Loading...

SN74ALVC7804-25DLR

Texas Instruments

SN74ALVC7804-25DLR by Texas Instruments

SN74ALVC7804-25DLR by Texas Instruments is a 512x18 FIFO memory IC with a cycle time of 25 ns and max clock frequency of 40 MHz. It operates at a nominal voltage of 3.3V and is commonly used in applications requiring high-speed data buffering and storage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,839 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,839

-

-

-

-

Digiode

USA . 3,792 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,792

-

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,247 parts In-Stock

1+ parts

$1.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,247

$1.000

-

-

-

Parana Technologies

USA . 1,703 parts In-Stock

1+ parts

$1.880

100+ parts

-

1k+ parts

$2.425

10k+ parts

-

1,703

$1.880

-

$2.425

-

DigiPath Technology Company

USA . 667 parts In-Stock

1+ parts

$2.070

100+ parts

$1.904

1k+ parts

-

10k+ parts

-

667

$2.070

$1.904

-

-

ChromeModa Solutions

Germany . 4,018 parts In-Stock

1+ parts

$2.112

100+ parts

$1.732

1k+ parts

-

10k+ parts

-

4,018

$2.112

$1.732

-

-

IDEA Electronic Components Group

UK . 1,934 parts In-Stock

1+ parts

$2.112

100+ parts

-

1k+ parts

$1.901

10k+ parts

-

1,934

$2.112

-

$1.901

-

Corohmni

South Africa . 91 parts In-Stock

1+ parts

$3.916

100+ parts

-

1k+ parts

-

10k+ parts

-

91

$3.916

-

-

-

Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$4.036

100+ parts

$3.673

1k+ parts

$3.310

10k+ parts

-

350

$4.036

$3.673

$3.310

-

AZTECH Wire

Italy . 243 parts In-Stock

1+ parts

$12.540

100+ parts

-

1k+ parts

-

10k+ parts

-

243

$12.540

-

-

-

One Stop Electronics

USA . 1,348 parts In-Stock

1+ parts

$24.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,348

$24.000

-

-

-

Continental Prestige Electronics

USA . 6,949 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,949

-

-

-

-

Corphita

USA . 3,311 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,311

-

-

-

-

Argo Parts USA

USA . 3,149 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,149

-

-

-

-

Microchip USA

USA . 481 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

481

-

-

-

-

Aranea Global

USA . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Overview

Experience seamless data transfer and enhanced performance with the SN74ALVC7804-25DLR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees exceptional quality and reliability. The SN74ALVC7804-25DLR is a powerful FIFO device that offers numerous benefits to customers. With its synchronous operating mode and 25 ns cycle time, it enables lightning-fast data transfers. Its compact size and surface mount package make it easy to integrate into any application. Whether you're working on telecommunications, networking, or industrial automation projects, this versatile device will streamline your operations and deliver unparalleled results. Trust Texas Instruments for the finest technology solutions that exceed your expectations. Elevate your projects with the SN74ALVC7804-25DLR today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product is made of durable plastic/epoxy material, ensuring long-lasting and reliable /formance.

Surface Mount: YES

The surface mount feature allows for easy installation and integration into various electronic devices, making it ideal for compact design applications.

Cycle Time: 25 ns

With a fast cycle time of 25 ns, this FIFO product enables quick and efficient data transfer, enhancing system /formance.

Package Shape: RECTANGULAR

The rectangular package shape offers compatibility with standard PCB designs, making integration simple and convenient.

O/ating Mode: SYNCHRONOUS

The synchronous o/ating mode ensures synchronized data transfer, minimizing data errors and ensuring accurate communication between components.

Nominal Supply Voltage / Vsup (V): 3.3

O/ating at a nominal supply voltage of 3.3V, this product promotes energy efficiency and compatibility with various power supply systems.

Power Supplies (V): 3.3

This product utilizes a single 3.3V power supply, reducing the complexity of the power management system and improving overall reliability.

No. of Terminals: 56

With its 56 terminals, this FIFO offers versatile connectivity options and compatibility with various data transmission protocols.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style provides a compact footprint, allowing for space-saving designs and integration in tight spaces.

Maximum O/ating Tem/ature: 70 °C

With a maximum o/ating tem/ature of 70°C, this product can withstand high-tem/ature environments, ensuring reliable o/ation under challenging conditions.

Organization: 512X18

The 512X18 organization offers ample storage capacity for data, making this FIFO suitable for applications that require large data buffering.

Output Characteristics: 3-STATE

The 3-STATE output characteristics enable bus sharing, allowing multiple devices to be connected to the same data lines without interference.

Minimum O/ating Tem/ature: 0 °C

This product can o/ate in tem/atures as low as 0°C, ensuring reliable /formance even in cold environments.

Terminal Position: DUAL

The dual terminal position allows for flexible mounting options, providing versatility in system integration.

Maximum Seated Height: 2.79 mm

With its low maximum seated height, this FIFO product reduces space constraints and enables compact designs in height-limited applications.

Maximum Clock Frequency (fCLK): 40 MHz

The high maximum clock frequency of 40 MHz allows for fast data transfer rates, enhancing the overall system speed and /formance.

Width: 7.5 mm

With a compact width of 7.5 mm, this product is suitable for space-constrained applications where size optimization is crucial.

Minimum Supply Voltage (Vsup): 3.3 V

O/ating with a minimum supply voltage of 3.3V, this FIFO ensures compatibility with a wide range of power sources.

Length: 18.415 mm

The length of 18.415 mm offers a compact form factor, making it suitable for applications where space is limited.

Tem/ature Grade: COMMERCIAL

This product is designed to o/ate reliably within commercial tem/ature ranges, ensuring its suitability for most standard electronic devices.

Technology: CMOS

Utilizing CMOS technology, this FIFO offers low power consumption, fast switching speed, and high noise immunity, making it an energy-efficient and reliable choice.

Parallel or Serial: PARALLEL

Supporting parallel data transfer, this FIFO enables simultaneous and efficient data communication, ideal for applications that require high throughput.

Terminal Form: GULL WING

The gull wing terminal form ensures easy soldering and reliable mechanical connection, simplifying the manufacturing and assembly process.

No. of Words: 512 words

With a capacity of 512 words, this FIFO provides ample storage for data, enabling efficient buffering and transfer capabilities.

Memory Width: 18

The memory width of 18 allows for efficient storage and retrieval of data in 18-bit chunks, facilitating compatibility with various data formats and protocols.

Terminal Pitch: 0.635 mm

The small terminal pitch of 0.635 mm allows for high-density circuit board layouts, enabling integration in space-constrained applications.

No. of Words Code: 512

The 512-word code accommodates a wide range of data storage requirements, making this FIFO suitable for diverse applications that demand extensive memory.

Maximum Supply Voltage (Vsup): 3.6 V

With a maximum supply voltage of 3.6V, this FIFO can tolerate voltage fluctuations, ensuring reliable o/ation even in less stable power supply conditions.

Memory Density: 9216 bit

This FIFO offers a total memory density of 9216 bits, providing ample storage capacity for data buffering and transfer requirements.

Memory IC Type: OTHER FIFO

Designed as an "other" type of FIFO memory integrated circuit (IC), this product offers specific features and functionalities, catering to unique application needs.

Output Enable: YES

The output enable feature allows for control over the FIFO's output signal, enabling improved data integrity and system flexibility.

Maximum Access Time: 22 ns

With a maximum access time of 22 ns, this FIFO guarantees quick data retrieval, contributing to efficient and responsive system /formance.

Technical Specifications

FIFO SN74ALVC7804-25DLR attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

22 ns

Maximum Clock Frequency (fCLK):

40 MHz

Cycle Time:

25 ns

JESD-30 Code:

R-PDSO-G56

Length:

18.415 mm

Memory Density:

9216 bit

Memory IC Type:

Memory Width:

18

No. of Functions:

1

No. of Terminals:

56

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512X18

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP56,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Sub-Category:

FIFOs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3.3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

SN74ALVC7804-25DLR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20