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TMS9900JL

Texas Instruments

TMS9900JL by Texas Instruments

TMS9900JL by Texas Instruments is a 16-bit microprocessor with 64 terminals. It operates b/w 0-70°C, suitable for commercial applications. Utilizing MOS technology, it runs at a speed of 3.3 rpm and is commonly used in microprocessor-based systems.

Median Price

$87.205

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

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Ace Electronics

USA . 21 parts In-Stock

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$40.000

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American Microsemiconductor Inc.

USA . 1 parts In-Stock

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$134.410

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Vyrian

USA . 8,064 parts In-Stock

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Digiode

USA . 1,281 parts In-Stock

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Electronic Expediters

USA . 51 parts In-Stock

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Digital Electronic Gebert Verwaltungs UG

Germany . 23 parts In-Stock

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Electronics Depot

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Q Components

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ECAB

Sweden . 2 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 1,287 parts In-Stock

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$11.000

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AZTECH Wire

Italy . 682 parts In-Stock

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$15.263

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Parana Technologies

USA . 1,326 parts In-Stock

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$31.684

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$2,942.340

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$28.516

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$2,942.340

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DigiPath Technology Company

USA . 826 parts In-Stock

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$34.888

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IDEA Electronic Components Group

UK . 1,210 parts In-Stock

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$35.600

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$33.820

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$32.040

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ChromeModa Solutions

Germany . 1,138 parts In-Stock

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$35.600

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$29.192

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Authorized Procurement Solutions

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Corphita

USA . 807 parts In-Stock

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A-Plus Industry Inc.

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Overview

Unleash the power of innovation with the TMS9900JL by Texas Instruments, a top-tier microprocessor designed to deliver unmatched performance and reliability. Crafted with precision using high-quality materials, this technological marvel boasts a sleek rectangular design with 64 terminals, making it ideal for a wide range of applications. From enhancing computing capabilities to driving cutting-edge advancements in technology, the TMS9900JL offers unparalleled value and benefits to customers seeking superior quality and seamless functionality. Experience the difference with Texas Instruments and revolutionize your world today.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide excellent thermal properties, ensuring efficient heat dissipation and making this product reliable for long-term use.

Package Shape: RECTANGULAR

Rectangular shape allows for easier integration into various systems and devices, offering flexibility in design and installation.

Bit Size: 16

16-bit processing capability enables faster and more efficient data processing, making this microprocessor suitable for a wide range of applications.

No. of Terminals: 64

With a higher number of terminals, this microprocessor can support more connectivity options and peripherals, enhancing its functionality and versatility.

Package Style (Meter): IN-LINE

In-line package style allows for easy PCB layout and assembly, simplifying the manufacturing process and reducing production costs.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this microprocessor can withstand harsh environmental conditions and maintain performance under stress.

Minimum Operating Temperature: 0 °C

Having a low minimum operating temperature ensures reliable operation even in cold environments, making this microprocessor suitable for a wide range of applications.

Terminal Position: DUAL

Dual terminal position allows for easier PCB layout and routing, enhancing the overall design efficiency and enabling smoother integration into systems.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures compatibility with most common applications and environments, making this microprocessor a cost-effective solution for various projects.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture provides efficient data processing and high performance, making this microprocessor ideal for demanding computing tasks and applications.

Technology: MOS

MOS technology offers low power consumption and high speed, making this microprocessor energy-efficient and suitable for battery-powered devices or applications where power efficiency is critical.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical connections, ensuring secure mounting and reliable operation in various environments, making this microprocessor suitable for industrial applications.

Terminal Pitch: 2.54 mm

Standard terminal pitch allows for easy integration with existing PCB designs and components, simplifying the installation process and offering compatibility with a wide range of hardware.

Speed: 3.3 rpm

With a high processing speed of 3.3 rpm, this microprocessor can handle complex computing tasks and real-time data processing, making it suitable for applications requiring high performance and responsiveness.

Technical Specifications

Microprocessors TMS9900JL attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Bit Size:

16

JESD-30 Code:

R-XDIP-T64

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP64,.9

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Speed:

3.3 rpm

Sub-Category:

Microprocessors

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

TMS9900JL Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

NSN

5962-01-082-7434, 5962010827434, 5962-01-146-4292, 5962011464292

NIIN

010827434, 011464292

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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