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SN74V283-10PZA

Texas Instruments

SN74V283-10PZA by Texas Instruments

SN74V283-10PZA by Texas Instruments is a FIFO memory with 32Kx18 organization, 166 MHz clock frequency, and 10 ns cycle time. It operates synchronously at 3.3V and has a low profile flatpack package shape. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.

Median Price

$30.870

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 419 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

419

-

-

-

-

Rochester

USA . 387 parts In-Stock

1+ parts

-

100+ parts

$27.440

1k+ parts

$24.550

10k+ parts

$23.100

387

-

$27.440

$24.550

$23.100

Verical

USA . 374 parts In-Stock

1+ parts

-

100+ parts

$34.300

1k+ parts

$30.688

10k+ parts

$28.875

374

-

$34.300

$30.688

$28.875

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 541 parts In-Stock

1+ parts

$28.966

100+ parts

-

1k+ parts

-

10k+ parts

-

541

$28.966

-

-

-

Vyrian

USA . 5,498 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,498

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 103 parts In-Stock

1+ parts

$2.479

100+ parts

-

1k+ parts

$2.971

10k+ parts

-

103

$2.479

-

$2.971

-

DigiPath Technology Company

USA . 2,284 parts In-Stock

1+ parts

$2.729

100+ parts

$2.511

1k+ parts

-

10k+ parts

-

2,284

$2.729

$2.511

-

-

ChromeModa Solutions

Germany . 5,540 parts In-Stock

1+ parts

$2.785

100+ parts

$2.284

1k+ parts

-

10k+ parts

-

5,540

$2.785

$2.284

-

-

IDEA Electronic Components Group

UK . 522 parts In-Stock

1+ parts

$2.785

100+ parts

-

1k+ parts

$2.506

10k+ parts

-

522

$2.785

-

$2.506

-

Microchip USA

USA . 122 parts In-Stock

1+ parts

$6.180

100+ parts

$6.160

1k+ parts

$6.160

10k+ parts

$6.140

122

$6.180

$6.160

$6.160

$6.140

Corphita

USA . 3,363 parts In-Stock

1+ parts

$27.441

100+ parts

-

1k+ parts

-

10k+ parts

-

3,363

$27.441

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 14,321 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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14,321

-

-

-

-

Overview

Experience unparalleled efficiency and reliability with the SN74V283-10PZA by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products like this FIFO memory that are essential for various applications. With a seamless synchronous operating mode and fast cycle time of 10 ns, this product ensures optimal performance. Its 3-STATE output characteristics and low profile package design make it a versatile solution for any project. Trust Texas Instruments to provide cutting-edge technology that exceeds expectations and enhances your applications. Choose the SN74V283-10PZA for unmatched value and superior results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the components inside the package, ensuring long-term reliability.

Cycle Time: 10 ns

Fast cycle time of 10 ns allows for quick data transfer and efficient operation, making the product suitable for high-speed applications.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a voltage of 3.3V ensures efficient power consumption and compatibility with standard supply voltages.

Maximum Clock Frequency (fCLK): 166 MHz

High maximum clock frequency of 166 MHz enables fast data processing and high-performance operation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Memory IC Type: OTHER FIFO

Being a FIFO (First In, First Out) memory IC type ensures efficient data storage and retrieval, particularly useful for buffering and data processing applications.

Technical Specifications

FIFO SN74V283-10PZA attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

6.5 ns

Additional Features:

CAN ALSO BE CONFIGURED AS 65536 X 9

Alternate Memory Width:

9

Maximum Clock Frequency (fCLK):

166 MHz

Cycle Time:

10 ns

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

14 mm

Memory Density:

589824 bit

Memory IC Type:

Memory Width:

18

Moisture Sensitivity Level (MSL):

4

No. of Functions:

1

No. of Terminals:

80

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

32KX18

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.015 Amp

Sub-Category:

FIFOs

Maximum Supply Current:

35 mA

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

SN74V283-10PZA Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.B

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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