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TMS320DM8127SCYE3

Texas Instruments

TMS320DM8127SCYE3 by Texas Instruments

TMS320DM8127SCYE3 by Texas Instruments is a 32-bit microprocessor with 8-bit data RAM width, 16-bit external data bus width, and max clock frequency of 30 MHz. It is used in applications requiring high-speed processing such as embedded systems, industrial automation, and digital signal processing.

Median Price

$107.420

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 15 parts In-Stock

1+ parts

$107.420

100+ parts

$82.410

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15

$107.420

$82.410

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,387 parts In-Stock

1+ parts

$82.897

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3,387

$82.897

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Vyrian

USA . 5,331 parts In-Stock

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5,331

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Chip Stock

USA . 635 parts In-Stock

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635

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Sensible Micro Corp

USA . 93 parts In-Stock

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93

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,330 parts In-Stock

1+ parts

$69.696

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-

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1,330

$69.696

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Ampacity Inc.

Singapore . 15 parts In-Stock

1+ parts

$74.170

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15

$74.170

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DigiPath Technology Company

USA . 1,401 parts In-Stock

1+ parts

$76.744

100+ parts

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1,401

$76.744

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ChromeModa Solutions

Germany . 6,599 parts In-Stock

1+ parts

$78.310

100+ parts

$64.214

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6,599

$78.310

$64.214

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IDEA Electronic Components Group

UK . 1,240 parts In-Stock

1+ parts

$78.310

100+ parts

$74.394

1k+ parts

$70.479

10k+ parts

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1,240

$78.310

$74.394

$70.479

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Corphita

USA . 3,057 parts In-Stock

1+ parts

$78.534

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3,057

$78.534

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iodParts Technologies Inc.

India . 7,128 parts In-Stock

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7,128

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A-Z Elektronik GmbH

Germany . 4,932 parts In-Stock

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4,932

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Kepictronics

USA . 285 parts In-Stock

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285

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Overview

Experience unparalleled performance and efficiency with the TMS320DM8127SCYE3 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microprocessors that cater to a wide range of applications. Whether you're looking to enhance your embedded systems, digital signal processing, or industrial control projects, this product offers unmatched value and benefits. With integrated cache, high-speed clock frequency, and low power mode, you can trust that the TMS320DM8127SCYE3 will exceed your expectations and elevate your designs to new heights. Elevate your projects with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the microprocessor lightweight and durable, ideal for portable devices.

Integrated Cache: YES

Having integrated cache helps in faster data access, improving the overall performance of the microprocessor.

Maximum Supply Voltage: 1.42 V

The maximum supply voltage allows for efficient power usage while providing enough voltage for the microprocessor to operate at optimal levels.

Address Bus Width: 28

With a wide address bus width of 28, the microprocessor can access a large amount of memory which is beneficial for handling complex computational tasks.

Bit Size: 32

With a bit size of 32, the microprocessor can handle 32 bits of data at a time, increasing the efficiency of processing tasks.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature of 90°C ensures the microprocessor can perform reliably under demanding conditions.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC (Reduced Instruction Set Computing) microprocessor, it is optimized for speed and efficiency in handling instructions, making it a good choice for high-performance applications.

Technology: CMOS

CMOS technology offers low power consumption and high speed, making the microprocessor energy-efficient while delivering excellent performance.

Technical Specifications

Microprocessors TMS320DM8127SCYE3 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B684

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

72

No. of Terminals:

684

On Chip Data RAM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

RAM Words:

851968

Maximum Seated Height:

3.06 mm

Speed:

1000 rpm

Maximum Supply Voltage:

1.42 V

Minimum Supply Voltage:

1.28 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320DM8127SCYE3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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