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TLK2521IPAP

Texas Instruments

TLK2521IPAP by Texas Instruments

TLK2521IPAP by Texas Instruments is a telecom IC with 64 terminals, operating at -40 to 85°C. It has a supply voltage of 2.5V and uses CMOS technology. The package is a square flatpack with thin profile, suitable for telecom circuit applications.

Median Price

$15.910

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 11,351 parts In-Stock

1+ parts

$15.910

100+ parts

$15.590

1k+ parts

$15.270

10k+ parts

-

11,351

$15.910

$15.590

$15.270

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Distributors (In-Stock)

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Vyrian

USA . 3,109 parts In-Stock

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3,109

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Chip Stock

USA . 285 parts In-Stock

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285

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Digiode

USA . 269 parts In-Stock

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269

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 903 parts In-Stock

1+ parts

$13.652

100+ parts

-

1k+ parts

$14.152

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903

$13.652

-

$14.152

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DigiPath Technology Company

USA . 1,113 parts In-Stock

1+ parts

$15.032

100+ parts

$13.830

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1,113

$15.032

$13.830

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AZTECH Wire

Italy . 849 parts In-Stock

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$15.220

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849

$15.220

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IDEA Electronic Components Group

UK . 2,075 parts In-Stock

1+ parts

$15.339

100+ parts

$14.572

1k+ parts

$13.805

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2,075

$15.339

$14.572

$13.805

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ChromeModa Solutions

Germany . 2,017 parts In-Stock

1+ parts

$15.339

100+ parts

$12.578

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2,017

$15.339

$12.578

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Semicontronic

India . 826 parts In-Stock

1+ parts

$149.000

100+ parts

$145.275

1k+ parts

$144.530

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826

$149.000

$145.275

$144.530

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One Stop Electronics

USA . 655 parts In-Stock

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$815.000

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655

$815.000

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QUARKTWIN TECHNOLOGY LTD

USA . 18,883 parts In-Stock

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Metaverse IC Inc.

Canada . 10,238 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,509 parts In-Stock

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Microchip USA

USA . 4,646 parts In-Stock

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Corphita

USA . 4,577 parts In-Stock

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4,577

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Kepictronics

USA . 2,000 parts In-Stock

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2,000

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GreenTree Electronics

Israel . 1,000 parts In-Stock

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Corohmni

South Africa . 498 parts In-Stock

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498

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Overview

Unlock seamless communication experiences with the TLK2521IPAP by Texas Instruments. Crafted with precision and expertise, this telecom interface IC offers unparalleled quality and reliability for a wide range of applications. From industrial settings to consumer electronics, this product delivers exceptional value, benefits, and advantages to customers seeking top-notch performance. Trust in Texas Instruments to provide cutting-edge technology that elevates your communication solutions to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material combination provides durability and protection for the telecom interface IC, making it suitable for various environments and applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto PCBs, simplifying the manufacturing process.

Power Supplies (V): 2.5

The 2.5V power supply ensures compatibility with common power sources, making integration into existing systems seamless.

No. of Terminals: 64

Having a high number of terminals allows for a wide range of connectivity options, enhancing the versatility of the telecom interface IC.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this telecom interface IC can withstand tough environmental conditions, ensuring reliable performance.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, enhancing overall efficiency and reliability.

Technical Specifications

Other Function Telecom Interface ICs TLK2521IPAP attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TLK2521IPAP Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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