Loading...

SN74V3670-10PEU

Texas Instruments

SN74V3670-10PEU by Texas Instruments

SN74V3670-10PEU by Texas Instruments is a FIFO memory with 8Kx36 organization, operating at 100MHz with a cycle time of 10ns. It features synchronous operation and parallel interface, suitable for applications requiring fast data storage and retrieval in commercial temperature environments.

Median Price

$25.170

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 648 parts In-Stock

1+ parts

-

100+ parts

$25.170

1k+ parts

-

10k+ parts

-

648

-

$25.170

-

-

Rochester

USA . 360 parts In-Stock

1+ parts

-

100+ parts

$21.780

1k+ parts

$19.490

10k+ parts

$18.340

360

-

$21.780

$19.490

$18.340

Verical

USA . 360 parts In-Stock

1+ parts

-

100+ parts

$27.225

1k+ parts

$24.363

10k+ parts

$22.925

360

-

$27.225

$24.363

$22.925

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,059 parts In-Stock

1+ parts

$22.990

100+ parts

-

1k+ parts

-

10k+ parts

-

2,059

$22.990

-

-

-

Vyrian

USA . 2,061 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,061

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,072 parts In-Stock

1+ parts

$3.351

100+ parts

-

1k+ parts

$3.876

10k+ parts

-

2,072

$3.351

-

$3.876

-

DigiPath Technology Company

USA . 1,960 parts In-Stock

1+ parts

$3.690

100+ parts

-

1k+ parts

-

10k+ parts

-

1,960

$3.690

-

-

-

ChromeModa Solutions

Germany . 1,341 parts In-Stock

1+ parts

$3.765

100+ parts

$3.087

1k+ parts

-

10k+ parts

-

1,341

$3.765

$3.087

-

-

IDEA Electronic Components Group

UK . 372 parts In-Stock

1+ parts

$3.765

100+ parts

-

1k+ parts

$3.388

10k+ parts

-

372

$3.765

-

$3.388

-

Corphita

USA . 1,397 parts In-Stock

1+ parts

$21.780

100+ parts

-

1k+ parts

-

10k+ parts

-

1,397

$21.780

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 22,081 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

22,081

-

-

-

-

Microchip USA

USA . 5,799 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,799

-

-

-

-

Overview

Experience seamless data transfer and efficient memory management with the SN74V3670-10PEU by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in all its products. This FIFO device is versatile and can be used in various applications such as networking, telecommunications, and industrial automation. With a cycle time of 10 ns and a maximum clock frequency of 100 MHz, this product offers high performance and speed. Trust Texas Instruments to provide you with the cutting-edge technology you need for your projects. Unlock the potential of your systems with the SN74V3670-10PEU today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside the package, ensuring reliability in various operating conditions.

Cycle Time: 10 ns

The fast cycle time allows for quick data retrieval and processing, making this FIFO product suitable for high-speed applications.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage is commonly used in many electronic systems, making integration of this FIFO seamless in existing setups.

Maximum Clock Frequency (fCLK): 100 MHz

With a high clock frequency, this FIFO can handle data input and output operations at a rapid pace, ideal for demanding tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of this FIFO product.

Technical Specifications

FIFO SN74V3670-10PEU attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

6.5 ns

Maximum Clock Frequency (fCLK):

100 MHz

Cycle Time:

10 ns

JESD-30 Code:

R-PQFP-G128

Length:

20 mm

Memory Density:

294912 bit

Memory IC Type:

Memory Width:

36

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

128

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

8KX36

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

FIFOs

Maximum Supply Current:

40 mA

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

SN74V3670-10PEU Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20