Loading...

SN74V273-15GGM

Texas Instruments

SN74V273-15GGM by Texas Instruments

SN74V273-15GGM by Texas Instruments is a FIFO memory with 16Kx18 organization, 15ns cycle time, and 66.7MHz clock frequency. It operates synchronously at 3.3V and is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,100

-

-

-

-

Digiode

USA . 1,121 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,121

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 246 parts In-Stock

1+ parts

$4.736

100+ parts

-

1k+ parts

$5.234

10k+ parts

-

246

$4.736

-

$5.234

-

DigiPath Technology Company

USA . 1,520 parts In-Stock

1+ parts

$5.215

100+ parts

$4.797

1k+ parts

-

10k+ parts

-

1,520

$5.215

$4.797

-

-

AZTECH Wire

Italy . 690 parts In-Stock

1+ parts

$5.266

100+ parts

-

1k+ parts

-

10k+ parts

-

690

$5.266

-

-

-

IDEA Electronic Components Group

UK . 1,703 parts In-Stock

1+ parts

$5.321

100+ parts

-

1k+ parts

$4.789

10k+ parts

-

1,703

$5.321

-

$4.789

-

ChromeModa Solutions

Germany . 687 parts In-Stock

1+ parts

$5.321

100+ parts

$4.363

1k+ parts

-

10k+ parts

-

687

$5.321

$4.363

-

-

One Stop Electronics

USA . 829 parts In-Stock

1+ parts

$22.000

100+ parts

-

1k+ parts

-

10k+ parts

-

829

$22.000

-

-

-

Ampacity Inc.

Singapore . 1,206 parts In-Stock

1+ parts

$29.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,206

$29.000

-

-

-

Corphita

USA . 1,448 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,448

-

-

-

-

Microchip USA

USA . 208 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

208

-

-

-

-

Overview

Experience seamless data storage and retrieval with the SN74V273-15GGM FIFO by Texas Instruments. Known for its exceptional quality and reliability, Texas Instruments offers a wide range of applications in the technology industry. This FIFO device ensures fast and efficient data processing, making it ideal for various electronic devices. With a cycle time of 15 ns and a maximum clock frequency of 66.7 MHz, this product delivers high performance while maintaining a low profile and fine pitch package style. Trust Texas Instruments to provide cutting-edge solutions that meet your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and cost-effectiveness, making the product suitable for a wide range of applications.

Cycle Time: 15 ns

The fast cycle time ensures efficient operation and quick data access, making this FIFO a reliable choice for high-speed applications.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a standard supply voltage of 3.3V allows compatibility with common electronic systems and reduces the need for additional components.

Maximum Clock Frequency (fCLK): 66.7 MHz

The high clock frequency supports rapid data transfer rates, making this FIFO ideal for applications that require real-time processing.

Technology: CMOS

Being based on CMOS technology ensures low power consumption and high noise immunity, enhancing the overall performance and reliability of the product.

Technical Specifications

FIFO SN74V273-15GGM attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

10 ns

Additional Features:

CAN ALSO BE CONFIGURED AS 32768 X 9

Alternate Memory Width:

9

Maximum Clock Frequency (fCLK):

66.7 MHz

Cycle Time:

15 ns

JESD-30 Code:

S-PBGA-B100

Length:

10 mm

Memory Density:

294912 bit

Memory IC Type:

Memory Width:

18

No. of Functions:

1

No. of Terminals:

100

No. of Words:

16384 words

No. of Words Code:

16K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

16KX18

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Maximum Standby Current:

.015 Amp

Sub-Category:

FIFOs

Maximum Supply Current:

35 mA

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Trade Compliance

SN74V273-15GGM Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20