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TMS9900JDL40

Texas Instruments

TMS9900JDL40 by Texas Instruments

TMS9900JDL40 by Texas Instruments is a 16-bit microprocessor with 64 terminals, operating at speeds up to 4.2 rpm. It features MOS technology, commercial temperature grade, and ceramic package suitable for various applications like embedded systems and industrial automation.

Median Price

$80.990

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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American Microsemiconductor Inc.

USA . 1 parts In-Stock

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$61.980

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Ace Electronics

USA . 24 parts In-Stock

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$100.000

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Vyrian

USA . 6,722 parts In-Stock

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Digiode

USA . 2,251 parts In-Stock

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Q Components

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R&J Components

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MRC Electronics

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Digital Electronic Gebert Verwaltungs UG

Germany . 10 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 271 parts In-Stock

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$12.245

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One Stop Electronics

USA . 834 parts In-Stock

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$33.000

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Parana Technologies

USA . 1,085 parts In-Stock

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$69.918

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DigiPath Technology Company

USA . 1,315 parts In-Stock

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$76.988

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ChromeModa Solutions

Germany . 6,304 parts In-Stock

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$78.559

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$64.418

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IDEA Electronic Components Group

UK . 819 parts In-Stock

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$78.559

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$74.631

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$70.703

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819

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A-Z Elektronik GmbH

Germany . 6,785 parts In-Stock

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Corphita

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A-Plus Industry Inc.

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Overview

Elevate your electronic designs with the TMS9900JDL40 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers superior quality microprocessors that are perfect for a wide range of applications. With its advanced technology and high-speed performance, this versatile chip offers unmatched value and benefits to customers looking to optimize their projects. Whether you're working on robotics, automation, or telecommunications, the TMS9900JDL40 is the reliable solution you need to take your creations to the next level.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide good thermal conductivity and stability, making this microprocessor reliable and efficient in terms of heat dissipation.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration and placement within electronic circuits, contributing to a more streamlined design.

Bit Size: 16

Having a bit size of 16 allows for processing a moderate amount of data efficiently, making it suitable for various applications.

No. of Terminals: 64

With 64 terminals, this microprocessor can handle multiple connections and input/output operations, enhancing its versatility.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this microprocessor can withstand relatively high temperatures, increasing its reliability in different environments.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC (Reduced Instruction Set Computing) microprocessor allows for faster and more efficient processing of instructions, making this product a powerful choice for computing tasks.

Technology: MOS

MOS (Metal Oxide Semiconductor) technology enables low power consumption and high speed performance, making this microprocessor energy-efficient and suitable for demanding applications.

Speed: 4.2 rpm

With a speed of 4.2 revolutions per minute, this microprocessor can deliver quick data processing and calculations, making it a reliable choice for tasks that require speed.

Technical Specifications

Microprocessors TMS9900JDL40 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Bit Size:

16

JESD-30 Code:

R-XDIP-T64

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP64,.9

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Speed:

4.2 rpm

Sub-Category:

Microprocessors

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

TMS9900JDL40 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

NSN

5962-01-146-4292, 5962011464292

NIIN

011464292

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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