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TMS9900NL

Texas Instruments

TMS9900NL by Texas Instruments

TMS9900NL by Texas Instruments is a 16-bit microprocessor with 64 terminals in an in-line package. Operating temperature ranges from 0 to 70°C, suitable for commercial applications. Utilizes MOS technology with a speed of 3.3 rpm, ideal for RISC-based systems requiring high processing power.

Median Price

$69.580

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

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American Microsemiconductor Inc.

USA . 85 parts In-Stock

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$69.580

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Vyrian

USA . 3,710 parts In-Stock

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Digiode

USA . 2,142 parts In-Stock

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Digital Electronic Gebert Verwaltungs UG

Germany . 58 parts In-Stock

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MRC Electronics

USA . 35 parts In-Stock

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Q Components

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Fibra_Brandt Electronic GMBH

Germany . 18 parts In-Stock

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ECAB

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Holdelec - ElecDif-Pro

France . 7 parts In-Stock

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Euro-Tech

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Electronic Expediters

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Corel Iberica Componentes, S.L.

Spain . 1 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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AZTECH Wire

Italy . 758 parts In-Stock

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$7.054

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758

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One Stop Electronics

USA . 1,366 parts In-Stock

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$11.000

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Parana Technologies

USA . 1,658 parts In-Stock

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$15.426

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$15.806

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DigiPath Technology Company

USA . 1,605 parts In-Stock

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$16.986

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$15.627

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ChromeModa Solutions

Germany . 4,004 parts In-Stock

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$17.333

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$14.213

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$17.333

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IDEA Electronic Components Group

UK . 1,687 parts In-Stock

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$17.333

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$16.466

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$15.600

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A-Z Elektronik GmbH

Germany . 7,494 parts In-Stock

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Corphita

USA . 4,364 parts In-Stock

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Assy Fe

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A-Plus Industry Inc.

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Overview

Unlock the power of cutting-edge technology with the TMS9900NL microprocessor by Texas Instruments. Designed for high performance and reliability, this innovative product is perfect for a wide range of applications. From consumer electronics to industrial automation, the TMS9900NL offers unmatched value and efficiency. Trust in Texas Instruments' reputation for quality and craftsmanship, and experience the advantages that this microprocessor brings to your projects. Elevate your designs and stay ahead of the competition with the TMS9900NL.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the microprocessor, enhancing its durability and reliability.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into various electronic devices and circuit boards.

Bit Size: 16

The 16-bit size allows for efficient processing and handling of data, suitable for a wide range of applications.

No. of Terminals: 64

The high number of terminals enables connectivity with other components and peripherals, enhancing the functionality of the microprocessor.

Package Style (Meter): IN-LINE

The in-line package style makes it easy to install and mount the microprocessor in a space-efficient manner.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this microprocessor can handle moderate heat conditions effectively.

Minimum Operating Temperature: 0 °C

The ability to operate at temperatures as low as 0°C makes this microprocessor suitable for a variety of environments.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC microprocessor, it offers high performance and efficiency for computing tasks, making it a reliable choice for various applications.

Technology: MOS

The MOS technology used in this microprocessor provides low power consumption and faster switching speeds, enhancing overall performance.

Terminal Form: THROUGH-HOLE

The through-hole terminal form offers easy soldering and secure connections, ensuring stable performance in electronic circuits.

Terminal Pitch: 2.54 mm

The 2.54mm terminal pitch allows for easy interfacing with other components and circuit boards, facilitating integration and connectivity.

Speed: 3.3 rpm

With a speed of 3.3 rpm, this microprocessor can process data quickly and efficiently, making it suitable for multitasking and high-speed applications.

Technical Specifications

Microprocessors TMS9900NL attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Bit Size:

16

JESD-30 Code:

R-PDIP-T64

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP64,.9

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Speed:

3.3 rpm

Sub-Category:

Microprocessors

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

TMS9900NL Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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