Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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SN74ALVC7804-25DLR by Texas Instruments is a 512x18 FIFO memory IC with a cycle time of 25 ns and max clock frequency of 40 MHz. It operates at a nominal voltage of 3.3V and is commonly used in applications requiring high-speed data buffering and storage.
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$2.070
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$2.112
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This product is made of durable plastic/epoxy material, ensuring long-lasting and reliable /formance.
The surface mount feature allows for easy installation and integration into various electronic devices, making it ideal for compact design applications.
With a fast cycle time of 25 ns, this FIFO product enables quick and efficient data transfer, enhancing system /formance.
The rectangular package shape offers compatibility with standard PCB designs, making integration simple and convenient.
The synchronous o/ating mode ensures synchronized data transfer, minimizing data errors and ensuring accurate communication between components.
O/ating at a nominal supply voltage of 3.3V, this product promotes energy efficiency and compatibility with various power supply systems.
This product utilizes a single 3.3V power supply, reducing the complexity of the power management system and improving overall reliability.
With its 56 terminals, this FIFO offers versatile connectivity options and compatibility with various data transmission protocols.
The small outline and shrink pitch package style provides a compact footprint, allowing for space-saving designs and integration in tight spaces.
With a maximum o/ating tem/ature of 70°C, this product can withstand high-tem/ature environments, ensuring reliable o/ation under challenging conditions.
The 512X18 organization offers ample storage capacity for data, making this FIFO suitable for applications that require large data buffering.
The 3-STATE output characteristics enable bus sharing, allowing multiple devices to be connected to the same data lines without interference.
This product can o/ate in tem/atures as low as 0°C, ensuring reliable /formance even in cold environments.
The dual terminal position allows for flexible mounting options, providing versatility in system integration.
With its low maximum seated height, this FIFO product reduces space constraints and enables compact designs in height-limited applications.
The high maximum clock frequency of 40 MHz allows for fast data transfer rates, enhancing the overall system speed and /formance.
With a compact width of 7.5 mm, this product is suitable for space-constrained applications where size optimization is crucial.
O/ating with a minimum supply voltage of 3.3V, this FIFO ensures compatibility with a wide range of power sources.
The length of 18.415 mm offers a compact form factor, making it suitable for applications where space is limited.
This product is designed to o/ate reliably within commercial tem/ature ranges, ensuring its suitability for most standard electronic devices.
Utilizing CMOS technology, this FIFO offers low power consumption, fast switching speed, and high noise immunity, making it an energy-efficient and reliable choice.
Supporting parallel data transfer, this FIFO enables simultaneous and efficient data communication, ideal for applications that require high throughput.
The gull wing terminal form ensures easy soldering and reliable mechanical connection, simplifying the manufacturing and assembly process.
With a capacity of 512 words, this FIFO provides ample storage for data, enabling efficient buffering and transfer capabilities.
The memory width of 18 allows for efficient storage and retrieval of data in 18-bit chunks, facilitating compatibility with various data formats and protocols.
The small terminal pitch of 0.635 mm allows for high-density circuit board layouts, enabling integration in space-constrained applications.
The 512-word code accommodates a wide range of data storage requirements, making this FIFO suitable for diverse applications that demand extensive memory.
With a maximum supply voltage of 3.6V, this FIFO can tolerate voltage fluctuations, ensuring reliable o/ation even in less stable power supply conditions.
This FIFO offers a total memory density of 9216 bits, providing ample storage capacity for data buffering and transfer requirements.
Designed as an "other" type of FIFO memory integrated circuit (IC), this product offers specific features and functionalities, catering to unique application needs.
The output enable feature allows for control over the FIFO's output signal, enabling improved data integrity and system flexibility.
With a maximum access time of 22 ns, this FIFO guarantees quick data retrieval, contributing to efficient and responsive system /formance.
FIFO SN74ALVC7804-25DLR attributes and parameters. Explore more FIFO devices from Texas Instruments
Maximum Access Time:
Maximum Clock Frequency (fCLK):
Cycle Time:
JESD-30 Code:
Length:
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Memory IC Type:
Memory Width:
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Output Characteristics:
Output Enable:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
Maximum Seated Height:
Sub-Category:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
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SN74ALVC7804-25DLR Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
LL4148
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
M39029/56-351
Carlisle Interconnect Technologies
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Type: CRIMP; Removal Tools: M81969/8-06, M81969/14-02; IEC Conformity: NO; Contact Gender: FEMALE;
SS14
Hy Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Yangzhou Yangjie Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.05 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
DS18B20U
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -55 Cel; Package Equivalence Code: TSSOP8,.19;
BAV99
STMicroelectronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Fairchild Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .6 A;
Crimson Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148
Rfe International
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Forward Voltage (VF): 1 V; Config: SINGLE;
1552200168
Molex
WIRE AND CABLE;
Shanghai Lunsure Electronic Technology
DS18B20+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Package Shape or Style: RECTANGULAR; Maximum Operating Current: 1.5 mA; Package Equivalence Code: SIP3,.1,50;
08055C104KAT2A
KYOCERA AVX
08055C104KAT2A by KYOCERA AVX is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications requiring compact size and reliable performance in various electronic circuits.
BAT54SLT1G
Onsemi
BAT54SLT1G by Onsemi is a fast recovery Schottky diode with 2 elements in series connected configuration. It has a max reverse recovery time of 0.005 us and a max forward voltage of 0.8 V. Ideal for applications requiring high-speed rectification, it operates b/w -55 to 150 °C and can handle a max output current of 0.2 A.
M24308/2-1F
Cristek Interconnects
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; No. of Rows Loaded: 2; Shell Size: 1/E; Filter Feature: NO;
ISO1050DUBR
Texas Instruments
ISO1050DUBR by Texas Instruments is a network interface IC with 8 terminals, operating from -55 to 105°C. It features a small outline package, nickel palladium gold finish, and gull wing terminal form. Ideal for telecom applications requiring a 5V supply voltage and peak reflow temperature of 260°C.
BSS138
General Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Minimum DS Breakdown Voltage: 50 V; Qualification: Not Qualified;
Capar Components
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Forward Voltage (VF): 1 V; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Output Current: .15 A;
2N7002
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 240; Terminal Finish: TIN LEAD;
SN74ACT3642-30PCBR
SN74ACT3642-30PCBR by Texas Instruments is a FIFO with 1KX36 organization, 30 ns cycle time, and 5V nominal voltage. It is used in applications requiring fast data transfer and storage, such as networking equipment and telecommunications systems.
5962-8986305YA
Integrated Device Technology
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): 240;
7202LA50JG
Renesas Electronics
Renesas Electronics' 7202LA50JG is a FIFO chip carrier with 1Kx9 organization, operating at 15MHz clock frequency. It has a cycle time of 65ns and can handle parallel data transfer. Ideal for applications requiring fast asynchronous memory access in commercial temperature environments.
IDT72V255LA10PFG8
IDT72V255LA10PFG8 by Renesas Electronics is a 3.3V FIFO with 8Kx18 organization, operating at 100MHz clock frequency. Suitable for commercial applications, it offers a cycle time of 10ns, synchronous operation, and parallel interface for efficient data transfer.
SN74ABT7819-20PN
SN74ABT7819-20PN by Texas Instruments is a FIFO memory with 512x18 organization, operating at 20ns cycle time and 50MHz clock frequency. It is used in applications requiring fast data storage and retrieval, featuring a 3-STATE output characteristic and GULL WING terminal form for parallel communication.
72V841L10TFG8
BI-DIRECTIONAL FIFO; Terminal Finish: Tin (Sn); JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): 260;
SN54ACT3641HFP
SN54ACT3641HFP by Texas Instruments is a 1Kx36 CMOS FIFO memory IC with 50 MHz clock frequency, 20 ns cycle time, and operates at 5V. It is used in military-grade applications requiring fast data storage and retrieval with a memory density of 36864 bits.
IDT72V235L10TFG8
IDT72V235L10TFG8 by Renesas Electronics is a 2Kx18 FIFO with 10ns cycle time, operating at 3.3V. It features synchronous operation, parallel interface, and output enable function. Ideal for applications requiring fast data transfer and memory management in commercial temperature environments.
SN74ACT7203L-15DVR
SN74ACT7203L-15DVR by Texas Instruments is a FIFO with 2KX9 organization, 25 ns cycle time, and 15 ns max access time. It operates asynchronously at a supply voltage of 4.5V to 5.5V. Ideal for applications requiring fast data transfer and storage in commercial temperature environments.
72V3660L6PFG8
The Renesas Electronics 72V3660L6PFG8 is a FIFO memory IC with a cycle time of 6 ns and an operating frequency of up to 166 MHz. It has a memory density of 147456 bits and is commonly used in applications requiring high-speed data buffering and storage.
SN74ACT3641-30PQ
SN74ACT3641-30PQ by Texas Instruments is a 1Kx36 CMOS FIFO memory with 30ns cycle time, operating at 5V. It features synchronous operation, 3-STATE output characteristics, and a max clock frequency of 33.4MHz. Ideal for applications requiring high-speed data storage and retrieval in commercial temperature environments.
CD74HCT40105ME4
CD74HCT40105ME4 by Texas Instruments is a FIFO IC with 16x4 organization, operating at 5V. It features a cycle time of 100ns, synchronous mode, and max clock frequency of 10MHz. Ideal for military applications due to its temperature grade and memory density of 64 bits.
CD40105BD
CD40105BD by Texas Instruments is a 16X4 FIFO with 125ns cycle time, operating at 1.5MHz clock frequency. Suitable for military applications, it has a memory density of 64 bit and operates in parallel mode.
SN74ACT3622-15PCBR
SN74ACT3622-15PCBR by Texas Instruments is a FIFO with 256x36 organization, 15 ns cycle time, and 5V nominal voltage. It is used in applications requiring fast synchronous operation and 9216-bit memory density.
IDT7202LA35JG
IDT7202LA35JG by Renesas Electronics is a FIFO chip with 1Kx9 organization and 1024 words capacity. It operates asynchronously with a cycle time of 45ns, making it suitable for high-speed data buffering applications. The chip features 3-STATE output characteristics and supports parallel communication, ideal for systems requiring fast and efficient data storage and retrieval.
SN74ACT3622-20PCB
SN74ACT3622-20PCB by Texas Instruments is a FIFO memory IC with 256x36 organization, operating at 20ns cycle time and 50MHz clock frequency. It features a parallel interface, synchronous operation, and 3-state output characteristics. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
SN54ALS232AFK
SN54ALS232AFK by Texas Instruments is a 16x4 FIFO chip carrier with 3-STATE output, operating at 25 MHz with a cycle time of 40 ns. It has a synchronous mode and operates b/w -55 to 125 °C. Ideal for military-grade applications requiring fast parallel memory access.
72V241L10PFG
The Renesas Electronics 72V241L10PFG is a FIFO memory with 4Kx9 organization, operating at 100MHz clock frequency and 10ns cycle time. It is used in applications requiring fast synchronous data storage and retrieval, such as networking equipment and communication systems.
SN74ACT3622-15PQR
SN74ACT3622-15PQR by Texas Instruments is a FIFO with 256x36 organization, 15 ns cycle time, and 5V nominal voltage. It is used in applications requiring fast synchronous operation and 3-STATE output characteristics. Ideal for commercial temperature grade environments needing high memory density and parallel data transfer.
SN74ACT7203L25NP
SN74ACT7203L25NP by Texas Instruments is a FIFO memory with 2Kx9 organization, 2048 words, and 18432-bit memory density. It operates at a max clock frequency of 28.8 MHz and has a cycle time of 35 ns. This device is commonly used in applications requiring fast asynchronous data storage and retrieval.
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LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
SN74V293-6PZA
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 80; Package Code: LQFP; Package Shape: SQUARE; No. of Functions: 1;
SN74V245-15PAG
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: TFQFP; Package Shape: SQUARE; Organization: 4KX18;
SN74V293-7PZA
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 80; Package Code: LQFP; Package Shape: SQUARE; JESD-30 Code: S-PQFP-G80;
SN74V245-10PAG
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: TFQFP; Package Shape: SQUARE; Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH;
SN74V235-7PAG
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: TFQFP; Package Shape: SQUARE; Parallel or Serial: PARALLEL;
SN74V245-7PAG
SN74V245-7PAG by Texas Instruments is a FIFO with 4Kx18 organization, operating at 166MHz. It features a cycle time of 7.5ns, synchronous mode, and 3-state output characteristics. This memory IC type is suitable for applications requiring fast data transfer and parallel operation in commercial temperature environments.
SN74V215-7PAG
SN74V215-7PAG by Texas Instruments is a FIFO with 512x18 organization, operating at 133 MHz clock frequency. It features a cycle time of 7.5 ns and operates at a nominal voltage of 3.3 V. This device is ideal for applications requiring fast data storage and retrieval in synchronous mode with 3-STATE output characteristics.
SN74ACT7201LA-25NP
SN74ACT7201LA-25NP by Texas Instruments is a FIFO with 512x9 organization, 35ns cycle time, and 28.5MHz max clock frequency. It operates at 5V, has a temp range of 0-70°C, and is ideal for parallel memory applications due to its CMOS technology and 3-STATE output characteristics.
SN74ACT7202LA25NP
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 5;
SN74V263-6PZA
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 80; Package Code: LQFP; Package Shape: SQUARE; Qualification: Not Qualified;
SN74V215-10PAG
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: TFQFP; Package Shape: SQUARE; JESD-609 Code: e4;
SN74V245-15PAGEP
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 64; Package Code: TFQFP; Package Shape: SQUARE; Parallel or Serial: PARALLEL;
SN74V215-20PAG
SN74V215-20PAG by Texas Instruments is a FIFO memory IC with 512x18 organization and 512 words code. It operates synchronously with a cycle time of 20 ns and has a max clock frequency of 133 MHz. This IC is commonly used in applications that require high-speed data buffering and storage.
SN74V283-15PZA
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 80; Package Code: LQFP; Package Shape: SQUARE; Maximum Standby Current: .015 Amp;
SN74ALVC7803-40DL
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 56; Package Code: SSOP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel;
SN74ABT7819A-15PN
SN74ABT7819A-15PN by Texas Instruments is a 512KX18 BI-DIRECTIONAL FIFO with a cycle time of 15 ns and max clock frequency of 67 MHz. It is commonly used in applications requiring high-speed data buffering and storage.
SN74ABT7819A-30PH
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 80; Package Code: QFP; Package Shape: RECTANGULAR; Organization: 512KX18;
SN74V235-10PAG
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: TFQFP; Package Shape: SQUARE; Surface Mount: YES;
SN74ABT7819A-10PN
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 80; Package Code: LFQFP; Package Shape: SQUARE; Cycle Time: 10 ns;
SN74ABT7819A-15PH
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 80; Package Code: QFP; Package Shape: RECTANGULAR; Minimum Operating Temperature: 0 Cel;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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