efficient and streamlined processing of instructions, making it ideal for fast and responsive performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the energy efficiency and reliability of this microprocessor.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies the soldering process and provides a strong mechanical connection, ensuring stable operation of the microprocessor.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch allows for easy integration and compatibility with standard electrical components and connectors.

Technical Specifications

Microprocessors TMS9981NL attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Bit Size:

16

JESD-30 Code:

R-PDIP-T40

No. of Terminals:

40

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Sub-Category:

Microprocessors

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Trade Compliance

TMS9981NL Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

NSN

5962-01-217-0995, 5962012170995

NIIN

012170995

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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