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TMS9995NL-12

Texas Instruments

TMS9995NL-12 by Texas Instruments

TMS9995NL-12 by Texas Instruments is an 8-bit RISC microprocessor with CMOS technology. It features 40 terminals in a rectangular package style, suitable for commercial applications. Operating temperature ranges from 0°C to 70°C, making it ideal for various embedded systems and industrial automation tasks.

Median Price

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Lifecycle Status

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8

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Bristol Electronics

USA . 5,836 parts In-Stock

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Vyrian

USA . 3,340 parts In-Stock

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Digiode

USA . 142 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Digital Electronic Gebert Verwaltungs UG

Germany . 7 parts In-Stock

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A&K Electronics

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Flex Direct, LLC

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LWI Electronics Inc

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AZTECH Wire

Italy . 795 parts In-Stock

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$11.862

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Ampacity Inc.

Singapore . 1,324 parts In-Stock

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$18.000

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One Stop Electronics

USA . 1,071 parts In-Stock

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$28.000

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Parana Technologies

USA . 1,555 parts In-Stock

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DigiPath Technology Company

USA . 222 parts In-Stock

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$79.137

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ChromeModa Solutions

Germany . 6,716 parts In-Stock

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$66.217

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IDEA Electronic Components Group

UK . 1,522 parts In-Stock

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$76.714

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Lixinc

USA . 19,164 parts In-Stock

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Corphita

USA . 3,657 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Assy Fe

Spain . 1,506 parts In-Stock

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Netroflash

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Kepictronics

USA . 620 parts In-Stock

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SIE Connect GmbH (Excess)

Germany . 1 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the TMS9995NL-12 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers unparalleled quality and reliability in their microprocessors. Perfect for a wide range of applications, this product offers exceptional value and benefits to customers seeking top-notch performance. Upgrade your projects with the TMS9995NL-12 and experience the difference that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection, making the product reliable for long-term use.

Bit Size: 8

8-bit size allows for efficient processing and handling of data, suitable for various applications that do not require high computational power.

No. of Terminals: 40

Having 40 terminals provides enough connectivity options for interfacing with other components or devices, enhancing the versatility of the product.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the product can withstand heat stress and maintain optimal performance in various environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable for battery-operated devices.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections, reducing the risk of disconnection and ensuring stable performance in demanding operating conditions.

Technical Specifications

Microprocessors TMS9995NL-12 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Bit Size:

8

JESD-30 Code:

R-PDIP-T40

No. of Terminals:

40

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Sub-Category:

Microprocessors

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Trade Compliance

TMS9995NL-12 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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